• 제목/요약/키워드: Capping layer

검색결과 137건 처리시간 0.032초

집중관측을 통한 서해연안의 대기 수직구조 특성 (On the Characteristics of Vertical Atmospheric Structure in the Western Coastal Region through the Intensive Observation Period)

  • 문승의;노재식
    • 한국환경과학회지
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    • 제7권3호
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    • pp.335-348
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    • 1998
  • The intensive meteorological observations including pibal balloon at Ungcheon, airsonde and 10m meteorological tower observations at Gulup-Do, where are located In the western coastal region, are taken to Investigate the characteristics of the upper and lower atmospheric structure and the local circulation pattern during the period of 17 to 22 September 1996. The diurnal variations of weather elements(i.e. air temperature, humidity, pressure, and Und speeds at Gulup-Do are analyzed and discussed with those at four inland meteorological stations. The vertical profiles of wind vector, ortho- gonality(Ω), and shear obtained from the pibal obsenrations are also presented to examine the change of wand structure according to the synoptic-scale pressure system's movement. The diurnal temperature changes at Gulup-Do are more sensitive than that of Inland meteorological stations In case of the mow of southwesterlies but are not dominant due to the ocean effect under the Influence of relatively cold northerlies. A well defined mixed layer Is developed from the 500m to the maximum 1700m with a significant capping Inversion layer on the top of it. It can be found from the vertical profiles of wind vector that the wind become generally strong at the interface heights between cloud lay- ers and non-cloud layers. The maximum Und shear Is appeared at the bel각t where the varlauon of wand direction Induced by the passage of synoptic-scale pressure system Is accompanied with the In- crease of Und speed. Based on the wind orthogonality, the change of wind direction with height is more complicated In cloudy day than In clear day. In case of a fair weather, the change of wand direction is showed to be at around 2km.

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TEM Study on the Growth Characteristics of Self-Assembled InAs/GaAs Quantum Dots

  • Kim, Hyung-Seok;Suh, Ju-Hyung;Park, Chan-Gyung;Lee, Sang-Jun;Noh, Sam-Gyu;Song, Jin-Dong;Park, Yong-Ju;Lee, Jung-Il
    • Applied Microscopy
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    • 제36권spc1호
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    • pp.35-40
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    • 2006
  • Self-assembled InAs/GaAs quantum dots (QDs) were grown by the atomic layer epitaxy (ALE) and molecular beam epitaxy (MBE) techniques, The structure and the thermal stability of QDs have been studied by high resolution electron microscopy with in-situ heating experiment capability, The ALE and MBE QDs were found to form a hemispherical structure with side facets in the early stage of growth, Upon capping by GaAs layer, however, the apex of QDs changed to a flat one. The ALE QDs have larger size and more regular shape than those of MBE QDs. The QDs collapse due to elevated temperature was observed directly in atomic scale, In situ heating experiment within TEM revealed that the uncapped QDs remained stable up to $580^{\circ}C$, However, at temperature above $600^{\circ}C$, the QDs collapsed due to the diffusion and evaporation of In and As from the QDs, The density of the QDs decreased abruptly by this collapse and most of them disappeared at above $600^{\circ}C$.

GaAs/AlGaAs 양자점구조에서 표면전기장에 관한연구

  • 김종수;조현준;김정화;배인호;김진수;김준오;노삼규;이상준;임재영
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.158-158
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    • 2010
  • 본 연구에서는 분자선 박막성장 장비를 (MBE) 이용하여 droplet epitaxy 방법으로 성장시킨 GaAs/AlGaAs 양자점구조의 표면전기장변화에 관하여 photoreflectance spectroscopy (PR)를 이용하였다. 본 실험에 사용된 GaAs/AlGaAs 양자점 구조는 undoped-GaAs (001) 기판을 위에 성장온도 $580^{\circ}C$에서 GaAs buffer layer를 100 nm 성장 후 장벽층으로 AlGaAs을 100 nm 성장하였다. AlGaAs 장벽층을 성장한 후 기판온도를 $300^{\circ}C$로 설정하여 Ga을 3.75 원자층를 (ML) 조사하여 Ga drop을 형성하였다. Ga drop을 GaAs 나노구조로 결정화시키기 위하여 $As_4$를 beam equivalent pressure (BEP) 기준으로 $1{\times}10^{-4}$ Torr로 기판온도 $150^{\circ}C$에서 조사하였다. 결정화 직후 RHEED로 육각구조의 회절 페턴을 관측하여 결정화를 확인하였다. GaAs 나노 구조를 성장한 후 AlGaAs 장벽층을 성장하기위해 10 nm AlGaAs layer는 MEE 방법을 이용하여 $150^{\circ}C$에서 저온 성장 하였으며, 저온성장 후 기판온도를 $580^{\circ}C$로 설정하여 80 nm의 AlGaAs 층을 성장하고 최종적으로 GaAs 10 nm를 capping layer로 성장하였다. 저온성장 과정에서의 결정성의 저하를 보상하기위하여 MBE 챔버내에서 $650^{\circ}C$에서 열처리를 수행하였다. GaAs/AlGaAs 양자점의 광학적 특성은 photoluminescence를 이용하여 평가 하였으며 780 nm 근처에서 발광을 보여 주었다. 특히 PR 실험으로부터 시료의 전기장에 의한 Franz-Keldysh oscillation (FKO)의 변화를 관측하여 GaAs/AlGaAs 양자점의 존재에 의한 시료의 표면에 형성되는 표면전기장을 측정하였다. 또한 시료에 형성된 전기장의 세기를 계산하기위해 PR 신호로부터 fast Fourier transformation (FFT)을 이용하였다. 특히 온도의 존성실험을 통하여 표면전기장의 변화를 관측 하였으며 양자구속효과와 관련성에 대하여 고찰 하였다.

