• 품질경영학회지
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• 제30권1호
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• pp.97-117
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• 2002

We apply Taguchi method to the process optimization problem of chemical reaction process, and some case studies are done to find out the way for cost reduction and quality improvement The parameter and tolerance designs of Taguchi mettled are done with operation data of a chemical process and we propose a procedure how to use and analyze the operation data to find the optimal process conditions and tolerance limits. In order to use the continuous values in experiment conditions, it is suggested how to determine the interval of each level by discrete values and to treat any missing values caused from discrete 4 levels.

• Corrosion Science and Technology
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• 제10권5호
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• pp.167-174
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• 2011

Due to commercialization of nuclear power, most countries have taken interest in decontamination process of nuclear power plant and tried to develop a optimum process. Because open literature of the decontamination process are rare, it is hard to obtain skills on decontamination of foreign country and it is necessarily to develop proper chemical decontamination process system in Korea. In this study, applicable possibility in chemical decontamination for reactor coolant pump (RCP) was investigated for the various stainless steels. The stainless steel (STS) 304 showed the best electrochemical properties for corrosion resistance and the lowest weight loss ratio in chemical decontamination process with immersion type than other materials. However, the pitting corrosion was generated in both STS 415 and STS 431 with the increasing numbers of cycle. The intergranular corrosion in STS 431 was sporadically observed. The sizes of their pitting corrosion also increased with increasing cycle numbers.

• 멤브레인
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• 제34권1호
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• pp.79-86
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• 2024

고분자 분리막의 대표적인 형태 중 하나인 평판형 분리막은 제조가 용이하여 실험실에서 분리막 소재 연구에서부터 실제 상용 분리막 생산에 이르기까지 널리 활용되는 분리막의 형태이다. 정밀여과 및 한외여과 등에 사용되는 평판형의 다공성 고분자 분리막은 주로 상분리 공정을 통해 제조할 수 있으며, 여기에는 비용매 유도 및 증기 유도 상분리 공정이 활용된다. 그러나 상분리 공정 특성상 주변 환경과 실험자에 따라 샘플 간 편차가 쉽게 발생하여 재현성의 확보가 어려운 점이 있다. 따라서 개발된 제조기술을 스케일업 및 재현성 확보를 위해 제어된 환경에서 연속식 대면적 제조가 가능한 롤투롤 제조장치가 필요하며, 본 연구에서는 실험실 스케일의 제조기술을 나이프 및 슬롯다이 롤투롤 공정으로 스케일 업 했을 때 나타나는 제조 환경 차이에 따른 분리막의 특성 변화를 비교하였다. 최종적으로 연속식 제조공정 인자에 대한 최적화를 통해 대면적 제조 시 분리막의 균일성을 확보하였다.

• Current Photovoltaic Research
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• 제7권2호
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• pp.33-37
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• 2019

In this paper, we compared the performance of $Cu(In,Ga)(S,Se)_2$ (CIGSSe) thin film solar cell with CdS buffer layer deposited by irradiating 365 nm UV light with 8 W power in Chemcial Bath Deposition (CBD) process. The effects of UV light irradiation on the thin film deposition mechanism during CBD-CdS thin film deposition were investigated through chemical and electro-optical studies. If the UV light is irradiated during the solution process, the hydrolysis of Thiourea is promoted even during the same time, thereby inhibiting the formation of the intermediate products developed in the reaction pathway and decreasing the pH of the solution. As a result, it is suggested that the efficiency of the CdS/CIGSSe solar cell is increased because the ratio of the S element in the CdS thin film increases and the proportion of the O element decreases. This is a very simple and effective approach to control the S/O ratio of the CdS thin film by the CBD process without artificially controlling the process temperature, solution pH or concentration.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 춘계학술대회 논문집
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• pp.217-220
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• 2001

In the shearing process the burr or rollover must be minimized in order to improve the quality of product. The burr size can be minimized by control of several process parameters. But removal of all burrs are impossible. Most mechanical type deburring methods (vibrating bowls, rotating barrels, shot blasting, for example.) will remove large burrs, other methods use chemical (electro-chemical deburring) or heat (thermal energy deburring). The electro-chemical deburring process removes burrs by the deplating method. Electro-chemical deburring equipment is requires a small capital investment than other methods(mechanical or thermal methods). Electro-chemical deburring method need to many parameters for control such as a time, voltage and concentration of electrolyte. In this paper shows relations of these parameters by experiment.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.35-40
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• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

• 한국세라믹학회지
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• 제43권9호
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• pp.564-568
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• 2006

AlO(OH) nano gel is used in precursor of ceramic material, coating material and catalyst. For use of these, not only physiochemical control for particle morphology, pore characteristic and peptization but also studies of synthetic method for preparation of advanced application products were required. In this study, AlO(OH) nano gel was prepared through the aging and drying process of aluminum hydroxides gel precipitated by the hydrolysis reaction of dilute NaOH solution and aluminum sulfate solution. In this process, optimum synthetic condition of AlO(OH) nano gel having excellent pore volume as studying the effect of water and aluminum sulfate mole ratio on gel precipitates has been studied. Water and aluminum sulfate mole ratio brought about numerous changes on crystal morphology, surface area, pore volume and pore size. Physiochemical properties were investigated as using XRD, TEM, TG/DTA, FT-IR, and $N_2$ BET method.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.504-509
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• 2004

Chemical machining(CHM) is a special process which material removed by contact of strong etchant. The application as industrial process was started from aircraft industry after 2nd world war. Chemical milling, one of the CHM process, initially became commercial bussiness and it was called chem-mill. Even today, this process widely used to remove the material from aircraft wings and fuselage panel in aircraft industry. In this study, it is attempted to design the cylinder pattern which minimize the weight within the allowable stress using chemical milling.

• 멤브레인
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• 제33권6호
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• pp.439-446
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• 2023

세라믹 분리막은 높은 열적, 화학적 안정성을 갖기 때문에 극한의 조건에서 운전되는 다양한 산업 공정에 적용할 수 있다. 그러나 투과도와 기계적 강도의 trade-off 현상에 의한 세라믹 분리막 활용에 제약이 있어, 고투과성-고강도 분리막의 개발이 필요하다. 본 연구에서는 상전이-압출법으로 알루미나 중공사 분리막을 제조하고, 고분자 바인더의 종류와 그 혼합비에 따른 분리막의 특성 변화를 관찰하였다. 용매인 DMAc (Dimethylacetamide)와 고분자 바인더의 한센 용해도 인자를 비교하면, PSf (polysulfone)가 DMAc와 높은 용해도 특성을 갖기 때문에 도프 용액의 점도와 토출압력이 높게 나타나 분리막 내부가 치밀한 구조로 형성되기 때문에 높은 기계적 강도를 갖으나 수투과도가 감소하는 것으로 확인되었다. 그에 반해, PES(polyethersulfone)를 이용하여 분리막을 제조하면 기계적 강도가 다소 감소하고 수투과도가 증가하는 것으로 나타났다. 따라서 분리막 성능과 물성을 최적화하기 위해 PSf와 PES를 혼합하여 분리막을 제조하였으며, 9:1로 혼합하여 제조된 분리막에서 최적화된 수투과도와 기계적 강도를 얻을 수 있었다.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.