• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.227-227
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• 2006

It was attempted to synthesize polyimides from PPMDA and 3FPPMDA with mDAPPO/pPDA in order to afford CTE of 17ppm and adhesion property of 80g/mm, besides high Tg (>$300^{\circ}C$), good thermal stability (>$500^{\circ}C$), low water absorption and good solubility. The polyimides were prepared via a conventional two-step process; preparation of poly(amic-acid), followed by solution imidization by refluxing in NMP with o-DCB and the molar ratio of mDAPPO/pPDA was varied. The polyimides were characterized by FT-IR, NMR, DSC and TGA. In addition, intrinsic viscosity, solubility and coefficient of thermal expansion (CTE) were also measured.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.126-129
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• 2001

LIPCA (LIghtweight Piezo-composite Curved Actuator) is an actuator device which is lighter than other conventional piezoelectric ceramic type actuator. LIPCA is composed of a piezoelectric ceramic layer and fiber reinforced light composite layers, typically a PZT ceramic layer is sandwiched by a top fiber layer with low CTE (coefficient of thermal expansion) and base layers with high CTE. LIPCA has curved shape like a typical THUNDER (thin-layer composite unimorph feroelectric driver and sensor), but it is lighter an than THUNDER. Since the curved shape of LIPCA is from the thermal deformation during the manufacturing process of unsymmetrically laminated lay-up structure, an analysis for the thermal deformation and residual stresses induced during the manufacturing process is very important for an optimal design to increase the performance of LIPCA. To investigate the thermal deformation behavior and the induced residual stresses of LIPCA at room temperature, the curvatures of LIPCA were measured and compared with those predicted from the analysis using the classical lamination theory. A methodology is being studied to find an optimal stacking sequence and geometry of LIPCA to have larger specific actuating displacement and higher force. The residual stresses induced during the cooling process of the piezo-composite actuators have been calculated. A lay-up geometry for the PZT ceramic layer to have compression stress in the geometrical principal direction has been designed.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.7-15
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• 2008

In this paper, the Chip-On-Flex (COF) assembly process using anisotropic conductive films (ACFs) was investigated and the reliability of COF assemblies using ACFs was evaluated. Thermo-mechanical properties of ACFs such as coefficient of thermal expansion (CTE), storage modulus (E'), and glass transition temperature $(T_g)$ were measured to investigate the effects of ACF material properties on the reliability of COF assemblies using ACFs. In addition, the bonding conditions for COF assemblies using ACFs such as time, temperature, and pressure were optimized. After the COF assemblies using ACFs were fabricated with optimized bonding conditions, reliability tests were then carried out. According to the reliability test results, COF assemblies using the ACF which had lower CTE and higher $T_g$ showed better thermal cycling reliability. Consequently, thermo-mechanical properties of ACFs, especially $T_g$, should be improved for high thermal cycling reliability of COF assemblies using ACFs for compact camera module (CCM) applications.

• Polymer(Korea)
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• v.37 no.5
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• pp.618-624
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• 2013

Hydroquinone bis(trimellitic anhydride) (HQ-TA) was synthesized from trimellitic anhydride chloride and hydroquinone. Poly(amic acid)s (PAAs) were synthesized by reacting a HQ-TA with six different diamines, which were cyclized to yield polyimides (PIs) containing ester linkages by chemical- and thermal-imidization methods. The various PIs were synthesized from structurally different aromatic diamines. The glass transition temperatures ($T_g$) were in the range of 167-$215^{\circ}C$, and the decomposition temperatures (${T_D}^i$) were in the range of $364-451^{\circ}C$. The maximum improvements in coefficient of thermal expansion (CTE) and barrier to oxygen permeation were observed in PIs using TFB (3.23 $ppm/^{\circ}C$) and 4,4-ODA (< $10^{-2}cc/m^2/day$), respectively. The PI films possessed a transmittance of 65-89% at 500 nm and had a yellowish color with a yellow index (YI) of 3.01-69.52.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.59-62
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• 2013

At an infra-red (IR) wavelength of 1,064 nm, a diode-pumped Q-switched $Nd:YVO_4$ laser was used for the direct patterning of various transparent conductive oxide (TCO) thin films on glass substrate. With various laser beam conditions, the laser ablation results showed that the indium tin oxide (ITO) film was removed completely. In contrast, zinc oxide (ZnO) film was not etched for any laser beam conditions and indium gallium zinc oxide (IGZO) was only ablated with a low scanning speed. The difference in laser ablation is thought to be due to the crystal structures and the coefficient of thermal expansion (CTE) of ITO, IGZO, and ZnO. The width of the laser-patterned grooves was dependent on the film materials, the repetition rate, and the scanning speed of the laser beam.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.2
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• pp.186-193
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• 2008

[ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.168-172
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• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.145-148
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• 2006

Cold gas dynamic spray is a relatively new coating process by which coatings can be produced without significant heating during the process. Cold gas dynamic spray is conducted by powder sprayed by supersonic gas jet, and generally called the kinetic spray or cold-spray. Cold-spray was developed in Russia in the early 1980s to overcome the defect of thermal spray method. Its low process temperature can minimize thermal stress and also reduce the deformation of the substrate. Most researches on cold-spray have focused on micro scale coating, but our research team tried to apply this method to macro scale deposition. The macro scale deposition causes deformation of a thin substrate which is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy and properties of deposited aluminum layer such as coefficient of thermal expansion, Elastic modulus, hardness, electric conductivity were measured. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

• Polymer(Korea)
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• v.35 no.6
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• pp.599-604
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• 2011

The PET-PEN copolymers have been synthesized and the effect of their morphology on the physical properties of polyester flexible substrate was investigated. It was found that the block sequence of synthesized copolymer was varied depending upon DMT/NDC ratio in polymerization. Higher PET-PEN and PEN block sequence in polyester copolymer resulted in the increase of glass transition temperature and it caused the enhancement of dimensional stability as a polyester flexible substrate. The highest coefficient of thermal expansion(CTE) was obtained when DMT/NDC ratio is 50/50. Synthesized PET-PEN copolymer seems to be acceptable as a flexible substrate since it shows that their optical transmittance at 550 nm is over 80% and thermal weight loss at $280^{\circ}C$ for 1 hr is less than 0.4 wt%.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.64-68
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• 2002

플립칩 공정에서는 반도체 칩과 기판사이의 열팽창계수(CTE : Coefficient of Thermal Expansion)의 차와 외적 충격과 같은 이유로 인해 피로균열(Fatigue crack)이나 치명적인 전기적 결함이 발생하게 된다. 이런 부정적인 요인들로부터 칩을 보호하고 신뢰성을 향상시키기 위해서 플립칩 언더필 공정이 적용되고 있다. 본 연구에서는 기존의 몰딩 공정을 응용한 플립칩 언디필 방법을 소개하였다. 공정 이론과 디바이스를 소개하였으며, 시뮬레이션 및 수식을 통하여 최적의 언더필을 위한 몰더 설계 조건을 구하였다. 그리고 본 연구를 통해 기대되는 공정의 장점을 제시하였다.