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Brillouin Light Scattering을 이용한 GaAs/Fe/Au 구조의 자기이방성 (Brillouin Light Scattering Study of Magnetic Anisotropy in GaAs/Fe/Au System)

  • 하승석;유천열;이석목
    • 한국자기학회지
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    • 제18권4호
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    • pp.147-153
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    • 2008
  • GaAs 기판위에 Fe을 성장시킨 이종 접합 구조는 두 물질의 lattice mismatch가 1.4 % 정도로 작기 때문에 결정 상태가 매우 좋은 Fe층을 성장시킬 수 있는 것으로 알려져있다. GaAs/Fe의 계면에서는 많은 흥미로운 현상이 관찰되며, 또한 스핀주입을 이용한 산업적 응용 면으로 가치가 있는 구조로서 활발한 연구가 진행되어 왔다. 본 연구에서는 GaAs(100) 표면에 Fe층을 쐐기모양으로 두께를 $0{\sim}3.4$ nm로 바꾸어 성장시키고 5 nm 두께의 Au층을 추가 증착시킨 시료를 Brillouin light scattering(BLS) 측정방법을 이용, 자기이방성에 대해 조사하였다. Fe층 두께를 변화시켜가며 자화 용이축과 곤란축 방향으로 외부자기장의 세기에 대한 스핀파 들뜸의 의존도와 외부자기장의 방위각에 대한 스핀파 들뜸의 의존도를 조사하였다. 측정된 결과의 정량적 분석을 통해 Fe층의 두께에 따라 일축 자기이방성 상수와 이축 자기이방성 상수를 구하였다. GaAs층 위에서 성장된 Fe층의 자기이방성은 GaAs 기판에 영향을 받아 Fe층의 두께가 얇을수록 큰 일축 자기이방성을 가지고 박막의 두께가 증가함에 따라서 Fe 본래의 이축 이방성의 크기가 증가함을 확인하였다.

나노급 CMOSFET을 위한 Pd 적층구조를 갖는 열안정 높은 Ni-silicide (Thermal Stable Ni-silicide Utilizing Pd Stacked Layer for nano-scale CMOSFETs)

  • 유지원;장잉잉;박기영;이세광;종준;정순연;임경연;이가원;왕진석;이희덕
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.10-10
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    • 2008
  • Silicide is inevitable for CMOSFETs to reduce RC delay by reducing the sheet resistance of gate and source/drain regions. Ni-silicide is a promising material which can be used for the 65nm CMOS technologies. Ni-silicide was proposed in order to make up for the weak points of Co-silicide and Ti-silicide, such as the high consumption of silicon and the line width limitation. Low resistivity NiSi can be formed at low temperature ($\sim500^{\circ}C$) with only one-step heat treat. Ni silicide also has less dependence of sheet resistance on line width and less consumption of silicon because of low resistivity NiSi phase. However, the low thermal stability of the Ni-silicide is a major problem for the post process implementation, such as metalization or ILD(inter layer dielectric) process, that is, it is crucial to prevent both the agglomeration of mono-silicide and its transformation into $NiSi_2$. To solve the thermal immune problem of Ni-silicide, various studies, such as capping layer and inter layer, have been worked. In this paper, the Ni-silicide utilizing Pd stacked layer (Pd/Ni/TiN) was studied for highly thermal immune nano-scale CMOSFETs technology. The proposed structure was compared with NiITiN structure and showed much better thermal stability than Ni/TiN.

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Strain-Relaxed SiGe Layer on Si Formed by PIII&D Technology

  • Han, Seung Hee;Kim, Kyunghun;Kim, Sung Min;Jang, Jinhyeok
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.155.2-155.2
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    • 2013
  • Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.

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매립장 폐기물 특성에 따른 지반특성 변화 사례 연구 (Case study on the variation of landfill soil properties due to waste materials' characteristics)

  • 김진환;조진우;백용;이용수
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2010년도 추계 학술발표회
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    • pp.1213-1216
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    • 2010
  • Developable areas nearby metropolitan areas, which has high the density of population are limited by highly industrialized. In recent, the redeveloping plans for the finished industrial and resident areas are pushing to resolve this problems. Getting to the exact properties for reclaimed wastes is very important to reuse of landfill. Also, a strategy for how to deal with follow-up measures have to based on the waste characteristics. A lot of environmental problems have been happened in finished waste landfill such as a nasty smell by seepage, pollution of surface and ground water, a poisonous gas and soil contamination. The environment pollution in waste landfill have been studied by many researchers. The goal of this study is estimate the effects for the ground properties with the environmental properties of waste in finished landfill. As the results, the chemical characteristics of seepage in landfill may effect directly or indirectly to capping layer. Therefore, sustainable researches are needed to develop a secure landfill over the long term.

