• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1921-1923
• /
• 2001

In this work, an array of resistance temperature detector(RTD) was fabricated inside the microchannel in order to investigate in-situ flow characteristics. A rectangular straight microchannel, integrated with RTD's for temperature sensing and a heat source for generating the temperature gradient along the channel. were fabricated with the dimension of $200{\mu}m(W){\times}{\mu}m(D){\times}$48mm(L), while RTD measured precise temperatures at the inside-channel wall. 4" $525{\pm}25{\mu}m$ thick P-type <100> Si wafer was used as a substrate. For the fabrication of RTDs. 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, glass wafer was bonded with Si wafer by anodic bonding, therefore RTD was located inside the microchannel. The temperature distribution inside the fabricated microchannel was obtained from 4 point probe measurements and Dl water is used as a working fluid. Temperature distribution inside the microchannel was measured as a function of mass flow rate and heat flux. As a result, precise temperatures inside the microchannel could be obtained. In conclusion, this novel temperature distribution measurement system will be very useful to the accurate analysis of the flow characteristics in the microchannel.

• KSBB Journal
• /
• v.18 no.5
• /
• pp.429-433
• /
• 2003

LAL (Limulus amebocyte lysate) test to detect and quantity endotoxin is based on gellation reaction between endotoxin and LAL from a blood extract of Limulus polyphemus. The test is labor intensive requiring dedicated personnel, takes relatively long reaction time (approximately 1 hr), requires relatively large volume of samples and reagents, and its end-point detection method is rather subjective. To solve these problems, we attempted to develop a miniaturized LOC (lab-on-a-chip) prototype using PDMS and glass. Using the 62 mm (length) ${\times}$ 18 mm (width) prototype in which 2 mm (width) ${\times}$ 44.34 mm (length) ${\times}$ 100 $\mu\textrm{m}$ (depth) microfluidic channel was provided, we compared the various detection methods of gellation, turbidometric, and chromogenic assays to find the chromogenic method to be the most suitable for small volume assay. In this assay, kinetic point method was more accurate than end point method. We also found the PDMS chip thickness should be minimized to around 2 mm to allow sufficient light transmittance, which necessitated a glass slide bonding for chip rigidity. Through the miniaturization, the test time was reduced from 1 hr to less than 10 minutes, and the sample volume could be reduced from 100 ${\mu}\ell$ to 4.4 ${\mu}\ell$. In sum, this study revealed that the mini LOC could be an alternative for a semi-automated and reliable method for LAL test.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.38B no.6
• /
• pp.427-434
• /
• 2013

In this paper, the design and layout of a 2.5 Gbps arrayed VCSEL driver for optical transceiver having arrayed multi-channel of integrating module is confirmed. In this paper, a 4 channel 2.5 Gbps VCSEL (vertical cavity surface emitting laser) driver array with automatic optical power control is implemented using $0.18{\mu}m$ CMOS process technology that drives a $1550{\mu}m$ high speed VCSEL used in optical transceiver. To enhance the bandwidth of the optical transmitter, active feedback amplifier with negative capacitance compensation is exploited. We report a distinct improvement in bandwidth, voltage gain and operation stability at 2.5Gbps data rate in comparison with existing topology. The 4-CH chip consumes only 140 mW of DC power at a single 1.8V supply under the maximum modulation and bias currents, and occupies the die area of $850{\mu}m{\times}1,690{\mu}m$ excluding bonding pads.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.51 no.9
• /
• pp.449-454
• /
• 2002

A rectangular straight microchannel, integrated with the resistance temperature detectors(RTDs) for temperature sensing and a micro-heater for generating the Temperature gradient along the channel, was fabricated. Its dimension is 57${\mu}{\textrm}{m}$(H)$\times$200${\mu}{\textrm}{m}$(W)$\times$48,050${\mu}{\textrm}{m}$(L), and RTDs were placed at the inner-channel wall. Si wafer was used as a substrate. For the fabrication of RTDs, 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, the glass wafer was bonded with Si wafer by anodic bonding, so that the RTDs are located inside the microchannel. Temperature coefficient of resistance(TCR) values of the fabricated Pt-RTDs were 2800~2950ppm$^{\circ}C$ and the variation of TCR value In the range of O~10$0^{\circ}C$ was less than 0.3％. Therefore, it was proved that the fabricated Pt-RTDs without annealing were excellent as temperature sensors. The temperature distribution in the microchannel was investigated as a function of mass flow rate and heating power. The temperature increase rate diminished with decreasing the applied power and increasing the mass flow rate. It was confirmed from the comparison with the simulation results that the temperature measured inside the microchannel is more accurate than measuring the temperature measured at the outer wall. The proposed temperature sensing method and microchannel are expected to be useful in microfluidics researches.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.2
• /
• pp.195-202
• /
• 2004

This paper presents the fabrication and evaluation of mechanical behavior for a peristaltic micropump by flow simulation. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, the middle plate, the upper plate and the tube that connects inlet and outlet of the pump. The lower plate includes the channel and the chamber, and the plain middle plate are made of glass and actuated by the piezoelectric translator. Channels and a chamber on the lower plate are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The upper plate does the roll of a pump cover and has inlet/outlet/electric holes. Three plates are laminated by the aligner and bonded by the anodic bonding process. Flow simulation is performed using error-reduced finite volume method (FVM). As results of the flow simulation and experiments, the single chamber pump has severe flow problems, such as a backflow and large fluctuation of a flow rate. It is proved that the double-chamber micropump proposed in this paper can reduce the drawback of the single-chamber one.

