• 조명전기설비학회논문지
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• 제24권4호
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• pp.1-9
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• 2010

LED구동회로및 제어회로를 개발하였다. 개발된 LED구동회로는 새로운 PWM회로를 가지고 있으며 LED열의 디밍, 전류 및 온도제어 및 통신 기능을 할 수 있다. 개발된 PWM회로는 기본적인 디지털 논리소자를 사용하여 만들어 질 수 있는 두 개의 링 발진기와 한 개의 카운터로 구성되어 있다. 부가적으로 이 회로는 온-오프 제어 모드, 비상모드, 전력절감모드를 가지고 있으며 직열통신을 이용해서 제어된다. 설계 된 PWM 발생기와 제어회로는 마그나칩/하이닉스의 디지털 공정을 이용하여 제작되었다. 제작된 칩은 LED구동장치와 제어기 보드에 장착되어 테스트 되었으며 성공적으로 동작하였다.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• 대한안전경영과학회지
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• 제20권3호
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• pp.21-26
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• 2018

This paper describes result of a study on safety against a fire of charging cable for mobile phone for vehicle. Combustion on the USB cable in the car was happened while driving. Gas coming from the burning USB cable could be a reason which can make a secondary car accident since the driver also can be embarrassed while driving. In order to prevent a secondary car accident connected on the road, to research a reason why USB cable can emit gas and be burned in charging. We did simulation test with abnormal fault condition for the electronic component on the board in the USB cable. So we get the result from abnormal fault condition simulation test, for instance, shorted test for output terminal of 8 pin switch, shorted test for chip resistor after thermal aging in the condition $25^{\circ}C$, 93 % RH during 48 hours. To analysis the result of all test, Combustion on the USB cable was not the 8 pin but other electrical component such as a chip resistor. Therefore we guess that the reason for USB cable combustion in charging in a car was not 8 pin and a LED but another defective component.

• 조명전기설비학회논문지
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• 제28권7호
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• 한국전기전자재료학회논문지
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• 제31권6호
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• pp.433-436
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• 2018

A total internal reflection (TIR) linear lens of size $190(W){\times}5(D){\times}2.1(H)mm^3$ has a directivity of $25^{\circ}$ and was made of a polydimethysiloxane (PDMS) silicone resin with a refractive index of 1.4 and a transmittance of 93% at 365 nm UV wavelength. A light source with a size of $190{\times}25.5mm^2$ was fabricated by installing a TIR linear lens on a chip on board (COB) type LED module mounted with a $1.1{\times}1.1mm^2$ size UV LED. The optical characteristics of the light source showed a maximum irradiation density of $3,840mW/cm^2$ at a working distance of 5 mm and a high uniformity of 91.6% over a $150{\times}25mm^2$ irradiation area. The thermal characteristics of the light source were measured at a supply current of 500 mA. The saturation temperature was reached after 30 min of operation, and measured to be $95^{\circ}C$.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.106-111
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• 2020

In this paper, we propose the non-contact gesture recognition system and algorithm using proximity-based sensors. The system uses four IR receiving photodiode embedded on a single chip and an IR LED for small area. The goal of this paper is to use the proposed algorithm to solve the problem associated with bringing the four IR receivers close to each other and to implement a gesture sensor capable of recognizing eight directional gestures from a distance of 10cm and above. The proposed system was implemented on a FPGA board using Verilog HDL with Android host board. As a result of the implementation, a 2-D swipe gesture of fingers and palms of 3cm and 15cm width was recognized, and a recognition rate of more than 97% was achieved under various conditions. The proposed system is a low-power and non-contact HMI system that recognizes a simple but accurate motion. It can be used as an auxiliary interface to use simple functions such as calls, music, and games for portable devices using batteries.

• 한국생산제조학회지
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• 제26권1호
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• pp.66-73
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• 2017

This study attempted to design lights with Type II distribution suitable for LED street lights based on the regulations of street light distribution developed by the Illuminating Engineering Society of North America (IESNA). The shape of an asymmetric lens, different from that of a rotationally symmetric lens, cannot be generated using a simple mathematical formula. In the first trial, the outline of the lens was fixed and simulated to confirm the distribution type. Following ISENA regulations, some problems that occurred during simulations and repeating was be modified that process is how we detected errors. Through optical research and simulations, a lens conforming to the regulations of Type II very short, Type II short, and Type II medium distributions was developed. A prototype was developed using simulation data and it was subjected to distribution tests. The results show that it can compare with property of Type II distribution.

• 한국인터넷방송통신학회논문지
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• 제15권2호
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• pp.189-194
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• 2015

본 논문에서는 열전소자의 구조에 따른 COB LED의 방열성능을 비교 분석하였다. COB LED의 발열부분과 접합하는 열전소자는 구리박판 구조와 세라믹 구조의 열전소자를 사용하였다. COB LED와 열전소자의 접합부분은 접촉식 온도계를 통해 온도 분포를 측정하였고, 각각의 열전소자는 0.1A, 0.3A, 0.5A, 0.7A의 전류를 입력시켜서 온도 변화를 측정하였다. COB LED의 열 응집현상이 나타나는 접합부분의 온도는 0.7A를 인가하였을 때 구리박판 구조의 열전소자에서 $59^{\circ}C$로 측정되었고, 세라믹 구조의 열전소자는 $67^{\circ}C$로 나타났으며, 구리박판 열전소자가 세라믹 구조의 열전소자 보다 $9^{\circ}C$가 낮게 측정됨으로써 방열성능이 더 우수함을 보였다.

• 한국정보전자통신기술학회논문지
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• 제7권1호
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• pp.20-25
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• 2014

차세대 친환경 조명인 LED소자는 온도가 올라갈수록 LED의 발광효율이 떨어지고 $80^{\circ}C$이상 올라갈수록 수명이 감소하고 스펙트럼선의 파장이 본래의 파장보다 장파장 쪽으로 이동하는 Red Shift현상 및 $T_j$ 상승에 따라 광 출력이 감소되는 큰 문제점이 대두되고 있어 열을 최소화 할 수 있는 방열설계 연구가 진행 중이다. COB Type LED의 경우 보드에 LED 칩을 직접 결합시켜 열 저항을 낮췄지만 주거용 13.5W의 경우 방열판을 통해 발열 문제를 해결해야한다. 본 논문에서는 주거용 13.5W COB LED 다운라이트에 맞게 Heat Sink를 설계하고, 그 설계한 Heat Sink와 13.5W COB를 패키징하여 Solidworks flow simulation을 통해 최적의 Fin두께를 선정하여 접촉식 온도계를 사용한 열적 특성을 분석 하고 평가 하였다.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.