• 제목/요약/키워드: Chemical bonding

검색결과 1,186건 처리시간 0.024초

pH 조건에 따른 기공성 실리콘의 나노구조 및 광학적 특성의 변화 (Variation of the Nanostructural and Optical Features of Porous Silicon with pH Conditions)

  • 김효한;조남희
    • 한국세라믹학회지
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    • 제50권4호
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    • pp.294-300
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    • 2013
  • The effect of chemical treatments of porous silicon in organic solvents on its nanostructural and optical features was investigated. When the porous Si was dipped in the organic solvent with various PH values, the morphological, chemical, and structural properties of the porous silicon was sensitively affected by the chemical conditions of the solvents. The size of silicon nanocrystallites in the porous silicon decreased from 5.4 to 3.1 nm with increasing pH values from 1 to 14. After the samples were dipped in the organic solvents, the Si-O-H bonding intensity was increased while that of Si-H bonding decreased. Photoluminescence peaks shifted to a shorter wavelength region in the range of 583 to 735 nm as the pH value increased. PL intensity was affected by the size as well as the volume fraction of the nanocrystalline silicon in the porous silicon.

Comparison of Pervaporation and Vapor Permeation Separation Processes for MTBE-methanol System

  • Kim, Youn-Kook;Lee, Keun-Bok;Rhim, Ji-Won
    • Korean Membrane Journal
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    • 제2권1호
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    • pp.36-47
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    • 2000
  • This paper deals with the separation of MTBE-methanol mixtures using crosslinked Poly(vinyl alcohol)(PVA) membranes with sulfur-succinic acid(SSA) as a crosslinking agent by pervaporation and vapor permeation technique. The operating temperatures, methanol concentration in feed mixtures, and SSA concentrations in PVA membranes were varied to investigate the separation performance of PVA/SSA membranes and the optimum separation characteristics by pervaporation and vapor permeation. And also, for PVA/SSA membranes, the swelling measurements were carried out to study the transport phenomena. The swelling measurements were carried out for pure MTBE and methanol, and MTBE/methanol=90/10, 80/20 mixtures using PVA/SSA membranes with varying SSA compositions. There are two factors of the membrane network and the hydrogen bonding. In pervaporation separation was also carried out for MTBE/methanol=90/10, 80/20 mixtures at various temperatures. The sulfuric acid group in SSA took an important role in the membrane performance. The crosslinking effect might be over the hydrogen bonding effect due to the sulfuric acid group at 3 and 5% SSA membranes, and this two factors act vice versa on 7% SSA membrane. In this case, the 5% SSA membrane shows the highest separation factor of 2,095 with the flux of 12.79g/㎡$.$hr for MTBE/methanol=80/20 mixtures at 30$^{\circ}C$ which this mixtures show near the azeotopic composition. Compared to pervaporation, vapor permeation showed less flux and similar separation factor. In this case, the flux decreased significantly because of compact structure and the effect of hydrogen bonding. In vapor permeation, density or concentration of methanol in vaporous feed is lower than that of methanol in liquid feed, as a result, the hydrogen bonding portion between the solvent and the hydroxyl group in PVA is reduced in vapor permeation. In this case, the 7% SSA membranes shows the highest separation factor of 2,187 with the flux of 4.84g/㎡$.$hr for MTBE/methanol=80/20 mixtures at 30$^{\circ}C$.

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HNO$_3:H_2O_2$ : HF 세척법을 이용한 실리콘 직접 접합 기술에 관한 연구 (Study on the Direct Bonding of Silicon Wafers by Cleaning in $HNO_3:H_2_O2:HF$)

  • 주철민;최우범;김영석;김동남;이종석;성만영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3310-3312
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    • 1999
  • We have studied the method of silicon direct bonding using the mixture of $HNO_$, $H_2O_2$, and HF chemicals called the controlled slight etch (CSE) solution for the effective wafer cleaning. CSE, two combinations of oxidizing and etching agents, have been used to clean the silicon surfaces prior to wafer bonding. Two wafers of silicon and silicon dioxide were contacted each other at room temperature and postannealed at $300{\sim}1100^{\circ}C$ in $N_2$ ambient for 2.5 h. We have cleaned silicon wafers with the various HF concentrations and characterized the parameters with regard to surface roughness, chemical nature, chemical oxide thickness, and bonding energy. It was observed that the chemical oxide thickness on silicon wafer decreased with increasing HF concentrations. The initial interfacial energy and final energy postannealed at $1100^{\circ}C$ for 2.5h measured by the crack propagation method was 122 $mJ/m^2$ and 2.96 $mJ/m^2$, respectively.

