• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.10
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• pp.1061-1066
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• 2011

In this study, the flow characteristics of an injection nozzle installed in a high-pressure holder for improving productivity were determined. The inlet velocity, nozzle inflow angle, and nozzle outlet diameter were selected as design factors having an influence on the flow characteristics, and numerical analysis was conducted for these factors. As the inlet velocity is high and the nozzle outlet diameter is small, the pressure and velocity of the injected flow are high. In the case of the nozzle inflow angle, the variation of flow characteristics according to angle was slight, but the highest pressure and velocity were found at $15^{\circ}$. In addition, the possibility of chip elimination by the injected flow was analyzed on the basis of the numerical results.

• Journal of the Korea Organic Resources Recycling Association
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• v.7 no.2
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• pp.57-64
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• 1999

The purpose of this study is to establish effective conditions for controlling $CH_4$, $N_2O$ emission from organic Waste / wastewater treatment processes. Continuous and batch experiments were conducted to treat the micro algae from polluted and eutrophicated lakes through the thermophilic oxic process. The microalgae used were mainly Microcystis sp.(collected from eutrophic lake) and Chlorella sp. (cultured in laboratory) Wasted cooking oil was added by aid-heating source. Physico-chemical components of sludges and microalgae were analyzed. In batch experiments, air supply was changed from 50ml/min to 150ml/min. The temperature. water content and drained water were affected by the air flow rate at initial stage. However, there was almost no influence of air flow rate on them in middle and last stages. At air flow rate of 100ml/min, the degradation rate of organic material was higher than that at other air flow rates. $CO_2$ concentration in exhaust was proportional to the strength of aeration, especially at initial stage when degradation was active. $CH_4$ with low concentration was detected only at starting stage when air diffusion was not enough. $N_2O$ production was not affected by variation of air supply. In continuous experiments no matter what the dewatering methods (with PAC and without PAC) and media (wood chip and reed chip) were changed, $N_2O$ was almost not affected by variation of injected air. Result showed that the reed chips using for lake purification could be used as media for thermophilic oxic process in lake and marshes area. $CO_2$ concentration was not so much affected by the change of dewatering methods and media types. $CH_4$ was not detected in the experimental period. So it can be shown that the thermophilic oxic process had been well operated in wide handling conditions regardless of media and dewatering methods.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.2
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• pp.106-114
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• 2010

We proposed an unified design methodology and verification platform for giga-scale System on Chip (SoC). According to the growth of VLSI integration, the existing RTL design methodology has a limitation of a production gap because a design complexity increases. A verification methodology need an evolution to overcome a verification gap. The proposed platform includes a high level synthesis, and we develop a power-aware verification platform for low power design and verification automation using it's results. We developed a verification automation and power-aware verification methodology based on control and data flow graph (CDFG) and an abstract level language and RTL. The verification platform includes self-checking and the coverage driven verification methodology. Especially, the number of the random vector decreases minimum 5.75 times with the constrained random vector algorithm which is developed for the power-aware verification. This platform can verify a low power design with a general logic simulator using a power and power cell modeling method. This unified design and verification platform allow automatically to verify, design and synthesis the giga-scale design from the system level to RTL level in the whole design flow.

• Design & Manufacturing
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• v.15 no.2
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• pp.11-16
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• 2021

Recently, three-dimensional (3D) cell culture systems, which are superior to conventional two-dimensional (2D) vascular systems that mimic the in vivo environment, are being actively studied to reproduce drug responses and cell differentiation in organisms. Conventional two-dimensional cell culture methods (scaffold-based and non-scaffold-based) have a limited cell growth rate because the culture cannot supply the culture medium as consistently as microvessels. To solve this problem, we would like to propose a 3D culture system with an environment similar to living cells by continuously supplying the culture medium to the bottom of the 3D cell support. The 3D culture system is a structure in which microvascular structures are combined under a scaffold (agar, collagen, etc.) where cells can settle and grow. First, we have manufactured molds for the formation of four types of microvessel-mimicking chips: width / height ①100 ㎛ / 100 ㎛, ②100 ㎛ / 50 ㎛, ③ 150 ㎛ / 100 ㎛, and ④ 200 ㎛ / 100 ㎛. By injection molding, four types of microfluidic chips were made with GPPS (general purpose polystyrene), and a 100㎛-thick PDMS (polydimethylsiloxane) film was attached to the top of each microfluidic chip. As a result of observing the flow of the culture medium in the microchannel, it was confirmed that when the aspect ratio (height/width) of the microchannel is 1.5 or more, the fluid flows from the inlet to the outlet without a backflow phenomenon. In addition, the culture efficiency experiments of colorectal cancer cells (SW490) were performed in a 3D culture system in which PDMS films with different pore diameters (1/25/45 ㎛) were combined on a microfluidic chip. As a result, it was found that the cell growth rate increased up to 1.3 times and the cell death rate decreased by 71% as a result of the 3D culture system having a hole membrane with a diameter of 10 ㎛ or more compared to the conventional commercial. Based on the results of this study, it is possible to expand and build various 3D cell culture systems that can maximize cell culture efficiency by cell type by adjusting the shape of the microchannel, the size of the film hole, and the flow rate of the inlet.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.10
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• pp.3334-3343
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• 1996

