• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05a
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• pp.169-172
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• 2005

공정시 플라스틱 기판의 변형을 방지하기 위해 PC(Polycarbonate) 기판을 약 12시간 동안 pre-annealing시킨 다음 SiN(silicon nitride)와 PI(Poly-imide)를 각각 Sputter와 Spin-Coater를 이용하여 Coating하였다. 완성된 PC 기판위에 Themal Evaporation으로 Calsium을 증착한 뒤 Al을 올렸다. Calsium 증착 된면에 삼성 코닝의 글래스를 UV resin으로 부착 시킨 다음 상온에서 투습률을 측정하였다. 측정 간격은 12시간으로 하였으며 Calsium Test 의 정확도 향상을 위해 CCD Camera로 측정하여 컴퓨터로 분석하였다. 그래픽 저장 파일은 저장시 이미지 손실을 방지하기 위해 Bitmap방식을 그대로 사용 하였으며 정확도 향상을 위한 분석 프로그램은 MicroSoft 사의 Visual C++로 작성하였다. 화상 처리 면적은 컴퓨터 시스템의 처리 속도를 감안하여 70*70 으로 하였다.

• 한국생물공학회:학술대회논문집
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• 2000.04a
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• pp.361-364
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• 2000

To remove nitrogen compound from wastewater six kinds of bacillus were isolated from sludge. Each bacillus was identified as B. subtillis $I{cdot}II$, B. cereus $I{cdot}II$, B. anthracis, B. circulans. The test of effect of nutrient and cofector on the nitrogen removal showed that peptone, yeast extract, magnesium, iron, and calsium accerated the efficiency of nitrogen removal. In syringe test aerobic nitrification and denitrification was occured.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).