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표면처리된 복합레진에 대한 수리용 레진의 결합강도에 관한 연구 (A STUDY ON THE BOND STRENGTH OF REPAIR RESIN TO THE SURFACE TREATED COMPOSITE RESINS)

  • 강현숙;최호영
    • Restorative Dentistry and Endodontics
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    • 제20권2호
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    • pp.487-507
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    • 1995
  • Composite resin repair requires strong bond strength between the new and old materials. The objective of the current study was to identify the optimal treatments for sufficient bond strengths. Bondings between same kinds of materials and cross bondings using chemical curing composites and light curing composites were tested. Surface treatments included the methods of sand-blasting, acid etching and coating of bonding agent. Seven kinds cases of combinations from three kinds of methods were experimented and compared with a control group of which surfaces were highly polished. Measurements of shear bond strength and observations of surface morphologic changes using a scanning electron microscope were done. Following conclusions were drawn : 1. The highest bond strength among composite resins were exhibited by the treatment of the sand-blasting and the coating of bonding agent. 2. Acid etched surfaces showed the lowest bond strength. Bond strengths obtained from experimental groups including acid etching were lower than those obtained from same kinds of experimental groups without acid etching. 3. Simple method of the coating of bonding agent produced the slightly increased bond strength on chemical curing composite and reduced bond strength on light curing composite. 4. Bonding surfaces of chemical curing composite resin showed slightly higher bond strengths than light curing composite resin, however significant differences were not confirmed statistically. 5. More significant irregular surfaces were created by sand-blasting method than acid etching method. 6. A principal component of fillers of both resins was silicon. Acid etching method produced the seperations and degradations of fillers, these were significant on light curing composite resins which containing barium fillers.

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전자 여기상태에서 phenol-(H2O)2 크러스터의 수소결합 동력학: DFT/TDDFT 연구 (Hydrogen Bonding Dynamics of Phenol-(H2O)2 Cluster in the Electronic Excited State: a DFT/TDDFT Study)

  • Wang, Se;Hao, Ce;Wang, Dandan;Dong, Hong;Qiu, Jieshan
    • 대한화학회지
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    • 제55권3호
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    • pp.385-391
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    • 2011
  • Phenol-$(H_2O)_2$ 착물의 여기상태 수소 결합 동력학을 시간 의존 밀도 함수 이론(TDDFT) 법으로 연구하였다. 수소-결합된 착물에 대한 바닥 상태 및 다른 전자 여기 상태들 ($S_1$$T_1$)에서의 기하학적 구조와 IR 스펙트라를 밀도 함수 이론(DFT)와 TDDFT 방법을 사용하여 계산하였다. 페놀과 두 물분자 간에 3개의 수소 결합으로 구성된 고리가 형성되었다. 세 개의 수소 결합에서 분자간 수소결합 $O_1-H_2{\cdots}O_3-H$$S_1$ 그리고 $T_1$ 상태에서 더 강해졌지만, 수소결합 $O_5-H_6{\cdots}O_1-H$$S_1$$T_1$상태에서 약해졌다. 이러한 결과들은 다른 전자 상태에서 수소 결합과 hydrogen-bonding groups의 결합 길이의 변화를 이론적으로 모니터링하여 얻었다. 수소 결합 $O_1-H_2{\cdots}O_3-H$$S_1$$T_1$ 상태 모두에서 강화된다는 것은 OH(phenol)의 계산된 신축 진동 모드가 광 여기에 의해 적색-이동한다는 것으로부터 확인 되었다. 전자 여기 상태에서 수소 결합이 강해지고 약해지는 행동은 phenol-$(H_2O)_n$의 다른 고리 구조에 존재할 수 있다.

고압 균질기를 이용하여 형성된 셀룰로오스 나노결정의 결정 구조 및 화학적 결합 특성 연구 (Crystal structural property and chemical bonding nature of cellulose nanocrystal formed by high-pressure homogenizer)

  • 최철종;박래만;심규환
    • 한국결정성장학회지
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    • 제34권3호
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    • pp.79-85
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    • 2024
  • 고압 균질기를 이용하여 면 셀룰로오스 원료로부터 직접 셀룰로오스 나노결정을 추출하고 이에 대한 결정 구조 및 화학적 결합 상태에 대한 연구를 수행하였다. 형성된 셀룰로오스 나노결정은 나노와이어 형태의 구조적 특성을 가지며, 조밀한 구조의 메쉬 형태로 분포하였다. X-ray diffraction (XRD) 분석을 통해 관찰된 Bragg 결정면의 면간거리 계산을 통해 고압 균질기로부터 추출된 셀룰로오스 나노결정이 셀룰로오스 Iβ 하부 다형체인 monoclinc 결정구조를 갖음을 확인하였다. 셀룰로오스 나노결정에 포함된 비정질 영역을 정량적으로 평가하기 위한 Solid-state nuclear magnetic resonance(NMR) 분석 결과 셀룰로오스 나노결정의 결정화도 지수는 5 3.06 %로 계산되었다. 형성된 셀룰로오스 나노결정 표면의 O/C ratio는 0.82로 계산되었으며, C-C 결합 혹은 C-H 결합, C-O 결합, O-C-O 결합 혹은 C=O 결합, O-C=O 결합의 화학적 결합이 셀룰로오스 나노결정 표면의 주요 화학적 상태임을 알 수 있었다.

