• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2043-2052
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• 2008

The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.414-418
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• 2001

Flow and thermal characteristics of cooling system for the robot controller were numerically as well as experimentally investigated. To obtain the overall flows within controller, the system level solutions were analysed at first and then the board level solutions were pursued to understand the detailed flow and temperature fields near the main board which have a significant influence on the cooling of electronic components. The evaluation for a performance of the heat exchanger was conducted on the basis of the obtained flow and temperature patterns. The results showed that the heat exchanger made a small contribution to the cooling of controller and caused an increase of the temperature in CPU.

• 대한기계학회논문집B
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• 제25권6호
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• pp.766-775
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• 2001

Parametric study to investigate the cooling performance of a notebook PC mounted with heat spreader has been numerically performed. Two cases of air-blowing and air-exhaust at inlet were tested. The cooling effect on parameters such as, inlet velocities in the cases of air-blowing and air-exhaust, materials of heat spreader, and CPU powers were simulated for two cases. Cooling performance in the case of air-blowing was better than the case of air-exhaust.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 전기학술대회논문집
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• pp.1108-1112
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• 2005

Recently, the fuel charge is accounted for very high in the navigation cost. Therefore Shipowner is tried to find method for reducing oil consumption. ERCS(Energy Reduced Cooling System) is one of the method. The ERCS algorithm operates to decrease a power consumption of main sea water cooling pump through inverter control. We have developed ERCS controller with algorithm. The ERCS controller consists of CPU board, Digital I/O board, A/D board, D/A board and LCD/SW board. We tested with dummy signal to confirm the algorithm working correctly and achieved the good results. Before soon we will test under real condition in the ship and expect to get the result as forecasted.

• 한국생산제조학회지
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• 제20권1호
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

• Journal of Advanced Marine Engineering and Technology
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• 제31권6호
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• pp.665-671
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• 2007

The purpose of this study is to find out a flow characteristics required by the design of a computer case and to provide information about the preliminary data of cooling efficiency of CPU and a flow inside of a case. We examined a flow characteristic-suction a tracing particle occurred from a surge tand installed at an inlet into a computer case and moving it to a exit duct-experimentally by using PIV. The experimental device was consists of a fan inflowing and discharging the air into the computer case and a slot installed with a CPU cooling ran add-on, and analyzed the data of Re-stress distribution, velocity distribution, and kinetic energy distribution. This research will make a great contribution to improvement of the efficiency and performance of notebook, workstation, server, and all the design of electronic devices using large scale integrated(LSI) as well as usual computers.

• 전자공학회논문지CI
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• 제47권6호
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• pp.57-67
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• 2010

본 논문에서는 멀티코아 프로세서 상에서 프로세서와 메모리를 집중적으로 사용하는 다양한 워크로드들에 대한 온도특성을 연구한다. 일반적으로 프로세서의 온도관리를 위한 측정 지표로 평균온도와 온도범위 보다는 온도변화의 정도가 더 중요하다. 따라서 본 논문에서는 프로그램 실행 중에 온도변화를 분석하고, 워크로드의 온도변화의 정도를 정량화하는 측정 지표를 제안한다. 제안된 온도변화 측정 지표를 사용하여 인텔 Core 2 Duo 프로세서 상의 SPEC CPU2006 벤치마크들에 대해 쿨링 조건 및 클럭 주파수를 변경해 가며 온도변화를 분석한다. 분석 결과, 각 벤치마크 프로그램에 따라 서로 다른 유형의 온도 변화를 보였다. 이러한 온도변화는 쿨링 조건과 동작 클럭 주파수 및 멀티프로그래밍 워크로드에 영향을 받았다. 또한 코아들 사이의 공간적 위치에 따라서도 다른 온도 변화 특성을 보였다. 본 논문에서 제안된 온도변화 측정 지표와 연구 분석된 결과들은 향후 멀티코아 온도관리를 위한 연구에 활용하면 효과적인 온도관리가 기대된다.

• Journal of Advanced Marine Engineering and Technology
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• 제29권5호
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• pp.587-592
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• 2005

The ESS(Energy Saving System) is designed to have functions of controlling. monitoring for cooling system. etc. ESS consists of the I/O module, CPU module and Display module I/O module detects various ESS data on local area and treats signals via I/O interface system. The interface system receives various status data and outputs control signals. ESS is tested with dummy signal to verify proposed functions and is shown good results. For future study ESS will be tested under real condition in the ship.

• 한국정보과학회:학술대회논문집
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• 한국정보과학회 2012년도 한국컴퓨터종합학술대회논문집 Vol.39 No.1(A)
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• pp.173-175
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• 2012

데이터 센터와 같은 대량의 서버를 사용하는 시설이 늘어남에 따라 전력 소모 관리와 열 발생 관리는 매우 중요한 문제가 되었다. 열 관리 연구들의 경우 대부분 열관리의 목적이 시스템의 오류를 방지하는 것이다. 하지만 열 관리에는 많은 전력 소모량이 사용된다. 따라서 열관리를 잘 해주는 것은 전력 관리를 효율적으로 해주는 것이라고 할 수도 있다. 본 논문은 열 관리를 전력 관리라는 측면에서 접근했다. 즉 열 관리에 사용되는 전력과 열로 인해 발생하는 전력을 고려해서 이를 최소화하는 냉각 제어 기법을 구현하였다. 우리가 개발한 냉각 제어 기법을 실제로 실험해서 기존의 냉각 기법과 비교해본 결과 전력 소모량을 17% 감소시키는 것을 확인 할 수 있었다.

• Journal of Advanced Marine Engineering and Technology
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• 제27권2호
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• pp.305-311
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• 2003

This Paper Presents an information about the heat transfer characteristics of a separate type thermosyphon in electronic equipments. The heat removal problem of electronic equipments is regarded as an important factor and a separate type heatpipes can be utilized as a cooling device of electronic equipments (such as CPU of a Personal computer or notebook). In this study. heat source ($50\times50\times2 mm $aluminum Pseudo CPU) was used for the experiment. The device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces) and the results indicate that the device is capable of dissipating over 60W of thermal energy and keeping the heating plate surface temperature under $50^{\circ}C$.