• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.919-922
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• 2003

This paper presents a novel low power driving circuit for passive matrix organic lighting emitting diodes (OLED) displays. The proposed driving method for a low power OLED driving circuit which reduce large parasitic capacitance in OLED panel only use current driving method, instead of mixed mode driving method which uses voltage pre-charge technique. The driving circuit is implemented to one chip using 0.35${\mu}{\textrm}{m}$ CMOS process with 18V high voltage devices and it is applicable to 96(R.G.B)X64, 65K color OLED displays for mobile phone application. The maximum switching power dissipation of driving power dissipation is 5.7mW and it is 4% of that of the conventional driving circuit.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
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• pp.587-590
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• 1988

In the case of VLSI computer system control unit design using PLA, optimal state code assignment algorithm to minimize the PLA area is proposed. An optimal state code assignment algorithm which considers output state and logic minimization simultaneously is proposed, and by means of this, algorithm product term is minimized. Also, by means of this algorithm running time and memory capacitance is decreased as against heuristic state code assignment algorithm which uses matrix calculation and considers the constraint relation only. This algorithm is implemented on VAX 11/750 (UNIX4.3BSD). Through the various test example applied proposed algorithm, the efficiency of this algorithm is shown.

• 대한전자공학회논문지
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• 제22권6호
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• pp.46-52
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• 1985

본 논문은 구형 마이크로스트립 안테나의 H-plane 상호결합에 관한 연구이다. 두 안테나의 상호결합을 계산하기 위해서 단일 마이크로스트립 패치의 교사저항을 구하였으며 결합된 전송선로를 even mode와 add mode로 분발하여 각 mode의 특성저항와 실효 유전률을 계산하였다. 이로부터 자계적으로 결합된 안테나를 S-band 주파수에서 S-parameter를 구한 결과 이론치와 실험치가 거의 일치함을 확인할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.71-71
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• 2012

As the critical dimensions of integrated circuits are scaled down, the line width and spacing between the metal interconnects are made smaller. The dielectric film used as insulation between the metal lines contributes to the resistance-capacitance (RC) time constant that governs the device speed. If the RC time delay, cross talk and lowering the power dissipation are to be reduced, the intermetal dielectric (IMD) films should have a low dielectric constant. The introduction of Cu and low-k dielectrics has incrementally improved the situation as compared to the conventional $Al/SiO_2$ technology by reducing both the resistivity and the capacitance between interconnects. Some of the potential candidate materials to be used as an ILD are organic and inorganic precursors such as hydrogensilsequioxane (HSQ), silsesquioxane (SSQ), methylsilsisequioxane (MSQ) and carbon doped silicon oxide (SiOCH), It has been shown that organic functional groups can dramatically decrease dielectric constant by increasing the free volume of films. Recently, various inorganic precursors have been used to prepare the SiOCH films. The k value of the material depends on the number of $CH_3$ groups built into the structure since they lower both polarity and density of the material by steric hindrance, which the replacement of Si-O bonds with Si-$CH_3$ (methyl group) bonds causes bulk porosity due to the formation of nano-sized voids within the silicon oxide matrix. In this talk, we will be introduce some properties of SiOC(-H) thin films deposited with the dimethyldimethoxysilane (DMDMS: $C_4H_{12}O_2Si$) and oxygen as precursors by using plasma-enhanced chemical vapor deposition with and without ultraviolet (UV) irradiation.

• 대한전자공학회논문지SD
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• 제38권12호
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• pp.56-65
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• 2001

본 논문은 이상적인 균일한 무손실 유전체를 갖는 일반적인 3차원 연결선 구조에서의 커패시턴스 추출 시, 널리 사용되는 일차 대조법(First-order collocation) 외에 고차 구적법을 결합하여 사용함으로써 정확성을 제고하고, 반복적 행렬-벡터의 곱을 효율적으로 수행하기 위한 알고리즘을 제안한다. 제안된 기법은 연결선에서 전기적 성질이 집중되어 있는 코너나 비아를 포함한 경우에 일차 대조법 대신에 구적법을 이용하여 고차로 근사함으로써 정확성을 보장한다. 또한, 이 기법은 경계 요소 기법에서 행렬의 대부분이 수치적으로 저차 계수(low rank)를 이룬다는 회로상의 전자기적 성질을 이용하여 모형차수를 축소함으로써 효율성을 증진한다. 이 기법은 SVD(Singular Value Decomposition)에 기반한 저차 계수 행렬 축소 기법과 신속한 행렬의 곱셈 연산을 위한 Krylov-subspace 차수 축소 기법인 Gram-Schmidt 알고리즘을 도입함으로써 효율적인 연산을 수행할 수 있다. 제안된 방법은 허용 오차 범위 내에서 효율적으로 행렬-벡터의 곱셈을 수행하며, 이를 기존의 연구에서 제시된 기법과의 성능 평가를 통하여 보인다.