A quantitative flow visualization technique was developed to measure velocity and temperature fields simultaneously in a two-dimensional cross section of thermo-fluid flows. Thermochromic liquid crystal(TLC) particles are used as temperature sensor and velocity tracers. Illuminating a thermo-fluid flow with a thin sheet of white light, the reflected colors from the TLC particles in the flow were captured simultaneously by two CCD cameras; a 3-chip CCD color camera for temperature field measurement and a black and white CCD camera for velocity field measurement. Variations of temperature field were measured by using a HSI true color image processing system and TLC solution. The relationship between the hue values of TLC color image and real temperature was obtained and this calibration curve was used to measure the true temperature under the same camera and illumination condition. The velocity field was obtained by using a 2-frame PTV technique using the concept of match-probability to track true velocity vectors from two consecutive image frames. These two techniques were applied at the same time to the unsteady thermal-fluid flow in a Hele-Shaw cell to measure the temperature and velocity field simultaneously and some results are discussed.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.2
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• pp.214-221
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• 2012

Recently, the biochip which is a prime representation of NT, IT, BT, as an example of convergence technology, has been frequently mentioned. With the recent rapid advance in biotechnology, these compact devices, such as lab-on-a-chip or u-TAS, have been developed, and more research is needed. These compact devices typically use the micro-channel in order to shed or detach and mix a variety of materials. Specially, in micro-fluidic systems, a mixer is necessary to produce a mixture because only laminar flow occurs at a low-Reynolds number. To solve this problem, HVM a micromixer that induces a horizontal and vertical multi-mixing flow motion, is proposed. The mixing performance was analyzed and verified by optimizing the shape through the CFD analysis and evaluating the structural analysis and the soundness with material properties that are obtained through the basic experiment.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.3
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• pp.609-613
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• 2010

In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in $1\;[m^3]$ box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of $47.37\;[^{\circ}C]$ and thermal resistance of $0.48407\;[W/^{\circ}C]$. In thermal flow simulation, the temperature of heatsink decreased from $51.54\;[^{\circ}C]$ to $51.51\;[^{\circ}C]$ and the temperature of heatsink by the time in real measurement decreased from $47.03\;[^{\circ}C]$ to $46.87\;[^{\circ}C]$. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux.

• 한국전산유체공학회:학술대회논문집
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• 2003.10a
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• pp.113-115
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• 2003

Droplet impinging into a cavity at micro-scale is one of important fluidic issues for microfabrications, e.g. bio-chip applications and inkjet deposition processes in the PLED panel manufacturing. The droplets generally dispensing from an inkjet head, which contains an array of nozzles, have a volume in several picoliters, while each nozzle jets the droplets into cavities with micron-meter size located on substrates. Due to measurement difficulties at micro-scale, the numerical simulation could serve as an efficient and preliminary way to evaluate the micro-sized droplet impinging behavior into a cavity. The micro-fluidic flow is computed by solving the three-dimensional Navier-Stokes equations through a finite volume discretization. The droplet front is predicted by a volume-of-fluid approach, in which the surface tension is modeled as a function of the fluid concentration. This paper discusses the influence of fluid properties, such as surface tension and fluid viscosity, on micro-fluidic characteristics at different jetting speeds in the deposition process via the proposed numerical approach.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.124-130
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• 2001

The heat transfer and flow measurements were made on a cylindrical pedestal mounted on a flat plate with a turbulent impinging air jet. The heat transfer coefficient distributions on the flat plate were measured using the shroud-transient technique and liquid crystal was used to measure the surface temperature. The jet Reynolds number (Re) is 23,000, the dimensionless nozzle-to-surface distance (L/d) from 2 to 10, the dimensionless pedestal diameter-to-height (H/D) from 0 to 1.5, the dimensionless 2nd pedestal diameter-to-height ($H/D_2$) from 0 to 0.4 and the distance from the stagnation point to 2nd pedestal (p/D). The results show that for H/D = 0.5 to 1.5, the Nusselt number distributions on the plate surface exhibit a maximum between $r/d\;{\cong}\;1.0$ and 1.5. The presence of the pedestal appears to cause the flow separation and reattachment on the plate surface, which results in the maximum heal transfer coefficient. Also, for p/D = 2.5 and $H/D_2$ = 0.3, the local Nusselt number in the region corresponding to $r/d\;{\cong}\;1.1$ was increased up to 50% compared to that for $H/D_2=0$.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.