• ETRI Journal
• /
• v.38 no.4
• /
• pp.665-674
• /
• 2016

We designed and fabricated a semiconductor optical amplifier-integrated dual-mode laser (SOA-DML) as a compact and widely tunable continuous-wave terahertz (CW THz) beat source, and a pin-photodiode (pin-PD) integrated with a log-periodic planar antenna as a CW THz emitter. The SOA-DML chip consists of two distributed feedback lasers, a phase section for a tunable beat source, an amplifier, and a tapered spot-size converter for high output power and fiber-coupling efficiency. The SOA-DML module exhibits an output power of more than 15 dBm and clear four-wave mixing throughout the entire tuning range. Using integrated micro-heaters, we were able to tune the optical beat frequency from 380 GHz to 1,120 GHz. In addition, the effect of benzocyclobutene polymer in the antenna design of a pin-PD was considered. Furthermore, a dual active photodiode (PD) for high output power was designed, resulting in a 1.7-fold increase in efficiency compared with a single active PD at 220 GHz. Finally, herein we successfully show the feasibility of the CW THz system by demonstrating THz frequency-domain spectroscopy of an ${\alpha}$-lactose pellet using the modularized SOA-DML and a PD emitter.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.29 no.11
• /
• pp.857-867
• /
• 2018

Active array radar is evolving into digital active array radar. Digital active array radar has many advantages for making several simultaneous radar beams from the digital receive data of each element. A digital-type transceiver(TR) module is suitable for this goal in radar. In this work, the design results of an L-band digital TR module are presented to verify the possibility of fabrication for a digital active array antenna. This L-band digital TR module consists of a gallium-nitride-type HPA to achieve a more than 350-W peak output power and one-chip transceivers that include a digital waveform generator and analog digital converter. The receiving gain was 47 dB, the noise figure was less than 2 dB, and the final output type of the four channel receiving paths was one optic signal.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.36 no.5
• /
• pp.423-432
• /
• 2023

With the increasing demand for mobile devices featuring multi-touch operation, extensive research is being conducted on touch screen panel (TSP) Readout ICs (ROICs) that should possess low power consumption, compact chip size, and immunity to external noise. Therefore, this paper discusses capacitive touch sensors and their readout circuits, and it introduces research trends in various circuit designs that are robust against external noise sources. The recent state-of-the-art TSP ROICs have primarily focused on minimizing the impact of parasitic capacitance (Cp) caused by thin panel thickness. The large Cp can be effectively compensated using an area-efficient current compensator and Current Conveyor (CC), while a display noise reduction scheme utilizing a noise-antenna (NA) electrode significantly improves the signal-to-noise ratio (SNR). Based on these achievements, it is expected that future TSP ROICs will be capable of stable operation with thinner and flexible Touch Screen Panels (TSPs).

• ETRI Journal
• /
• v.36 no.3
• /
• pp.352-360
• /
• 2014

This paper presents a 900 MHz zero-IF RF transceiver for IEEE 802.15.4g Smart Utility Networks OFDM systems. The proposed RF transceiver comprises an RF front end, a Tx baseband analog circuit, an Rx baseband analog circuit, and a ${\Delta}{\Sigma}$ fractional-N frequency synthesizer. In the RF front end, re-use of a matching network reduces the chip size of the RF transceiver. Since a T/Rx switch is implemented only at the input of the low noise amplifier, the driver amplifier can deliver its output power to an antenna without any signal loss; thus, leading to a low dc power consumption. The proposed current-driven passive mixer in Rx and voltage-mode passive mixer in Tx can mitigate the IQ crosstalk problem, while maintaining 50% duty-cycle in local oscillator clocks. The overall Rx-baseband circuits can provide a voltage gain of 70 dB with a 1 dB gain control step. The proposed RF transceiver is implemented in a $0.18{\mu}$ CMOS technology and consumes 37 mA in Tx mode and 38 mA in Rx mode from a 1.8 V supply voltage. The fabricated chip shows a Tx average power of -2 dBm, a sensitivity level of -103 dBm at 100 Kbps with PER < 1%, an Rx input $P_{1dB}$ of -11 dBm, and an Rx input IP3 of -2.3 dBm.

