• The Korean Journal of Food And Nutrition
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• v.18 no.4
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• pp.316-324
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• 2005

The objectives of this study were to examine effect of ion chip and yellow soil on the growth and physicochemical characteristics of soybean sprouts. The weight and length increased rapidly in soybean sprouts cultivated for 4 days and then the increases slowed. Ascorbic acid increased rapidly after day 6 in soybean sprouts cultivated with ionized water (I.W), $1.0\%$ yellow soil in tap water (T.W+l.0) and $1.0\%$ yellow soil in ionized water (I.W+l.0). The detected content of minerals such as Mg, Ca, K and Fe in soybean sprouts was higher than other minerals. Iron content was the highest in soybean sprouts cultivated by I.W+1.0. The detected levels of glutamic acid in soybean sprouts cultivated for 4 days with ionized water was higher than in those grown with tap water. In all soybean sprouts, nucleotides such as UMP, CMP, AMP, Hx and soluble free sugars like sucrose, raffinose, stachylose were detected, and the levels of UMP were found to be the highest among nucleotides and sucrose among free sugars.

• Journal of The Korean Society of Grassland and Forage Science
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• v.17 no.4
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• pp.323-328
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• 1997

Com(Zea mays L.) hybrid is recognized as the principal cmp in a double-cmpping system. Rye(Secale cereale L.), seeded after corn hybrid harvest, is the second crop in the system. Under this forage production system, corn planting is mostly delayed beyond mid-May due to delayed rye harvest on May, but the corn should be harvested until mid-August before the autumn rain started. It is for this reason that early maturing corn hybrids are preferred for silage crops in this system. Twenty eight cultivars of early maturing corn hybrids evaluated in this experiment at three locations (Suweon, Sunghwan and Cheju) for 3 yr(1994-1996) were compared for agronomic characteristics, forage yield and quality. Among the com hybrids tested, DUO1 and GL499 were recommended as the government superior corn hybrids due to their promising agronomic traits, such as short plant and ear heights, adquate dry matter percentage for silage on mid-August, good staygreen along with good lodging and disease resistance, better ear retention, similar yield compared to the control hybrid, Suweon 19 and above average stover quality.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.4
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• pp.309-317
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• 2000

Langasite is a promising new piezoelectric material for SAW filter application. Little was known until recently about the methods needed to mechanically polish and chemically polish/etch this material. In this experiment, polishing, slurry chemistry and chemical wet etching for langasite is described. Conventional quartz and LN ($LiNbO_3$) polishing methods did not produce satisfactory polished surfaces, and polishing with a colloidal silica slurries has shown to be most effective. The optimum condition was investigated by changing the slurry chemistry. As the planarization effect is very important in SAW filter applications, the examination of the effective particle number effect and the particle size effect was carried out. Z-cut langasite surface which had been polished with the colloidal silica slurries was etched in a variety of etchants. Conventional quartz etchants destroyed the polished surface. Other etchants formed a thin film on the surfaces. In this experiment, the reaction between langasite and a few etching solution was analysed. And an appropriate selective etchant solution for analyzing the defects was synthesized.

• Journal of Pharmaceutical Investigation
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• v.20 no.2
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• pp.89-95
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• 1990

Ethylcellulose-PEG 4000 film coated on core tablets was investigated as a potential drug delivery system for the controlled release of chlorpheniramine maleate (CPM). The kinetic analysis of the release data indicated that CPM release followed a diffusion-controlled model, where the quantity released per unit area is proportional to the square root of time. The effect of the film composition, CPM concentration, plasticizer concentration and CPM solubility on the release characteristics were examined. The release rate constant increased as CPM concentration increased. It also increased as the PEG 4000 content in the film increased above 10%(w/w), however, it decreased as the PEG 4000 content increased in the concentration range below 10%(w/w). The release rate constant was not affected by the coated weight on the core tablet. The film-coated tablets which contain CPM only in the coated film layer seemed to be a potential oral drug delivery system for the controlled release of CPM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.49-49
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• 2009

