• Design & Manufacturing
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• v.6 no.1
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.8
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• pp.1100-1106
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• 2010

LED(Light Emitting Diode) has the defects of low efficiency and reducement of life cycle as its temperature increases. This research is about an efficient temperature control of the LED. For LED temperature control, it is shown that a heat sink, fan, a one-chip microprocessor and the PID control algorithm are a good cooling system through experiments. Finally. by using the fan as a cooling device and controlling it appropriately, it is proved that the intensity of illumination and the desired temperature can be achieved with consumption of only 2% of the driving power of the LED system through control experiments.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.73-78
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• 2016

An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Vacuum Magazine
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• v.4 no.3
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• pp.16-20
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• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

• Publications of The Korean Astronomical Society
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• v.18 no.1
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• pp.69-74
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• 2003

A CCD camera for the BOES (Bohyunsan Observatory Echelle Spectrograph) has been developed. The camera consists of a 2048 ${\times}$ 4096 format CCD, a SDSU Gen-I CCD controller, and a continuous flow cryostat (CFC) designed by the ESO. In order to control the CCD under SDSU Gen-I controller, the voltage level of all the biases and clocks were lowered by -6V. The CFC showed cooling time of about 10 hour, after which the chip temperature settled down with variation less than ${\pm}1^{\circ}C$. The final chip temperature is around -105$^{\circ}C$ with the setting value for the CFC as -170$^{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.6
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• pp.1068-1073
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• 1987

Traditional circuit partitioning algorithm using the cluster development method, which is suitable for such applications as single chip floor planning or multiple layer PCB system placement, where the clusters are formed so that inter-cluster nets are localized within the I/O connector pins, may not be appropriate for the functiona block placement in truly 3-D electronic modules. 3-D hybrid IC is one such example where the inter-layer routing as well as the intra-layer routing can be maximally incorporated to reduce the overall circuit size, cooling requirements and to improve the speed performance. In this paper, we propose a new algorithm called MBE(Minimum Box Embedding) for the layer assignment of each functional block in 3-D hybrid IC design. The sequence of MBE is as follows` i) force-directed relaxation in 3-D space, ii) exhaustive search for the optimal orientation of the slicing plane and iii) layer assignment. The algorithm is first explaines for a 2-D reduced problem, and then extended for 3-D applications. An example result for a circuit consisting of 80 blocks has been shown.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.443-444
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• 2006

The influence of the heat sources on LED junction temperature are Engine room air, Back plate, Electric power device, and so on. LED lamp cooling system is considered to be an important subject fur high light efficiency. Because LED Chip will be problem When LED junction temperature be over $135^{\circ}C$, In this Study, The Looped Heat Pipe System is considered to prevent LED Chip fall. The LHPS is consist of evaporator part, condenser part, heat pipe part. The working fluid of LHPS is HCFC-123. In this study, to prevent LED Chipfall, we study thermal characteristics for Looped Heat Pipe System with LED lamp.

• Journal of Chest Surgery
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• v.21 no.2
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• pp.231-239
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• 1988

Currently numerous methods are in use for myocardial hypothermia as a myocardial preservation modality for cardiac operation. During cardiac ischemia after crystalloid cardioplegia[4C GIK solution], topical cold saline[Group I, a=9], topical ice slush[Group II, n=9] and topical ice chip[Group III, a=10] have been compared for myocardial surface cooling in the isolated rat heart model of cardiopulmonary bypass. During postischemic period, hemodynamic functions[aortic flow, coronary flow, peak aortic pressure and heart rate], biochemical enzymatic activities and cellular injuries with electron microscope were evaluated in this isolated rat heart perfusion model. Postischemic aortic flow, cardiac output and peak aortic pressure in Group I and Group II recovered better than Group III.[p< 0.05] Postischemic creatine kinase and lactate dehydrogenase leakages in Group II and Group III increased more than Group l and postischemic mitochondrial swelling in Group III was more severe than Group I, and Group II.[p< 0.05] These results suggest that topical cold saline was the better method than topical ice slush or topical ice chip as a myocardial preservation modality in the isolated rat heart model of cardiopulmonary bypass.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.179-186
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• 2009

Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.