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스핀 코팅 가능한 폴리머의 후열처리를 통한 그래핀의 합성과 특성

  • 이임복;남정태;박상준;배동재;김근수
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.384.1-384.1
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    • 2014
  • 대면적 그래핀을 합성하는 방법으로 주로 화학기상증작법, SiC 기판을 고온 열처리하는 방법 그리고 최근에는 고체소스를 활용하여 그래핀을 합성하는 방법 등이 보고되고 있다. 이에, 본 연구에서는 폴리머 용액들을 원하는 기판에 스핀코팅하여 건조시킨 후, 후 열처리 공정을 통해 그래핀을 합성하고 물성을 평가해보았다. 그래핀 합성을 위해서 사용된 폴리머 탄소원은 Vinyl계 폴리머 용액으로, polystyrene (PS), polyacrylonitrile (PAN), 그리고 polymethylmetacrylate (PMMA) 등으로 2wt%의 폴리머 용액을 $SiO_2$기판에 스핀 코팅을 하고, 그 위에 Nickel이나 Copper와 같은 catalytic metal을 capping layer로 증착하고, 고진공에서 후열처리 공정에 의해 그래핀을 성장하였다. 이때, 탄소원으로 쓰인 PS, PMMA 폴리머는 pristine graphene 합성을 위해, PAN 폴리머는 질소가 도핑된(n-type) 그래핀 합성을 위해 사용되었다. 그래핀의 물성은 폴리머 종류, 코팅된 두께, 촉매 금속층 종류와 두께, 그리고 후열처리 공정 온도와 시간에 따라서 조절이 가능하였다. 우리는 Raman spectroscopy, AFM, SEM 등을 활용하여 그래핀의 층수, 결함, 표면양상 등을 평가하였고, 또한 전사된 그래핀을 기반으로 제작된 FET의 게이트 전압에 따른 I-V 곡선을 측정하여 캐리어 종류 및 전하 이동도 등을 평가하였다. 더욱 상세한 내용은 프레젠테이션에서 논하겠다.

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HgTe 양자점의 광전류 특성 (Photocurrent of HgTe Quantum Dots)

  • 김현석;김진형;이준우;송현우;조경아;김상식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.84-87
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    • 2003
  • HgTe quantum dots(QDs) were synthesized in aqueous solution by colloidal method. The absorption and photoluminescence(PL) spectrum of the synthesized HgTe QDs revealed the strong exitonic peak in the IR region. And the photocurrent measurement of colloidal QDs are performed using IR light source. The lineshape of the wavelength dependent intensity of photocurrent was very similar to the absorption spectrum, indicating the charges generated by the absorption of photons give direct contribution to photocurrent. The channels of dark current are supposed $H_2O$ containing in thiol by the remarkable drop of current at the state of vacuum. It was thought that the proper passivation layer on the top of HgTe film reduce the dark current and the adequate choice of capping material improves the efficiency of the photocurrent in the HgTe QDs. This study suggests that HgTe QDs are very prospective materials for optoelectronics including photodetectors in the IR range.

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치수복조제가 백서치수조직에 미치는 영향에 대한 병리조직학적 연구 (HISTOPATHOLOGICAL EVALUATION OF PULP CAPPING AGENTS ON RATS MOLARS)

  • 김길태
    • Restorative Dentistry and Endodontics
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    • 제7권1호
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    • pp.107-115
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    • 1981
  • The purpose of this investigation was to study histopathological chronology and differences of the proprietary pulpcapping agents. One hundred eighty molars from thrity rats (Srague-Dawley species), weighing about 130gm, were divided into six groups. Cavities were prepared in their maxillary molars under intraperitoneal anesthesia with Secobarbital. The cavities in the right first and second molars were filled with Dycal$^{(R)}$ and the left ones were with Cavitec$^{(R)}$. Each group of rats were sacrificed at the intervals of 1, 3, 5, 7, 14 and 21 days following operation. The rats were decapituated, and the jaws were fixed in 10% neutral buffered formalin. Then the specimens were decalcified, embedded in paraffin or celloid, and sectioned at 6-8 ${\mu}$ in thickness through the cavities included and pulp mesiodistally. They were stained with Hematoxylin-Eosin and examined by lightmicroscope. The results were as follow: 1. The pattern of pulp healing was dependent upon the presence and character of the pulpcapping agents above. 2. Dentin bridge formation as a sign of pulp healing occurred in the 14 days after operation. 3. Dycal$^{(R)}$ reparation appeared to favor pulp bealing rather than Cavitec$^{(R)}$ preparation. 4. In the odontoblastic layer and pulp tissue specific vaculoes were showed at the 3, 5 and 7 days of the Dycal filling.

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