• Proceedings of the Korean Society of Broadcast Engineers Conference
• /
• 2011.07a
• /
• pp.320-321
• /
• 2011

본 논문은 디지털 케이블전송망인 HFC(Hybrid Fiber and Coaxial)망 기반하에서 6MHz 다수의 방송채널결합 기술을 이용하여, 대용량 3D 및 8K-UHD 콘텐츠 전송을 위한 방송망 채널결합형 200Mbps 급 1024-QAM 송수신시스템 개발에 대하여 기술한다. H.264 비디오 부호화기를 사용하여 8K-UHDTV 및 3D/UHD 융합형 서비스를 시청자에게 제공하기 위해서는 약 120~160Mbps 의 대용량 데이터 전송률이 확보되어야 한다. 이와같이 대용량 3D/8K-UHDTV 콘텐츠를 전송하기 위해서는 상대적으로 채널환경이 우수한 HFC 디지털 케이블망을 이용한 대용량 실감미디어 콘텐츠 전송기법에 대한 연구가 주목 받고 있다. 본 논문에서는 FPGA 를 이용하여 HFC 망 기반에서 기존 OpenCalbe/DOCSIS 3.0 256-QAM 대비 약 30% 전송효율이 개선된 3D/8K-UHDTV 대용량 실감미디어 콘텐츠 전송을 위한 방송망 채널결합형 1024-QAM 송수신기 구현 및 개발에 관한 내용을 기술한다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2007.06a
• /
• pp.69-72
• /
• 2007

DOCSIS 3.0 Protocol is proposed to make the advance of HFC network. In the DOCSIS based network, the upstream frame is divided into contention section reservation section. CMs to have packets send request messages through the contention section. That two or more CMs sends Request message at the same contention slot makes collison. In this paper, are propose the contention section establlish at algorithm considering of channel-bonding mechanism that is the primary technique of DOCSIS 3.0. Results of simulation display better performance int the number of contention slots and the utilization of contention section.

• Journal of the Korean Society for Precision Engineering
• /
• v.34 no.2
• /
• pp.77-81
• /
• 2017

CP (Commercially Pure) titanium has been widely used in various industries such as in energy plants and bio-materials because of an excellent corrosion resistance and its non-toxicity to the human body. But there are limitations for usage as structural materials due to low strength. The tensile properties of CP titanium could be improved by microstructure refinement such as in a SPD (Severe Plastic Deformation) process. However, high strengthening of CP titanium wire is impossible by SPD processes like ECAP (Equal Channel Angular Pressing), HPT (High-Pressure Torsion), and the ARB (Accumulative Roll Bonding) process. The study purposes are to increase the strength of CP titanium wire by optimization of the cold drawing process and the harmonization with mechanical properties by heat treatments for the next forming process. The optimization process was investigated with regard to the design of drawing dies and the reduction ratio of cross sections. The elongations of high strength CP titanium were controlled by heat treatment.

• Journal of the Korean Wood Science and Technology
• /
• v.26 no.1
• /
• pp.29-37
• /
• 1998

Alkali-soluble extracts were prepared from medium-sized barks of Radiata pine(Pinus radiata). There are difficulties in the production of extracts with uniform quality and in the preparation of adhesives with suitable viscosity. Ultrafiltration using an Amicon cell was subjected to fractionate extracts according to molecular sizes in order to overcome the above problem. The filtration efficiency was studied by using thin channel filtration systems. Adhesive manufacturing was also examined. Removal of particles greater than 0.45m from the extracts increased both filtration speed (flux) and yields of solids in the filtrates. Ultrafiltration with PM 10 membrane was very effective to fractionate and concentrate the extracts. Stiasny precipitates from the filtrates obtained by PM 10 membrane were very lower than that(83%) of the retentates. This ultrafiltration method was efficient for obtaining high yield purified phenolic compounds(mainly polyflavanoids) and thus important for preparing wood adhesives from barks. The extracts were shown excessive high viscosities at the concentrations required for adhesive formulation, but this high viscosity and short gelation time was reduced by lowering pH of the extracts and addition of urea. The highest bonding strength of plywoods(340g/$m^2$ of adhesive spreads) was achieved with adhesive formulated by 100parts of mixed alkali extracts and urea(70/30,w/w), 10parts of p-formaldehyde and 3.5parts of wheat flour at pH 6, and by hot pressing at the conditions of 12kg/$cm^2$ at $120^{\circ}C$ for 10 minutes.

• Electronics and Telecommunications Trends
• /
• v.32 no.6
• /
• pp.8-16
• /
• 2017

In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.