• Title/Summary/Keyword: Chemical Process Safety

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Chemical Use and Associated Health Concerns in the Semiconductor Manufacturing Industry

  • Yoon, Chungsik;Kim, Sunju;Park, Donguk;Choi, Younsoon;Jo, Jihoon;Lee, Kwonseob
    • Safety and Health at Work
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    • v.11 no.4
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    • pp.500-508
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    • 2020
  • Background: Research on the status of many chemicals used in the semiconductor industry is needed. The purpose of this study was to describe the overall status of chemical use in the semiconductor industry in Korea and to examine it from a health perspective. Methods: Data on the status of chemical use and safety data sheets at 11 of 12 major semiconductor workplaces in Korea were collected. The number of chemical products and chemical constituents, quantities of chemicals, and trade secret ingredients used, as well as the health hazards were examined. Results: On average, 210 chemical products and 135 chemical constituents were used at the surveyed workplaces. Among all chemical products, 33% (range: 16-56%) contained at least one trade secret ingredient. Most of the trade secret ingredients were used in the photolithography process. Several carcinogens, including sulfuric acid, chromic acid, ethylene oxide, crystalline silica, potassium dichromate, and formaldehyde were also used. Only 29% (39 of 135) of the chemical constituents had occupational exposure limits, and more than 60% had no National Fire Protection Association health, safety, and reactivity ratings. Based on the aforementioned results, this study revealed the following. First, many chemical products and constituents are being used in the semiconductor industry and many products contained trade secret ingredients. Second, many products contained significant amounts of carcinogenic, mutagenic, and reproductive toxicant materials. Conclusion: We conclude that protecting workers in the semiconductor industry against harm from chemical substances will be difficult, due to widespread use of trade secret ingredients and a lack of hazard information. The findings of the status of chemical use and the health and safety risks in semiconductor industry will contribute to epidemiological studies, safe workplace, and worker health protection.

A Study on Engineering Design IT Installation of Thermal Relief Valve in a Chemical Plant (화학플랜트에서의 릴리프밸브 설계에 관한 고찰)

  • Char, Soon-Chul;Hwang, Soon-Yong;Jang, Seo-Il
    • Journal of the Korea Safety Management & Science
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    • v.8 no.4
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    • pp.39-51
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    • 2006
  • Based on the practical process engineering design and commissioning and startup operation experiences focused on chemical process safety, the comprehensive review of engineering design and installation of the thermal relief valve with its surrounding facility in a chemical plant piping system is provided to enhance the better understanding of the piping system of characteristics of thermal relief valve which is comprised of the theoretical approach, correlation in terms of temperature and pressure increase caused by external heat supply in a piping system, consideration of thermal relief valve engineering design, pressure relieving system of serial thermal relief valves and exception of their installation. It is earnestly suggested that following topic should be implemented during thermal relief valve engineering design, installation and normal operation as well.

A Study of the Evaluation of Combustion Properties of Tetralin (테트랄린의 연소특성치 평가에 관한 연구)

  • Ha, Dong-Myeong
    • Journal of the Korean Society of Safety
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    • v.33 no.4
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    • pp.8-14
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    • 2018
  • In the industrial chemical process involving combustible materials, reliable safety data are required for design prevention, protection and mitigation measures. The accurate combustion properties are necessary to safely treatment, transportation and handling of flammable substances. The combustion parameters necessary for process safety are lower flash point, upper flash point, fire point, lower explosion limit(LEL), upper explosion limit(UEL)and autoignition temperature(AIT) etc.. However, the combustion properties suggested in the Material Safety Data Sheet (MSDS) are presented differently according to the literatures. In the chemical industries, tetralin which is widely used as a raw material of intermediate products, coating substances and rubber chemicals was selected. For safe handling of tetralin, the lower and flash point, the fire point, and the AIT were measured. The LEL and UEL of tetralin were calculated using the lower and upper flash point obtained in the experiment. The flash points of tetralin by using the Setaflash and Pensky-Martens closed-cup testers measured $70^{\circ}C$ and $76^{\circ}C$, respectively. The flash points of tetralin using the Tag and Cleveland open cup testers are measured $78^{\circ}C$ and $81^{\circ}C$, respectively. The AIT of the measured tetralin by the ASTM E659 apparatus was measured at $380^{\circ}C$. The LEL and UEL of tetralin measured by Setaflash closed-cup tester at $70^{\circ}C$ and $109^{\circ}C$ were calculated to be 1.02 vol% and 5.03 vol%, respectively. In this study, it was possible to predict the LEL and the UEL by using the lower and upper flash point of tetralin measured by Setasflash closed-cup tester. A new prediction method for the ignition delay time by the ignition temperature has been developed. It is possible to predict the ignition delay time at different ignition temperatures by the proposed model.