최근 범세계적인 그린에너지 정책에 관련해 화석연료를 대체할 수 있는 수소, 풍력, 태양광 등의 대체 에너지에 대한 관심이 고조되고 있다. 이러한 여러 대체에너지 중에서도 태양광을 전기에너지로 변환하는 태양전지에 관한 연구가 집중되고 있다. 태양전지는 구조적으로 단순하고 제조 공정도 비교적 간단하지만, 보다 널리 보급되기 위해서는 경제성 향상이라는 문제점을 해결해야 한다. 이를 위해서는 기존의 실리콘 태양전지를 대체할 수 있는 신물질에 대한 연구가 필요하며, 그 중에서도 반도체 기술을 이용한 박막형 태양전지는 기존의 실리콘 태양 전지가 가지고 있는 고비용이라는 문제점을 극복할 수 있을 것으로 기대를 모으고 있다. 박막형 태양전지의 박막 재료로는 CIGS, CdTe 등이 연구되어지고 있지만, 아직까지는 기존의 실리콘 태양전지에 비해 에너지변환효율이 낮은 이유로 인해 실용화가 많이 이루어지지 못하고 있는 것이 사실이다. 이러한 박막형 태양전지의 재료들 중에서도 CdTe는 이종접합 박막형 태양전지에 흡광층으로 사용되는 것으로 상온에서 1.45eV 정도의 밴드갭(band gap) 에너지를 갖는 II-VI족 화합물반도체로써 태양광 스펙트럼과 잘 맞는 이상적인 밴드랩 에너지와 높은 광흡수도 때문에 박막형 태양전지로 가장 주목을 받고 있다. CdTe 박막의 제조 방법으로는 진공증착법(vacuum evaporation), 전착법(electrodeposition), 스퍼터링법(sputtering) 등이 있지만 본 연구에서는 스퍼터링법을 이용하여 박막을 증착하였다. 이상과 같이 증착된 CdTe 박막을 화학적기계적연마(CMP, chemical mechanical polishing) 공정을 적용시킴으로써, 태양전지의 에너지변환효율에 직접적인 영향을 끼칠 수 있는 CdTe 박막의 물리적, 전기적 특성들의 변화를 연구하기 위한 선행 연구를 진행하였다. 특히 본 연구에서는 CdTe 박막의 화학적 기계적 연마 특성을 분석하여 정규화를 통한 모델링을 수행하였다. 또한 화학적기계적연마 공정 전과 후의 표면 특성을 관찰하기 위해 SEM(scanning electron microscopy)과 AFM(atomic forced microscope)를 이용하였으며, 구조적 특성 관찰을 XRD(X-ray diffraction)를 사용하여 실험을 수행하였다.

• 한국지구물리탐사학회:학술대회논문집
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• 2008.10a
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• pp.107-112
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• 2008

In the case of the deep reservoirs like the gas reservoirs in the East-sea, it is often difficult to observe AVO responses in CMP gathers. Because the reservoir becomes more consolidated as its depth deepens, P-wave velocity does not decrease significantly when the pore fluid is replaced by the gas. In this study, we analyzed the effects of Poisson's ratio difference on AVO response with a variety of Poisson's ratios for the upper and lower layers. The results show that, as the difference in Poisson's ratio between the upper and lower layers decreases, the change in the reflection amplitude with incidence angle decreases. To consider the limitation of AVO responses shown in the gas reservoir in East-sea, the velocity model was made by simulation Gorae V structure with seismic data and well logs. The results of comparing AVO responses observed from the synthetic data with theoretical AVO responses calculated by using material properties show that the amount of the change in reflection amplitude with increasing incident angle is very small when the difference in Poisson's ratio between the upper and lower layers is small. In addition, the characteristics of AVO responses were concealed by noise or amplitude distortion arisen during preprocessing. To overcome such limitations of AVO analysis of the data from deep reservoirs, we need to acquire precisely reflection amplitudes in data acquisition stage and use processing tools which preserve reflection amplitude in data processing stage.