• 전기화학회지
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• 제3권3호
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• pp.141-145
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• 2000

전도성이 뛰어난 피롤고분자 피막을 전기화학적으로 중합하고 이를 Gr/ppy(Polypyrrole),X.O.(xylenol orange)형의 수식된 전극을 제작하여 U(VI)의 포집에 이용하였다. 사전피막제인 NBR(nitrile butadiene rubber)을 사용하였을 때 중합속도는 $3.22\times10^{-3}s^{-1}$로 이를 사용하지 않았을 때 보다 1.6배 느린 반응이었다. 포집된 U(VI)의 양은 ppy $1.70Ccm^{-2}$ 당에 $1.55\times10^{-4}g$ 이었으며, 인공해수 중에서 matrix효과는 $6.8\%$로 나타났다. ppy전극이 Gr/ppy, $X.O^{4-}UO^+$형으로 수식됨에 따라서 피막자체의 임피던스가 증가하여 ppy만일 때의 확산에 지배적인 전도과정에서 피막자체의 전자전도와 이온도핑과정이 함께 영향을 받는 결과를 보였다. ppy전극을 X.O.로 수식하여 U(VI)를 포집함에 따라 전기이중층의 용량은 각각 56과 130여 배로 증가하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.79-79
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• 2013

Quantum-structures with nanoparticles have been attractive for various electronic and photonic devices [1,2]. In recent, nonvolatile memories such as nano-floating gate memory (NFGM) and resistance random access memory (ReRAM) have been studied using silicides, metals, and metal oxides nanoparticles [3,4]. In this study, we fabricated nonvolatile memories with silicides (WSi2, Ti2Si, V2Si) and metal-oxide (Cu2O, Fe2O3, ZnO, SnO2, In2O3 and etc.) nanoparticles embedded in polyimide matrix, and photovoltaic device also with SiC nanoparticles. The capacitance-voltageand current-voltage data showed a threshold voltage shift as a function of write/erase voltage, which implies the carrier charging and discharging into the metal-oxide nanoparticles. We have investigated also the electrical properties of ReRAM consisted with the nanoparticles embedded in ZnO, SiO2, polyimide layer on the monolayered graphene. We will discuss what the current bistability of the nanoparticle ReRAM with monolayered graphene, which occurred as a result of fully functional operation of the nonvolatile memory device. A photovoltaic device structure with nanoparticles was fabricated and its optical properties were also studied by photoluminescence and UV-Vis absorption measurements. We will discuss a feasibility of nanoparticles to application of nonvolatile memories and photovoltaic devices.

• Journal of Computing Science and Engineering
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• 제8권3호
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• pp.129-136
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• 2014

This paper presents the equivalent circuit modelling and eigenfrequency analysis of a wideband robust capacitive radio frequency (RF) microelectromechanical system (MEMS) switch that was designed using Poly-Si and Au layer membrane for highly reliable switching operation. The circuit characterization includes the extraction of resistance, inductance, on and off state capacitance, and Q-factor. The first six eigenfrequencies are analyzed using a finite element modeler, and the equivalent modes are demonstrated. The switch is optimized for millimeter wave frequencies, which indicate excellent RF performance with isolation of more than 55 dB and a low insertion loss of 0.1 dB in the V-band. The designed switch actuates at 13.2 V. The R, L, C and Q-factor are simulated using Y-matrix data over a frequency sweep of 20-100 GHz. The proposed switch has various applications in satellite communication networks and can also be used for devices that will incorporate the upcoming IEEE Wi-Fi 802.11ad protocol.

• 대한전자공학회논문지
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• 제26권6호
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• pp.131-139
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• 1989

본 논문에서는 CMOS 및 domino CMOS 의 특징과 PLA등 array logic의 특징을 동시에 살리면서 동작특성이 좋고 집적도가 높으며 테스트 생성이 쉬운 domino CMOS NOR-NOR array logic의 설계방식을 제안하였다. 이 방식은 pull-down 특성을 개선하여 기생 커패시턴트의 문제점을 해결하며 간단한 부가회로를 사용하여 회로내의 모든 고정들을 검출할 수 있도록 한 testable design 방식이다. PLA의 적항군의 개념 및 특성 행렬을 이용한 테스트 생성 알고리듬과 절차를 제안하였고 이를 PASCAL 언어로 실현하였다. 또한 SPICE 및 P-SPICE를 이용하여 본 설계방식에 대한 검증을 행하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1582-1584
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• 1996

The polycrystalline silicon thin film transistors (poly-Si TFT) are the most promising candidate for active matrix liquid crystal displays (AMLCD) for their high mobilities and current driving capabilities. The leakage current of the poly-Si TFT is much higher than that of the amorphous-Si TFT, thus larger storage capacitance is required which reduces the aperture ratio fur the pixel. The offset gated poly-Si TFTs have been widely investigated in order to reduce the leakage current. The conventional method for fabricating an offset device may require additional mask and photolithography process step, which is inapplicable for self-aligned source/drain ion implantation and rather cost inefficient. Due to mis-alignment, offset devices show asymmetric transfer characteristics as the source and drain are switched. We have proposed and fabricated a new offset poly-Si TFT by applying photoresist reflow process. The new method does not require an additional mask step and self-aligned ion implantation is applied, thus precise offset length can be defined and source/drain symmetric transfer characteristics are achieved.