• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.11
• /
• pp.16-22
• /
• 2003

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.6 no.3
• /
• pp.24-30
• /
• 2007

The FPCs(Flexible Printed Circuit) are currently used in several electronic products like digital cameras, cellular phones because of flexible material characteristics. Because the FPC is usually small size and flexible, only one FPC should not enter chip mounting process, instead, several FPCs are placed on the large rigid pallette and enter into the chip mounting process. Currently the job of mounting FPC on the pallette is carried by totally manual way. Thus, the goals of the research is develop the automatic machine of FPC mounting on pallette using vision alignment. Instead of using two cameras or using moving one camera, the proposed vision system with only one fixed camera is adopted. Moreover, the two picker heads which can handle two FPCs simultaneously are used to make process time shortened. The procedure of operation is firstly to measure alignment error of FPC, correct alignment errors, and finally mount well-aligned FPC on the pallette. The vision technology is used to measure alignment error accurately, and precision motion control is used in correcting errors and mounting FPC.

• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.218-221
• /
• 2007

The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of $80{mu}m$ with circle hole shape and 90% square hole shape. In case of chip mounting process, chip mis-alignment and bridge was occurred rarely in same conditions. In more thin stencil thickness, $50{mu}m$, strength of 1005 chip parts was poor, because of amount of printed solder was insufficient.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.390-393
• /
• 2005

he FPCs(Flexible Printed Circuit) are currently used in several electronic products like digital cameras, cellular phones because of flexible material characteristics. Because the FPC is usually small size and flexible, only one FPC should not enter chip mounting process, instead, several FPCs is placed on the large rigid pallette and go to the chip mounting process. Currently the job of mounting FPC on the pallette is carried by totally manual way. Thus, the goals of the research is develop the automatic machine of FPC mounting on pallette using vision alignment. The procedure of operating machine is firstly to measure alignment error of FPC, correct alignment errors, and finally mount well-aligned FPC on the pallette. The vision technology is used to measure alignment error accurately, and precision motion control is used in correcting errors nd mounting FPC. The two picker heads handling two FPC together is used to increase the productivity.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.12 no.9
• /
• pp.4138-4146
• /
• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.10a
• /
• pp.105-129
• /
• 2000

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.3
• /
• pp.2146-2150
• /
• 2015

The surface mount technology is used, as mounting relay using Chip Mounter that is inserted into the junction box, etc. car and small components such as 0402 and 0603 Chip. In this study we developed stick tube for supplying the relay that cause problems as components is heavy and suggested the technology using fiber sensors to eliminate missing insertions or improper insertions because of small components. And we show to result of the experiment how to increased the productivity.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.165-172
• /
• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.1
• /
• pp.43-50
• /
• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Journal of Platform Technology
• /
• v.8 no.1
• /
• pp.24-32
• /
• 2020

This paper designed and manufactured a chip mounter based on 3D printer technology that can be used for educational research or sample production to disseminate chip mounter, a core technology of SMT line. A stepper motor with open loop control is used for low cost drive design. The shortcomings of the motor's vibration and disassembly caused by the use of the step motor were compensated by the Micro-Step control method. In the chip mounter experiment, the gerber file was generated on the small chip mounter, printed at the actual size, and the solder cream was printed on the HASL-treated PCB in the same manner as the sample board fabrication. As a result of the experiment, unlike the 2012 micro components, parts such as SOIC and TQFP that require correction are twice as long as the component mounting time, but it can be confirmed that they are mounted relatively accurately. In addition, as a result of repeatedly measuring the error of the initial position 10 times, it was confirmed that a relatively small error of about 0.110mm occurs.