• Korean Journal of Optics and Photonics
• /
• v.17 no.3
• /
• pp.290-295
• /
• 2006

The coupling between copper wire and a THz electromagnetic wave is one of the important factors to build up the magnitude and spectrum of a THz wave. We measured a I THz spectrum range THz pulse into a $480{\mu}m$ diameter and 23cm long copper wire waveguide. We measured THz pulses up to $275{\mu}m$ air gap between the end of the copper wire and transmitter or receiver chips. The coupling sensitivity of the transmitter is 3 times bigger than that of the receiver. The THz pulses propagated to air by the end of the receiver-side copper wire tip acting as a transmitter antenna. We confirmed that the THz field concentrates near the copper wire surface by opening the pin hole to the copper wire waveguide.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.30 no.4
• /
• pp.314-319
• /
• 2019

In this study, we propose a W-band frequency modulated continuous wave(FMCW) radar altimeter that can measure the altitude based on the frequency differences of transmitted and received signals. This W-band FMCW system is powered by an altitude control algorithm, which we propose to help prevent collisions of drones with obstacles in real deployment by measuring the relative altitude. It is shown that this algorithm enables the drone to be positioned within a 3 % error of altitude from the desired input height. The chip used in the W-band transmitter and receiver was fabricated using a 65-nm CMOS process, and a horn antenna was directly fed by incorporating an embedded waveguide feeder into the chip. The clutter spectra observed in terrains including soil, grass, and calm lake water were measured and compared, confirming the reflectivity characteristics of various surfaces of different water contents.

• ETRI Journal
• /
• v.25 no.2
• /
• pp.65-72
• /
• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• Proceedings of the Korean Institute of Intelligent Systems Conference
• /
• 2003.09a
• /
• pp.244-247
• /
• 2003

All over the value chain, a logistics information system must satisfy several requirements about gathering and sharing related information. For example, distributors or forwarders need up-to-date information for scheduling and managing their logistics resources. Meanwhile, consignors or consignees want to know the dynamic information about current states or location of their goods. Such information is dependent upon the quality of data sets collected throughout the logistics processes. Thus, gathering accurate data promptly is the essential factor for the success of a logistics information system. However, there are limits in reducing both time-gap and man-power for datn sourcing, since this process is done manually or by using bar codes and scanning devices. Smart-tag can be the alternative to such n time-consuming and inefficient operation, especially for handling piles of goods. The tag includes a micro-chip containing data which is remotely readable by readers with antenna. Logistics system with Smart tag can provide all the information anywhere and anytime, and it will increase the efficiency of logistics and satisfaction of users. In this paper, we propose a conceptual architecture for smart-tag based logistics system and describe its functions.

• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.48 no.1
• /
• pp.97-101
• /
• 2011

Quad band p-HEMT SP6T switch for handset applications was developed. To achieve the low insertion loss and high isolation, trade-off between "On" state and "Off" state was considered by optimization of unit cell. Especially, in case isolation between transmit port and receive port, it was achieved by large capacitors and miniaturization of chip size was achieved by common voltage control and ground using back via process. Designed SP6T switch has size of $950um{\times}100um$ and take into consideration the gate recess error, excellent loss and isolation was confirmed in operating frequency.

• Proceedings of the KSR Conference
• /
• 2008.06a
• /
• pp.535-544
• /
• 2008

Unlike MS(Magnetic Stripe), SMART CARD is equipped with COS(Chip Operating System) consisting of the Microprocessor and Memory where information can be stored and processed, and there are two types of cards according to the contact mode; the contact type that passes through a gold plated area and the contactless one that goes through the radio-frequency using an antenna embedded in the plastic card. the contactless IC card used for the transportation card was first introduced into local area buses in Seoul, and expanded throughout the country so that it has removed the inconvenience such as possession of cash, fare payment and collection. Focusing on the Seoul metropolitan area in 2004, prepaid and pay later cards were adopted and have been used interchangeably between a bus and subway. The card terminal compatible between a bus and subway is Proximity Integrated Circuit Card(PICC) as international standards(1443 Type A,B), communicates in the 13.56MHz dynamic frequency modulation-demodulation system, and adopts the Multi Secure Application Module(SAM). In the second half of 2009, the system avaliable nationwide will be built when the payment SAM standard is implemented.