• ETRI Journal
• /
• 제38권4호
• /
• pp.665-674
• /
• 2016

We designed and fabricated a semiconductor optical amplifier-integrated dual-mode laser (SOA-DML) as a compact and widely tunable continuous-wave terahertz (CW THz) beat source, and a pin-photodiode (pin-PD) integrated with a log-periodic planar antenna as a CW THz emitter. The SOA-DML chip consists of two distributed feedback lasers, a phase section for a tunable beat source, an amplifier, and a tapered spot-size converter for high output power and fiber-coupling efficiency. The SOA-DML module exhibits an output power of more than 15 dBm and clear four-wave mixing throughout the entire tuning range. Using integrated micro-heaters, we were able to tune the optical beat frequency from 380 GHz to 1,120 GHz. In addition, the effect of benzocyclobutene polymer in the antenna design of a pin-PD was considered. Furthermore, a dual active photodiode (PD) for high output power was designed, resulting in a 1.7-fold increase in efficiency compared with a single active PD at 220 GHz. Finally, herein we successfully show the feasibility of the CW THz system by demonstrating THz frequency-domain spectroscopy of an ${\alpha}$-lactose pellet using the modularized SOA-DML and a PD emitter.

• 한국전자파학회논문지
• /
• 제29권11호
• /
• pp.857-867
• /
• 2018

현재 레이다의 발전 형태는 기존의 능동위상배열에서 디지털형 위상배열로 진화하고 있다. 디지털형 위상배열은 수신빔을 자유롭게 구성할 수 있는 장점이 있다. 이를 가능하게 하려면 각각의 복사소자별 수신신호가 디지털화되어야 한다. 본 논문에서는 이를 위한 디지털 송수신모듈을 설계 및 제작하고 시험결과를 제시하여 가능성을 확인하고자 한다. 디지털 송수신모듈은 4개의 송수신 채널을 포함한 쿼드팩 형태로 구성하였다. 고출력 송신을 위해 각 채널별로 GaN 소재의 고출력증폭소자(HPA)를 사용하였으며, 송신파형 발생과 수신신호 디지털변환을 위해 송수신 집적소자를 적용한 디지털 회로를 적용하였다. 제작한 결과, 각 채널별로 송신출력은 350 W 이상, 수신이득은 47 dB, 수신잡음지수 2 dB 이하를 만족하였다. 또한 모듈 내에서 최종 광신호로 변환된 수신출력을 저장하고, 분석하여 수신 특성을 확인하였다.

• 한국전기전자재료학회논문지
• /
• 제36권5호
• /
• pp.423-432
• /
• 2023

With the increasing demand for mobile devices featuring multi-touch operation, extensive research is being conducted on touch screen panel (TSP) Readout ICs (ROICs) that should possess low power consumption, compact chip size, and immunity to external noise. Therefore, this paper discusses capacitive touch sensors and their readout circuits, and it introduces research trends in various circuit designs that are robust against external noise sources. The recent state-of-the-art TSP ROICs have primarily focused on minimizing the impact of parasitic capacitance (Cp) caused by thin panel thickness. The large Cp can be effectively compensated using an area-efficient current compensator and Current Conveyor (CC), while a display noise reduction scheme utilizing a noise-antenna (NA) electrode significantly improves the signal-to-noise ratio (SNR). Based on these achievements, it is expected that future TSP ROICs will be capable of stable operation with thinner and flexible Touch Screen Panels (TSPs).

• ETRI Journal
• /
• 제36권3호
• /
• pp.352-360
• /
• 2014

This paper presents a 900 MHz zero-IF RF transceiver for IEEE 802.15.4g Smart Utility Networks OFDM systems. The proposed RF transceiver comprises an RF front end, a Tx baseband analog circuit, an Rx baseband analog circuit, and a ${\Delta}{\Sigma}$ fractional-N frequency synthesizer. In the RF front end, re-use of a matching network reduces the chip size of the RF transceiver. Since a T/Rx switch is implemented only at the input of the low noise amplifier, the driver amplifier can deliver its output power to an antenna without any signal loss; thus, leading to a low dc power consumption. The proposed current-driven passive mixer in Rx and voltage-mode passive mixer in Tx can mitigate the IQ crosstalk problem, while maintaining 50% duty-cycle in local oscillator clocks. The overall Rx-baseband circuits can provide a voltage gain of 70 dB with a 1 dB gain control step. The proposed RF transceiver is implemented in a $0.18{\mu}$ CMOS technology and consumes 37 mA in Tx mode and 38 mA in Rx mode from a 1.8 V supply voltage. The fabricated chip shows a Tx average power of -2 dBm, a sensitivity level of -103 dBm at 100 Kbps with PER < 1%, an Rx input $P_{1dB}$ of -11 dBm, and an Rx input IP3 of -2.3 dBm.

