• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.1
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• pp.87-96
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• 2019

Flexible organic light-emitting diode (OLED) displays with organic thin-film transistors (OTFTs) backplanes have been studied. A gate driver is required to drive the OLED display. The gate driver is integrated into the panel to reduce the manufacturing cost of the display panel and to simplify the module structure using fabrication methods based on low-temperature, low-cost, and large-area printing processes. In this paper, pseudo complementary metal oxide semiconductor (CMOS) logic gates are implemented using OTFTs for the gate driver integrated in the flexible OLED display. The pseudo CMOS inverter and NAND gates are designed and fabricated on a flexible plastic substrate using inkjet-printed OTFTs and the same process as the display. Moreover, the operation of the logic gates is confirmed by measurement. The measurement results show that the pseudo CMOS inverter can operate at input signal frequencies up to 1 kHz, indicating the possibility of the gate driver being integrated in the flexible OLED display.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.569-572
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• 2014

This paper presents a CMOS switched-capacitor interface circuit for MEMS capacitive sensors. It consist of a capacitance to voltage converter(CVC), a second-order ${\Sigma}{\Delta}$ modulator, and a comparator. A bias circuit is also designed to supply constant bias voltages and currents. This circuit employes the correlated-double-sampling(CDS) and chopper-stabilization(CHS) techniques to reduce low-frequency noise and offset. The designed CVC has a sensitivity of 20.53mV/fF and linearity errors less than 0.036%. The duty cycle of the designed ${\Sigma}{\Delta}$ modulator output increases about 5% as the input voltage amplitude increases by 100mV. The designed interface circuit shows linearity errors less than 0.13%, and the current consumption is 0.73mA. The proposed circuit is designed in a 0.35um CMOS process with a supply voltage of 3.3V. The size of the designed chip including PADs is $1117um{\times}983um$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.267-270
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• 2014

This paper presents a CMOS interface circuit for vibration energy harvesting. The proposed circuit consists of an AC-DC converter and a DC-DC boost converter. The AC-DC converter rectifies the AC signals from vibration devices(PZT), and the DC-DC boost converter generates a boosted and regulated output at a predefined level. A full-wave rectifier using active diodes is used as the AC-DC converter for high efficiency, and a schottky diode type DC-DC boost converter is used for a simple control circuitry. A MPPT(Maximum Power Point Tracking) control is also employed to harvest the maximum power from the PZT. The proposed circuit has been designed in a 0.35um CMOS process. The chip area is $530um{\times}325um$. Simulation results shows that the maximum efficiencies of the AC-DC converter and DC-DC boost converter are 97.7% and 89.2%, respectively. The maximum efficiency of the entire system is 87.2%.

• ETRI Journal
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• v.27 no.5
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• pp.539-544
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• 2005

An analog CMOS vision chip for edge detection with power consumption below 20mW was designed by adopting electronic switches. An electronic switch separates the edge detection circuit into two parts; one is a logarithmic compression photocircuit, the other is a signal processing circuit for edge detection. The electronic switch controls the connection between the two circuits. When the electronic switch is OFF, it can intercept the current flow through the signal processing circuit and restrict the magnitude of the current flow below several hundred nA. The estimated power consumption of the chip, with $128{\times}128$ pixels, was below 20mW. The vision chip was designed using $0.25{\mu}m$ 1-poly 5-metal standard full custom CMOS process technology.

