• Proceedings of the IEEK Conference
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• 2000.07a
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• pp.347-350
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• 2000

We present the design of ternary flip-flop which is based on ternary logic so as to process ternary data. These flip-flops are fabricated with ternary voltage mode NOR, NAND, INVERTER gates. These logic gate circuits are designed using CMOS and obtained the characteristics of a lower voltage, a lower power consumption as compared to other gates. These circuits have been simulated with the electrical parameters of a standard 0.25 micron CMOS technology and 2.5 volts supply voltage. The Architecture of proposed ternary flip-flop is highly modular and well suited for VLSI implementation, only using ternary gates.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.22-25
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• 2005

In this research, a wafar-level transfer method of cantilever array on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.

• Transactions on Electrical and Electronic Materials
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• v.12 no.5
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• pp.175-188
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• 2011

As complementary metal-oxide semiconductor (CMOS) continues to scale down deeper into the nanoscale, various device non-idealities cause the I-V characteristics to be substantially different from well-tempered metal-oxide semiconductor field-effect transistors (MOSFETs). The last few years witnessed a dramatic increase in nanotechnology research, especially the nanoelectronics. These technologies vary in their maturity. Carbon nanotubes (CNTs) are at the forefront of these new materials because of the unique mechanical and electronic properties. CNTFET is the most promising technology to extend or complement traditional silicon technology due to three reasons: first, the operation principle and the device structure are similar to CMOS devices and it is possible to reuse the established CMOS design infrastructure. Second, it is also possible to reuse CMOS fabrication process. And the most important reason is that CNTFET has the best experimentally demonstrated device current carrying ability to date. This paper discusses and reviewsthe feasibility of the CNTFET's application at this point of time in integrated circuits design by investigating different types of circuit blocks considering the advantages that the CNTFETs offer.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.571-574
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• 2008

In this paper, we propose $256{\times}256$ pixel array fingerprint sensor with an advanced circuits for detecting. The pixel level simple detection circuit converts from a small and variable sensing current to binary voltage out effectively. We minimizes an electrostatic discharge(ESD) influence by applying an effective isolation structure. The sensor circuit blocks were designed and simulated in standard CMOS $0.35{\mu}m$ process. Full custom layout is performed in the unit sensor pixel and auto placement and routing is performed in the full chip.

• Journal of IKEEE
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• v.8 no.1 s.14
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• pp.12-21
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• 2004

Error control is one of major concerns in many electronic systems. Experience shows that most malfunctions during system operation are caused by transient faults, which often mean abnormal signal delays that may result in violations of circuit element timing constraints. This paper presents a novel CMOS-based concurrent timing error detector that makes a flip-flop to sense and then signal whether its data has been potentially corrupted or not by a setup or hold timing violation. Designed circuit performs a quiescent supply current evaluation to determine timing violation from the input changes in relation to a clock edge. If the input is too close to the clock time, the resulting switching transient current in the detection circuit exceeds a reference threshold at the instant of the clock transition and an error is flagged. The circuit is designed with a $0.25{\mu}m$ standard CMOS technology at a 2.5 V supply voltage. The validity and effectiveness are verified through the HSPICE simulation. The simulation results in this paper shows that designed circuit can be used to detect setup and hold time violations effectively in clocked circuit element.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.1
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• pp.25-29
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• 2002

There is an increasing interest in high-speed signal processing in modern telecommunication and SC circuit, HDTV, ISDN. There are many methods of high-speed signal processing. This paper describes a design approach for the realization of high-frequency Op-amp in CMOS technology. A limiting factor in Op-amp based analog integrated circuits is the limited useful frequency range. this thesis will develop a CMOS op-amp architecture with improved gainband width product with this technique an op-amp will achieve up to 170MHz (CL=2pF) unity-gain frequency with a 1.2-micron design rule. This CMOS op-amp is particularly suitable for achieving wide and stable closed-loop band widths, such as required in high-frequency SC filters, high-speed analog circuits.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1516-1517
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• 2007

This paper investigated the breakdown effect of the CMOS device by impact of high power electromagnetic wave. The experiments employed a waveguide to study the current characteristics of CMOS device broken by high power electromagnetic wave. The CMOS device were composed of a LED drive circuit for visual discernment. Also CMOS device broken by high power electromagnetic wave was observed by power current. The CMOS device were broke by high power electromagnetic wave at about 10 kV/m and when power current is 75 mA. Based on the result, CMOS devices should show plan to protect the CMOS devices by high power electromagnetic wave. And the database from this experiment should provide the basis for future investigation.

• ETRI Journal
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• v.29 no.1
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• pp.59-69
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• 2007

We designed and fabricated a vision chip for edge detection with a $160{\times}120$ pixel array by using 0.35 ${\mu}m$ standard complementary metal-oxide-semiconductor (CMOS) technology. The designed vision chip is based on a retinal structure with a resistive network to improve the speed of operation. To improve the quality of final edge images, we applied a saturating resistive circuit to the resistive network. The light-adaptation mechanism of the edge detection circuit was quantitatively analyzed using a simple model of the saturating resistive element. To verify improvement, we compared the simulation results of the proposed circuit to the results of previous circuits.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.6
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• pp.2707-2712
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• 2011

In this paper, a power factor correction (PFC) control circuit using single stage boundary conduction mode(BCM) for the 400V. 120W LED drive application has been designed. The proposed control circuit is aimed for improvement of the power factor correction and reduction of the total harmonic distortion. In this circuit, a new CMOS multiplier structure is used instead of a conventional BJT(bipolar junction transistor) based multiplier where has a relatively large area. The CMOS multiplier can bring 30 % reduced chip area, competitive die cost in comparison with the conventional BJT multiplier.

• Journal of IKEEE
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• v.15 no.3
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• pp.205-210
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• 2011

A novel hysteresis tunable monolithic comparator circuit based on a 0.35 ${\mu}m$ CMOS process is suggested in this paper. To tune the threshold voltage of the hysteresis in the comparator circuit, two external digital bits are used with supply voltage of 3.3V. The threshold voltage of the suggested comparator circuit is controlled by 234mV by change of 4 digital control bits in the simulation, which is a close agreement to the analytic calculation.