• 한국광학회지
• /
• 제17권3호
• /
• pp.290-295
• /
• 2006

전기전도도가 높은 구리선 도파로에 THz 전자기파의 결합은 THz 유선방식의 전파에 있어 테라파의 크기 및 주파수 특성을 결정짓는 중요한 요인 중의 하나이다. 본 연구에서는 직경 $480{\mu}m$, 길이 23 cm의 구리선 도파로에 테라파를 전파시켜 1 THz 주파수 범위를 가진 THz 펄스를 측정하였다. 도파로와 transmitter chip 또는 receiver chip 사이의 공극 간격을 최대 $275{\mu}m$까지 확대하여 송신부와 수신부의 결합 특성을 접촉상태와 비교 분석하였다. 실험결과 송신부의 결합민감도가 수신부보다 약 3배 이상 높게 나타났으며 수신부에서 도파로와 receiver사이의 공극을 통하여 테라파가 공기 중으로 전파됨을 알 수 있었다. 또한 구리선 도파로에 pin hole를 위치시켜 pin hole의 직경에 따른 테라파의 변화를 연구하였으며 대부분의 THz field는 구리선 표면에 분포됨을 확인할 수 있었다.

• 한국전자파학회논문지
• /
• 제30권4호
• /
• pp.314-319
• /
• 2019

본 논문에서는 정확한 고도를 측정하기 위해 송 수신 주파수 차를 이용해 고도를 탐지할 수 있는 W-대역 FMCW(Frequency Modulated Continuous Wave) 레이다 고도계 시스템을 설계 제작하고, 상대 고도를 탐지하여 장애물과 충돌을 방지할 수 있는 고도제어 알고리즘을 제안한다. 이 알고리즘을 탑재한 레이다 고도계를 드론에 장착하여 비행시킨 결과, 입력 고도 대비 최대 약 3 % 오차의 실제 고도 제어를 실험적으로 보였다. W-대역 송 수신기에 사용한 칩은 65 nm CMOS 공정을 이용해 제작하였으며, 칩 상에 도파관 급전기를 내장하여 혼 안테나를 직접 구동하였다. 이 레이다 고도계를 이용하여 흙, 잔디, 그리고 호수 상공에서의 하방 클러터 전력분포를 실측하고, 수분 함량에 따른 표면 측정 특성을 확인하였다.

• ETRI Journal
• /
• 제25권2호
• /
• pp.65-72
• /
• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• 한국지능시스템학회:학술대회논문집
• /
• 한국퍼지및지능시스템학회 2003년도 ISIS 2003
• /
• pp.244-247
• /
• 2003

All over the value chain, a logistics information system must satisfy several requirements about gathering and sharing related information. For example, distributors or forwarders need up-to-date information for scheduling and managing their logistics resources. Meanwhile, consignors or consignees want to know the dynamic information about current states or location of their goods. Such information is dependent upon the quality of data sets collected throughout the logistics processes. Thus, gathering accurate data promptly is the essential factor for the success of a logistics information system. However, there are limits in reducing both time-gap and man-power for datn sourcing, since this process is done manually or by using bar codes and scanning devices. Smart-tag can be the alternative to such n time-consuming and inefficient operation, especially for handling piles of goods. The tag includes a micro-chip containing data which is remotely readable by readers with antenna. Logistics system with Smart tag can provide all the information anywhere and anytime, and it will increase the efficiency of logistics and satisfaction of users. In this paper, we propose a conceptual architecture for smart-tag based logistics system and describe its functions.

• 대한전자공학회논문지TC
• /
• 제48권1호
• /
• pp.97-101
• /
• 2011

개인 휴대통신의 서비스 대역에 대응하는 4중 대역 p-HEMT SP6T 스위치를 구현하였다. 낮은 삽입손실과 높은 격리특성을 달성하기 위하여, 트랜지스터 단위소자의 최적화를 통해 On-Off간 상호 보완적 관계를 고려하였으며, 특히 송수선간 격리 특성의 경우, 큰 커패시터 삽입을 통하여 우수한 격리 특성을 달성하는 동시에 단일의 전압제어와 백비아를 사용한 접지를 통해 소형화를 달성하였다. 구현된 SP6T 스위치는 $950um{\times}100um$의 크기를 가지며 공정상 게이트 우물의 오류를 감안할 때, 각 주파수 대역에서 우수한 삽입손실 및 격리특성을 확인 할 수 있었다.

• 한국철도학회:학술대회논문집
• /
• 한국철도학회 2008년도 춘계학술대회 논문집
• /
• pp.535-544
• /
• 2008

Unlike MS(Magnetic Stripe), SMART CARD is equipped with COS(Chip Operating System) consisting of the Microprocessor and Memory where information can be stored and processed, and there are two types of cards according to the contact mode; the contact type that passes through a gold plated area and the contactless one that goes through the radio-frequency using an antenna embedded in the plastic card. the contactless IC card used for the transportation card was first introduced into local area buses in Seoul, and expanded throughout the country so that it has removed the inconvenience such as possession of cash, fare payment and collection. Focusing on the Seoul metropolitan area in 2004, prepaid and pay later cards were adopted and have been used interchangeably between a bus and subway. The card terminal compatible between a bus and subway is Proximity Integrated Circuit Card(PICC) as international standards(1443 Type A,B), communicates in the 13.56MHz dynamic frequency modulation-demodulation system, and adopts the Multi Secure Application Module(SAM). In the second half of 2009, the system avaliable nationwide will be built when the payment SAM standard is implemented.