Effects of Stock Characteristics on Paper Bulk

  • Lee, Jin-Ho;Park, Jong-Moon
    • 한국펄프종이공학회:학술대회논문집
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    • 한국펄프종이공학회 2006년도 PAN PACIFIC CONFERENCE vol.2
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    • pp.423-426
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    • 2006
  • Paper has fibers and fines network structure and it is strongly affected by interface bonding between fibers. Depending on the inter-fiber bonding, paper bulk is determined. Fines play an important roll in Campbell and consolidation effect through wet pressing and drying operations. Refined Sw-BKP, Hw-BKP and BCTMP fines were used to investigate the fines effect. Wet-web strength, breaking length, scattering coefficient, and hydrodynamic specific volume were measured. According to the result of experiments, chemical and morphological compositions of fines do not strongly affect to wet-web forming, but strongly affect to drying operations which form hydrogen bonding among fiber-fines-fiber matrixes. Paper bulk should be controlled by the extent of hydrogen bonding between fibers during drying operations.

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Sputtering of Multifunctional AlN Passivation Layer for Thermal Inkjet Printhead

  • 박민호;김상호
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.50-50
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    • 2011
  • The aluminum nitride films were prepared by RF magnetron sputtering using an AlN ceramic target. The crystallinity, grain size, Al-N bonding and thermal conductivity were investigated in dependence on the plasma power densities (4.93, 7.40, 9.87 W/$cm^2$) during sputtering. High thermal conductivity is important properties of A1N passivation layer for functioning properly in thermal inkjet printhead. The crytallinity, grain size, Al-N bonding formation and chemical composition were observed using X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS), respectively. The AlN thin film was changed from amorphous to crystalline as the power density was increased, and the largest grain size appeared at medium power density. The near stoichiometry Al-N bonding ratio was acquired at medium power density. So, we know that the AlN thin film had better thermal conductivity with crystalline phase and near stoichometry Al-N bonding ratio at 7.40 W/$cm^2$ power density.

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Molecular Dynamics Investigation of the Effects of Concentration on Hydrogen Bonding in Aqueous Solutions of Methanol, Ethylene Glycol and Glycerol

  • Zhang, Ning;Li, Weizhong;Chen, Cong;Zuo, Jianguo;Weng, Lindong
    • Bulletin of the Korean Chemical Society
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    • 제34권9호
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    • pp.2711-2719
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    • 2013
  • Hydrogen bonding interaction between alcohols and water molecules is an important characteristic in the aqueous solutions of alcohols. In this paper, a series of molecular dynamics simulations have been performed to investigate the aqueous solutions of low molecular weight alcohols (methanol, ethylene glycol and glycerol) at the concentrations covering a broad range from 1 to 90 mol %. The work focuses on studying the effect of the alcohols molecules on the hydrogen bonding of water molecules in binary mixtures. By analyzing the hydrogen bonding ability of the hydroxyl (-OH) groups for the three alcohols, it is found that the hydroxyl group of methanol prefers to form more hydrogen bonds than that of ethylene glycol and glycerol due to the intra-and intermolecular effects. It is also shown that concentration has significant effect on the ability of alcohol molecule to hydrogen bond water molecules. Understanding the hydrogen bonding characteristics of the aqueous solutions is helpful to reveal the cryoprotective mechanisms of methanol, ethylene glycol and glycerol in aqueous solutions.

태양열 집열기에 사용되는 구리-유리관 접합기구 (Bonding Mechanism of Direct Copper to Glass Seal in an Evacuated Tube Solar Collector)

  • 김철영;남명식;곽희열
    • 한국세라믹학회지
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    • 제38권11호
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    • pp.1000-1007
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    • 2001
  • 진공관형 태양열 집열기에서는 열관(heat pipe)과 붕규산염 유리관의 안정된 접합이 이를 장시간 사용하는데 매우 중요하다. 구리와 유리는 그 물리.화학적 성질에 큰 차이가 있어 접합하기가 어려움으로 구리관 표면에 유리와 화학적 결합이 용이한 산화막을 생성시켜 접합하도록 구리의 산화상태, 접합계면 및 접합강도를 XRD, SEM, EDS 및 인정시험기로 측정하였다. 순수 구리는 $600^{\circ}C$ 이하로 열처리하였을 때 Cu$_2$O 산화막을 생성하였으나 그 이상의 온도에서는 CuO 산화막을 형성하였으며 후자의 산화막은 구리와의 접합력이 매우 불량하였다. 그러나 붕사로 표면 처리를 하였을 경우에는 80$0^{\circ}C$에서도 Cu$_2$O 산화막 만이 발견되었다. Cu$_2$O 산화막을 생성시킨 구리관과 붕규산염 유리관을 Housekeeper법으로 접합하였을 경우 354.4N의 접합강도를 얻을 수 있었으며 열충격 저항성도 매우 뛰어났다.

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