Exposure Characteristics for Chemical Substances and Work Environmental Management in the Semiconductor Assembly Process (반도체 조립공정의 화학물질 노출특성 및 작업환경관리)

  • Park, Seung-Hyun;Park, Hae Dong;Shin, In Jae
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.24 no.3
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    • pp.272-280
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    • 2014
  • Objectives: The purpose of this study was to evaluate the characteristics of worker exposure to hazardous chemical substances and propose the direction of work environment management for protecting worker's health in the semiconductor assembly process. Methods: Four assembly lines at two semiconductor manufacturing companies were selected for this study. We investigated the types of chemicals that were used and generated during the assembly process, and evaluated the workers' exposure levels to hazardous chemicals such as benzene and formaldehyde and the current work environment management in the semiconductor assembly process. Results: Most of the chemicals used at the assembly process are complex mixtures with high molecular weight such as adhesives and epoxy molding compounds(EMCs). These complex mixtures are stable when they are used at room temperature. However workers can be exposed to volatile organic compounds(VOCs) such as benzene and formaldehyde when they are used at high temperature over $100^{\circ}C$. The concentration levels of benzene and formaldehyde in chip molding process were higher than other processes. The reason was that by-products were generated during the mold process due to thermal decomposition of EMC and machine cleaner at the process temperature($180^{\circ}C$). Conclusions: Most of the employees working at semiconductor assembly process are exposed directly or indirectly to various chemicals. Although the concentration levels are very lower than occupational exposure limits, workers can be exposed to carcinogens such as benzene and formaldehyde. Therefore, workers employed in the semiconductor assembly process should be informed of these exposure characteristics.

Leadership for the Global Process Safety in Chemical Process Industries: Challenges of chemical process industries in Asia (화학공정산업의 글로벌 공정 안전 리더십: 아시아 화학공정산업의 과제)

  • Yoon, En Sup;Shin, Dongil
    • Proceedings of the Korean Society of Disaster Information Conference
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    • 2017.11a
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    • pp.337-338
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    • 2017
  • 지난 60년간 일본, 한국, 중국은 물론이고 아시아에서의 공정 산업은 크게 성장했다. 그 발전과정에서 다양한 사고들을 겪고 극복해내는 과정이 있었으며, 최근 한국의 화학물질관리법을 포함하여 안전 기술 및 안전 관리에 많은 진전 또한 있었다. 이 발표의 서두에서는 한국의 공정산업의 역사적 발전에 대해 뒤돌아보며 당면 과제들에 대한 논의를 전개하고자 한다. 장기적인 경제발전의 일환으로 중화학공업 육성을 표방하며, 초기 단계에 정부주도의 적극적인 산업 발전 계획을 수립해 산업의 성장을 주도하였으며, 1990년대에는 어려움을 극복하기 위해 시장 중심의 구조 조정이 도입되었다. 지난 30년 동안 한국사회에서는 가스 폭발, 건물 붕괴, 화물 및 여객선의 사고를 비롯한 치명적인 사고들이 있었다. 이러한 사고 후에는 필연적으로 안전 정책 및 법률에 중요한 발전이 있었는데, 가장 최근의 것은 2012년 유독 가스 배출 사고 이후 화학물질관리법(Chemical Control Act)을 시행한 것이다. 또한 앞으로 20년간 (2036 년까지) 다양한 구성요소의 수준을 정량화할 수 있는 지속 가능성 개념에 대한 강한 요구가 있음은 주지의 사실이다. 지속 가능성의 새로운 패러다임은 에너지, 경제 및 환경의 전통적인 구성 요소로 구성된다. 더불어 지속 가능성은 안전, 보안 및 세계화(globalization)를 다루어야 한다. 미래의 지속 가능성 개념은 이러한 6가지 구성 요소 모두를 하나의 기능으로 정량적으로 통합할 것이다. 특히 이 작업에 대한 강력한 리더십은 화학 공정 산업에서 절대적으로 부족한 현실이기에, 이러한 기능의 통합과 특화된 교육 및 훈련에 대해 한국의 사례와 해외에서의 글로벌 응용 프로그램에 대란 논의를 통해 본 발표는 향후의 발전방향과 비전에 대해 논의하고자 한다.

