• The Korean Journal of Ceramics
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• v.2 no.4
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• pp.203-211
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• 1996

CVD diamond tools are becoming more widely used in industry as an economic alternative to polycrystalline diamond (PCD) for machining non-ferrous and non-metallic materials. Although CVD diamond-sheet tools have been on the market for several years, diamond-coated carbide inserts have become available only recently, with the successful resolution of long-standing adhesion problems. Diamond coating morphology on the rake surface of the tool affects chip formation favorably, whereas a microscopically rough, faceted morphology on the flank surface of the tool produces a rough workpiece finish. Workpiece finish can be improved by using a coated tool with a larger nose radius. The tool life provided by diamond-coated tools(~30 $\mu\textrm{m}$ thick) can meet or exceed that of PCD tools, depending on the characteristics of the workpiece material. When using diamond-coated carbide tools in milling, a sharp-edged PCD tool should be used in the wiper position of the cutter to minimize workpiece roughness and burr formation.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.540-544
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• 1996

To apply the CVD diamond film to coated tools, it is necessary to make adhesion strength between diamond film and substrate stronger. So adhesion strength of diamond coated WC-Co tools using Microwave Plasma CVD and cutting test of Al-18mass%Si alloy using diamond cutting tools were studied. Diamond coating was carried out using Microwave Plasma CVD apparatus. Reaction gas was used mixture of methane and hydrogen. Substrate temperature were varied from 673K to 1173K by control of microwave output power and reaction pressure. By observation of SEM, grain size became larger and larger as substrate temperature became higher and higher. Also all deposits were covered with clear diamond crystals. XRD results, the deposits were identified to cubic diamond. An analysis using Raman spectroscopy, the deposit synthesized at lower substrate temperature (673K) showed higher quality than deposit synthesized at higher substrate temperature (1173K). As a result of scratch adhesion strength test, from 873K to 1173K adhesion strength decreased by rising of substrate temperature. The deposit synthesized at 873K showed best adhesion strength. In the cutting test of Al-18mass%Si alloy using diamond coated tools and the surface machinability of Al-Si works turned with diamond coating tools which synthesized at 873K presented uniform roughness. Cutting performance of Al-18mass%Si alloys using diamond coated WC-Co tools related to the adhesion strength.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.2
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• pp.75-80
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• 2021

The crystal grains of polycrystalline diamond vary depending on deposition conditions and growth thickness. The diamond thin film deposited by the CVD method has a very rough growth surface. On average, the surface roughness of a diamond thin film deposited by CVD is in the range of 1-100 um. However, the high surface roughness of diamond is unsuitable for application in industrial applications, so the surface roughness must be lowered. As the surface roughness decreases, the scattering of incident light is reduced, the heat conduction is improved, the mechanical surface friction coefficient can be lowered, and the transmittance can also be improved. In addition, diamond-coated cutting tools have the advantage of enabling ultra-precise machining. In this study, the surface roughness of diamond was improved by thermal diffusion reaction between diamond carbon atoms and ferrous metals at high temperature for diamond thin films deposited by MPCVD.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.395-400
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• 2005

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The damaged layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.39-46
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• 2006

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin mask layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The mask layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Journal of the Korean institute of surface engineering
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• v.46 no.2
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• pp.68-74
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• 2013

For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of $1{\mu}m$ thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, $2{\mu}m$ thick nanocrystalline diamond (NCD) films were deposited at $600^{\circ}C$ over the metal layers in a 2.45 GHz microwave plasma CVD system. The cross-sectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and $4{\mu}m$ with a fixed $2{\mu}m$ thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.2
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• pp.223-230
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• 2013

When a new nuclear fuel is developed, an irradiation test needs to be carried out in the research reactor to analyze the performance of the new nuclear fuel. In order to check the performance of a nuclear fuel during the irradiation test in the test loop of a research reactor, sensors need to be attached in and out of the fuel rod and connect them with instrumentation cables to the measuring device located outside of the reactor pool. In particular, to check the temporary temperature change at the center of a nuclear fuel during the irradiation test, a thermocouple should be instrumented at the center of the fuel rod. Therefore, a hole needs to be made at the center of fuel pellet to put in the thermocouple. However, because the hardness and the density of a sintered $UO_2$ pellet are very high, it is difficult to make a small fine hole on a sintered $UO_2$ pellet using a simple drilling machine even though we use a diamond drill bit made by electro deposition. In this study, an automated drilling machine using a CVD diamond drill has been developed to make a fine hole in a fuel pellet without changing tools or breakage of workpiece. A sintered alumina ($Al_2O_3$) block which has a higher hardness than a sintered $UO_2$ pellet is used as a test specimen. Then, it is verified that a precise hole can be drilled off without breakage of the drill bit in a short time.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1994.04c
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• pp.6-6
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• 1994

Har dmaterials such as cemented carbides with or without coated layer, cermets, ceramics and diamond or c-BN high pressure sintered compact are used for cutting tools, wear -resistant parts, rock drilling bits and/or high pressure vessels. These hardmaterials contain not only hard phase, but also second consituent as the element for forming ductile phase and/or sintering aid, and the mechanical properties of each material depend on (1) the amount of the second constituent as well as (2) the grain size of the hard phase. The hardness of each material mainly depends on these two factors. The fracture strength, however, largely depends on other microstructur a1 factors as well as the above two factors. For all hardmaterials, the fracture strength is consider ably affected by (3) the size of microstructur a1 defect which acts as the fracture source. In cemented carbides, the following factors which are generated mainly due to the addition of the second constituent are also important; (4) the variation of the carbon content in the normal phase region free from V-phase and graphite phase, (5) the precipitation of $Co_3$ during heating at about $800^{\circ}C$,(6) the domain size of binder phase, and (7) the formation of ${\beta}$-free layer or Co-rich layer near the surface of sintered compacts. For cemented carbides coated with thin hard substance, the important factors are as follows; (8) the kind of coated substance, (9) the formation of ${\eta}$-phase layer at the interface between coated layer and substrate, (10) the type of residual stress (tension or compression) in the coated layer which depends on the kind of coating method (CVD or PVD), and (11) the properties of the substrate, and (12) the combination, coherency and periodicity of multi-layers. In the lecture, the details of these factors and their effect on the strength will be explained.