• Journal of Korea Society of Industrial Information Systems
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• v.18 no.5
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• pp.19-23
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• 2013

This paper deals with the analysis of 6T SRAM cell stability for Hi-speed processing Ternary Content Addressable Memory. The higher the operation frequency, the smaller CMOS technology required in the designed TCAM because the purpose of TCAM is high-speed data processing. Decrease of Supply voltage is one cause of unstable TCAM operation. Thus, We should design TCAM through analysis of SRAM cell stability. In this paper we propose methodology to characterize the Static Noise Margin of 6T SRAM. All simulations of the TCAM have been carried out in 180nm CMOS process technology.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.796-800
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• 2004

The main research on this paper is to model on-chip inductor in digital CMOS technology by using the foundry parameters and the physical structure. The s-parameters of a spiral inductor are extracted from the modeled equivalent circuit and then compared to the results obtained from HFSS. The structure and material of the inductor used for modeling in this work is identical with those of the inductor fabricated by CMOS process. To show why the modeled inductor instead of ideal inductor should be used to design a RF system, we designed dual band RF front-end receiver and then compared the results between when using the ideal inductor and using the modeled inductor.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.4
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• pp.50-59
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• 1998

This paper describes a 3.3V 8bit CMOS digital to analog converter (DAC) with two state current cell metrix architecture which consists of a 4 MSB and a 4 LSB current matrix stage. The symmetric two stage current cell matrix architecture allow the designed DAC to reduce hot only a complexity of decoding logics, but also a number of wider swing cascode curent mirros. The designed DAC with an active chip area of 0.8 mm$_{2}$ is fabricated by a 0.8 .mu.m CMOS n-well standard digital process. The experimental data shows that the rise/fall time, the settling time, and INL/DNL are6ns, 15ns, and a less than .+-.0.8/.+-.0.75 LB, respectively. The designed DAC is fully operational for the power supply down to 2.0V, such that the DAC is suitable for a low voltage and a low power system application. The power dissipation of the DAC with a single power supply of 3.3V is measured to be 34.5mW.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.77-86
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• 1998

A two-chip humidity sensor system has been developed which consists of a capacitive sense element die and a CMOS interface chip. The sense element was fabricated using thin polyimide films on (100) silicon substrate and showed excellent linearity(0.72%FS), low hysteresis (<3%) and low temperature coefficient(-0.0285 ~-0.0542pF/K) over a wide range of relative humidity and temperature. The capacitance-relative humidity characteristic exhibited a drift of 2~3% after 9 weeks of exposure to 4$0^{\circ}C$/90%RH. The signal-conditioning circuitry was fabricated using an 1.2- ${\mu}{\textrm}{m}$, one poly double metal CMOS process. The measured output voltage of the sensor system was directly proportional to relative humidity and showed good agreement with theory.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.11
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• pp.56-64
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• 2007

We developed the first automatic design system targeting a promising hybrid CMOS-Nanoelectronics Architecture called CMOL. The CMOL architecture uses NOR gates to implement combinational logic. In this hybrid CMOS-nanoelectronics architecture, logical functions and the interconnections share the nanoelectronics hardware resource. Towards automating the CMOL physical design process, we developed a model for the CMOL architecture, formulated the placement and routing problems for the CMOL architecture subject to the unique CMOL specific constraints, and solved it by combining a placement algorithm with a gate assignment algorithm in a loop. We validated the proposed approach by implementing several industrial strength designs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.2
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• pp.103-110
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• 2001

Gate oxide scaling for sub-l00nm CMOS devices has been studied. Issues on the gate oxide scaling are reviewed, which are boron penetration, reliability, and direct tunneling leakage currents. Reliability of Sub-2.0nm oxides and the device performance degradation due to boron penetration are investigated. Especially, the effect of gate leakage currents on the transistor characteristics is studied. As a result, it is proposed that thinner oxides than previous expectations may be usable as scaling proceeds. Based on the gate oxide thickness optimization process we have established, high performance CMOS transistors of $L_{gate}=70nm$ and $T_{ox}=1.4nm$ were fabricated, which showed excellent current drives of $860\mu\textrm{A}/\mu\textrm{m}$ (NMOS) and $350\mu\textrm{A}/\mu\textrm{m}$ (PMOS) at $I_{off}=10\mu\textrm{A}/\mu\textrm{m}$ and $V_dd=1.2V$, and CV/I of 1.60ps (NMOS) and 3.32ps(PMOS).