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A Study for Key Points of PSM to Guarantee the Safety of Liqufied Hydrogen Storage Tank (액화수소 저장탱크 안전성 확보를 위한 PSM 중점사항에 관한 연구)

  • Myoung Sun Wu;Chang Jun Lee
    • Korean Chemical Engineering Research
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    • v.61 no.1
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    • pp.74-79
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    • 2023
  • As the demand for hydrogen increases, the facilities for storing hydrogen has been important, and a few laws for hydrogen facilities should be complied. According to the Occupational Safety and Health Act in Korea, in case liquid hydrogen with a storage capacity of 5 tons or more is handled, a Process Safety Management (PSM) system should be complied. However, there are some standards which are not proper for flammable low-temperature liquefied substances on the current Occupational Safety and Health Act. In this study, 7 key points in process safey information and safety operation procedures among PSM components are suggested and how these key points should be improved is derived based on scientific analysis.

A Process Hazard Analysis using HAZOP (HAZOP을 이용한 공정위험성 평가)

  • 이동형;배기웅;남소영;남경돈;이준열
    • Proceedings of the Safety Management and Science Conference
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    • 2000.05a
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    • pp.193-200
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    • 2000
  • Hazard and operability Review(HAZOP) is widely used as a process safety analysis which systematically identifies potential process deviations and settles the problems. In this paper, we carried out a process hazard analysis using HAZOP in K chemical plant. As a result, we showed that the plant could be operated more safely and be saved a lot of money by eliminating several existing hazardous factors through the change of processes and designs.

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HAZOP Study for Risk Assessment and Safety Improvement Strategies of CO2 Separation Process (HAZOP 기법을 이용한 이산화탄소 분리 공정 위험성 평가 및 안전도 향상 전략)

  • You, Chanhee;Kim, Jiyong
    • Korean Chemical Engineering Research
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    • v.56 no.3
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    • pp.335-342
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    • 2018
  • Various technologies to cope with the energy and environmental issues related to the chemical and electric power industry are in development and demonstration stage. Especially, the absorption process of carbon dioxide ($CO_2$) using amine solution is a key technology of the $CO_2$ capture and storage (CCS). In this study, we identify the major risk factors and suggest strategies for safety improvement by analyzing and assessing commercial the amine-based $CO_2$ separation process. HAZOP method was used to assess the risk for the process. We provide facilities and operational strategies to mitigate or eliminate major risk factors by assessing the relative ranks of identified risk factors using a risk matrix.

Evaluation of Safety Characteristic in Chemical Decontamination at Extremely Severe Condition of Stainless Steels for Coolant Pump (가장 가혹한 조건에서 화학 제염한 경우 냉각재 펌프용 스테인리스강의 안정성 평가)

  • Kim, Seong-Jong;Jang, Seok-Ki;Kim, Ki-Joon
    • Journal of the Korean Society of Marine Environment & Safety
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    • v.12 no.4 s.27
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    • pp.253-259
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    • 2006
  • This paper investigated on anti-corrosion characteristic in chemical decontamination at extremely severe condition{process model-2) of stainless steels used with reactor coolant pump. The electrochemical properties of stainless steel{STS) 304 with the lapse qf cycle is better than those of STS 415 and STS 431. The STS 304 in process model-1 and process model-2 present the lowest weightloss ratio. The experiment results for STS 304, STS 415, and STS 431 in process model-2 solution, it was ascertained that weightloss ratio of process model-2 solution for process model-1 solution show 2..908, 2.572, and 2.370 times, respectively. The reason suggests that process model-2 is higher concentration of chemical and temperature compare to process model-1.

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