• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.739-742
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• 2000

Micro machining technology has been studied to fabricate small size and high accuracy milli-structure products. To perfectly overcome the conventional mechanical machining methods, the chemical mechanical micro machining(C3M) process was developed. The mechanism of C3M process is that chemical solution etches the material and results in the generation of the chemical reacted layer, and the mechanical micro tool subsequently removes the layer. From the fundamental experiments, the C3M process has been founded to have the advantages of lower machining resistance, tool wear, and higher surface quality and form accuracy than conventional methods. This study focuses on the micro grooving of both the metallic material(SKDII, A1) and hard brittle silicon oxide.

• 한국정밀공학회지
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• 제19권1호
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• pp.186-195
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• 2002

The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.907-910
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• 1997

With increasing the needs for micro and precision parts, micro machining technology has been studied to fabricate a small part with high density such as electronics, optics, communications, and medicine industry more than before. But there are many problems to be solved requiring a high-level technology. So this research presents the new method to fabricate a small part through applying chemical mechanical micro machining (C3M) for the Al wafer. Al(thickness I ,u m) was sputtered on the Si substrate. Al is widely used as a lightweight material. However form defect such as burr has a bad effect on products. To improve machinability of ductile material, oxide layer was formed on the surface of AI wafcr before grooving by chemical reaction with HN03(10wt%). And then workpieces were machined to compare conventional micro-machining process with newly suggested method at different machining condition such as load and feed rate. To evaluate whether or not the machinability was improved by the effect of chemical condition, such as the size, the width of grooves 'and burr generation were measured. Finally, it is confirmed that C3M is one of the feasible tools for micro machining with the aid of effect of the chemical reaction.

• 한국정밀공학회지
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• 제18권12호
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• pp.177-184
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• 2001

C3M(chemical mechanical micro machining) is applied for diminishing the size of burr and fabricating the massless patterning for aluminium wafer(thickness of 1${\mu}m$). It is difficult to perform the micro size machining with the radically increased shear stress. While the miniaturization and function-orientation of parts has been needed in the many field such as electronics, optics and medicine. etc., it is not enough to satisfy the industry needs in the machining technology. In this paper feasibility test of diminishing burr and fabricating maskless pattern was experimented and analyzed. In the experiment oxide layer was farmed on the aluminium with chemical reaction by ${HNO_3}$(10wt%), then the surface was grooved with tungsten carbide tool for the different condition such as the load and fred rate. The result was compared with the conventional machining to show the improvement of C3M with SEM for burr diminish and XPS for atomic existence, AFM for more precise image.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.1047-1050
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• 2000

As the progress of new industrial products or parts technology, the precise and fine machining technologies are needed more and more. Micro fabrication technology of these products are usally consisted of mechanical machining or MEMS technology. Direct machining by mechanical method is not applicable to mass production. MEMS technology also has several problems such as low mechanical strength, bad surface roughness and difficulty of 3 dimensional machining. In this study, we introduce several micro fabrication technology to make micro molds and dies and our project to develop these machining technology.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.976-979
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• 2002

This research presents the new method to fabricate small features through applying chemical mechanical micro machining(C3M) for Al5052 and single crystal silicon. To improve machinability of ductile and brittle material, reacted layer was formed on the surface before micro-drilling process by chemical reaction with $HNO_3$(10wt%) and KOH(10wt%). And then workpieces were machined to compare conventional micro-drilling process with newly suggested one. To evaluate whether or not the machinability was improved by the effect of chemical condition, surface defects such as burr, chipping and crack generation were measured. Finally, it is confirmed that C3M is one of the feasible tools for micro machining with the aid of effect of the chemical reaction.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1052-1058
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• 2003

The possibility of micro/nano machining through electro-chemical process is discussed in this research. Electro-chemical dissolution region is localized within 1 ${\mu}m$ by applying ultra short pulses with tens of nanosecond duration. The effects of voltage, pulse duration, and pulse frequency on the localization distance are investigated. Localization distance can be manipulated by controlling the voltage and pulse duration, and various hole shapes are produced including stepped holes and taper free hole. High quality micro-hole with 8 ${\mu}m$ diameter with 20 ${\mu}m$ depth and micro-groove with 9 ${\mu}m$ width with 10 ${\mu}m$ depth are machined on 304 stainless steel.

• 대한기계학회논문집A
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• 제20권10호
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• pp.3113-3125
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• 1996

The objective of this study is to develop novel method named mechanical and chemical machining technique, which is capable of producing three dimensional patterns of few micrometers in dimension on a silicon wafer without the use of a mask. The strategy is to impart mechanical energy along the path of the pattern to be fabricated on a single crystal silicon by way on introdusing frictional interaction under controlled conditions. Then, the surface is preferentially etched to reveal the areas that have been mechanically energized. Upon completion of the etching process, the three dimensional pattern is produced on the silicon surface. Experiments have been conducted to identify the optimal tool material, geometery, as well as fabrication condition. The new technique introduced in this paper is significantly simpler than the conventional method which require sophisticated equipment and much time.

• 대한기계학회논문집
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• 제14권5호
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• pp.1147-1154
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• 1990

본 연구에서는 초음파 화학 가공(ultrasonicassisted chemical mahining)을 이용하여 100$\mu\textrm{m}$이하의 전극봉을 제작하였고 제작한 전극을 이용하여 미세구멍을 방전 가공함으로써 가공특성을 파악하고, 방전액을 각각 등유(kerosene)와 물로하여 구멍의 표면을 비교, 분석하였으며 전극의 지름, 가공물의 두께에 대한 오버컷과 경사도(tap- er) 그리고 전극의 마멸을 조사하였다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2005년도 춘계학술대회 논문집
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• pp.389-394
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• 2005

Microfactory is effective method for machining micro size component. Electro-chemical machining can be more suitable to a microfactory than other machining methods in terms of maintaining high accuracy. Surface profile of EDM Machined component is predicted by micro EDM simulation using superpositioning spark crater. Planar motor and micro pump are developed to construct microfactory system.