• Tribology and Lubricants
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• v.32 no.2
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• pp.61-66
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• 2016

Total thickness variation (TTV), BOW, and surface roughness are essential characteristics for high quality sapphire substrates. Many researchers have attempted to increase removal rate by controlling the key process parameters like pressure and velocity owing to the high cost of consumables in sapphire chemical mechanical polishing (CMP). In case of the pressure approach, increased pressure owing to higher deviation of pressure over the wafer leads to significant degradation of the TTV. In this study, the authors focused on reducing TTV under the high-pressure conditions. When the production equipment polishes multiple wafers attached on a carrier, higher loads seem to be concentrated around the leading edge of the head; this occurs because of frictional force generated by the combination of table rotation and the height of the gimbal of the polishing head. We believe the skewed pressure distribution during polishing to be the main reason of within-wafer non-uniformity (WIWNU). The insertion of a hub ring between the polishing head and substrate carrier helped reduce the pressure deviation. Adjusting the location of the hub ring enables tuning of the pressure distribution. The results indicated that the position of the hub ring strongly affected the removal profile, which confirmed that the position of the hub ring changes the pressure distribution. Furthermore, we analyzed the deformation of the head via finite element method (FEM) to verify the pressure non-uniformity over the contact area Based on experiment and FEM results, we determined the optimal position of hub ring for achieving uniform polishing of the substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.360-361
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• 2005

Rapid progress in IC fabrication technology has strong demand in polishing of silicon wafer to meet the tight specification of nanotopography and surface roughness. One of the important issues in Si CMP is the stabilization of polishing pad. If a polishing pad is not stabilized before main Si wafer polishing process, good polishing result can not be expected. Therefore, new pad must be subjected into break-in process using dummy wafers for a certain period of time to enhance its performance. After the break-in process, the main Si wafer polishing process must be performed. In this study, the characteristics of break-in process were investigated in Si wafer polishing. Viscoelastic behavior, temperature variation of pad and friction were measured to evaluate the break-in phenomenon. Also, it is found that the characteristic of the break-in seems to be related to viscoelastic behavior of pad.

• Korean Journal of Food Science and Technology
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• v.27 no.5
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• pp.724-728
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• 1995

Chemical compositions of dried Auricularia polytricha mushroom were analyzed when the dried mushroom were soaked in distilled water at different soaking condition. Physicochemical properties of soaked mushroom were investigated. Compositions of chemical components were 12.6% crude protein, 2.1% crude fat, 6.7% crude fiber and 6.2% ash. The contents of Ca, K, Mg were higher than those of other minerals in the sample, but Mn and Ni were of little quantities. The major amino acids of the sample were found to be aspartic and glutamic acid. The increase in the soaking time and temperature increased the ratio of water uptake, amount of water soluble solid, browning and pH value in the soak water. Ribonucleotide contents of the sample after soaking decreased depending on soaking time and temperature.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.224-232
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• 2000

Aluminum metal process in surface micromachining enables to fabricate Al electrodes or Al structures, which improve electrical characteristics by reducing contact- and line-resistance or makes the whole process to be simple by using oxide as sacrificial layer. However, it is not possible to use conventional sacrificial layer etching process, because HF solution attacks aluminum as well as sacrificial oxide. The mixed solution of BHF and glycerine as an alternative shows the adequate properties to meet with this end. The exact etching properties, however, are sensitively depends on the geometry of the released structure, because the most etching process of sacrificial layer proceeds to the lateral direction in narrow space. Also, the surface roughness of aluminum affects to the etching characteristics. This paper reports experimental results on the effect of microstructure and surface roughness of aluminum to the etching properties. Considering these effects, we propose the optimized etching condition, which can be used practically for the fabrication of aluminum electrodes and microstructures by using standard surface micromachining process without modification or additional process.