• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2002년도 학술대회 논문집
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• pp.101-104
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• 2002

The influences of the powder packing density on the Bi-2223/Ag tape have been investigated. For packing powder, both method of uniaxial press and packed rod form made by cold isostatic press(CIP) have been applied. As the pressure of cold isostatic press(CIP) is increased, fill factor and critical current (Ic) of Bi-2223/Ag tape is increased. At a pressure of 2000kgf/cm$^2$, fill factor reach ∼3l% and this sample has the engineering current density(Je) value of ∼8.5kA/cm$^2$(Ic ∼77A, Jc ∼ 30kA/cm$^2$). The tape sample packed by uniaxial press method shows more sawsaging effect than the sample processed by cold isostatic press(CIP), resulting from inhomogity of powder distribution produced by the process of uniaxial press.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.245-248
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• 소성∙가공
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• 제14권6호
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.243-246
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• 2006

In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.220-224
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• 2005

The technology trend of Flat Panel Display (FPD) equipments have been demanded that there are compact and multi-function. Therefore, nano/micro scale patterned on polymeric materials of Back Light Unit (BLU) in Liquid Crystal Display (LCD) that has been investigated. This paper describes a series of Horizontal Type Micro Tensile Tester that were carried out to investigate the load strain distance performance of typical polymeric material sheets. The polymeric materials film that micro size shaped specimens for tensile test are used by Cold-Isostatic-Press (CIP). Test equipment is Horizontal type Micro Tensile Tester that is presented to measure the micro scale mechanical property of thin film for FPD. This paper presents which easy testing tools measure for micro patterned on polyethylene (PET) specimens.

• 한국재료학회지
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• 제12권8호
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• pp.634-640
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• 2002

To improve the ductility of mTEX>$(Al +12.5%Cu)<_3$Zr intermetallics, which are the potential high temperature structural materials, the mechanical alloying behavior, the effect of pressure and temperature on the $Ll_2$, phase formation and the behavior of the cold isostatic press and sintering were investigated. However mechanically alloyed A1$_3$Zr alloy have been known to have high mechanical strength even at high temperature, its workability was poor. A method of solution is refined grain size and phase transformation from $DO_{23}$ to $Ll_2$.$ Ll_2$ structure TEX>$(Al+12.5%Cu)<_3$Zr with nanocrystalline microstructure intermetallic powders where were prepared by mechanical alloying of elemental powders. Grain sizes of the as milled powders were less than 10nm (from transmission electron microscopy, TEM). Thermal analyses showed that $Ll_2$ structure was stable up to$ 800^{\circ}C$ for 1hour $(Al+ 12.5%Cu)<_3$Zr. $(Al+12.5%Cu)<_3$Zr has been consolidated by cold isostatic pressing (CIP 138, 207, 276, 414MPa) at room temperature and subsequent heat treatment at high temperatures where $Ll_2$ structure was stable under vacuum atmosphere. The results showed that 94.2% density of Ll$_2$ compacts was obtained for the (Al +12.5%Cu)$_3$Zr by sintering at 80$0^{\circ}C$ for 1hour (under CIPed 207MPa). This compact of the grain size was 40nm.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.1428-1429
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• 2011

This paper variation of stranded cable conductor with CIP(Cold Isostatic Press) technology. Conductor as cable material takes majority costs. Thus many experiments have been done on conductor compaction. The core technology is to maintain the resistance of circular stranded conductor after compaction process, while reducing the weight of conductor diameter, but by increasing filling factor. Testing by varying the compaction ratio using 300SQ conductor, conductor after CIP process shows lower resistance rather than conductor before CIP process.

• 방사성폐기물학회지
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• 제16권1호
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• pp.123-136
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• 2018

본 연구의 목적은 고준위폐기물 처분기술 개발과 관련하여 현장실증 연구를 위해 사용될 공학규모 이상의 균질 완충재 블록을 제작하기 위한 새로운 방법론을 제시하는 것이다. 이와 관련하여 플롯팅 다이(floating die) 방식의 프레스 재하 및 냉간등방압프레스(CIP; Cold Isostatic Press) 기법을 국내 최초로 완충재 제작에 적용하였다. 또한 소요 밀도기준을 충족하는 완충재 블록을 생산하기 위한 최적의 제작조건(프레스 및 CIP의 소요 압력)과 현장 적용성을 분석하였다. 상기 기법의 적용을 통해 완충재 블록 내 밀도분포 편차가 현저히 감소하였으며, 이와 동시에 평균 건조밀도가 소폭 상승하고 약 5%의 크기가 감소하였다. 또한 CIP 적용을 통해 응력이완(stress release) 현상이 감소하고, 이로 인해 시간 경과에 따른 표면균열 발생이 현저히 저감됨을 시험제작을 통해 확인하였다. 본 연구에서 제시된 방법론은 공학규모 이상의 균질한 완충재 블럭을 성형할 수 있으며, 또한 이는 선진핵주기 고준위폐기물처분시스템(AKRS; Advanced Korea Reference Disposal System of HLW)의 완충재 소요 밀도기준을 충족하는 것으로 분석되었다.

• 한국전기전자재료학회논문지
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• 제32권4호
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• pp.333-340
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• 2019

The effects of compaction methods on the sintering density, microstructures, and mechanical properties were investigated in ${\alpha}-alumina$ ceramics. ${\alpha}-Alumina$ powders were granulated with a 10% aqueous solution of polyvinyl alcohol (PVA). Uniaxially pressed (UAP) and cold isostatic-pressed (CIP) samples were prepared by pressing uniaxially at a pressure of 1 ton for 1 min, and isostatically at 200 MPa for 15 min, respectively. Subsequently, both types of samples were sintered at $1,200^{\circ}C$, $1,300^{\circ}C$, $1,400^{\circ}C$, $1,450^{\circ}C$, $1,500^{\circ}C$, $1,550^{\circ}C$, and $1,600^{\circ}C$ at a rate of $5^{\circ}C/min$ for 2 h. The CIP samples were better than the UAP samples for all properties measured, such as the sintering density, Vicker's hardness, and toughness. The CIP sample sintered at $1,400^{\circ}C$ showed the maximum Vicker's hardness and toughness; this may be attributed to the competing effects of a decrease in porosity and the growth of grains with increasing sintering temperature.

• 한국재료학회지
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• 제13권4호
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• pp.205-212
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• 2003

RF sputtering process was applied to produce thin hydroxyapatite［HA, Ca10($PO_4$)$_{6}$ $ (OH)_2$films on Ti-6Al-4V alloy substrates. To make a 101.6 mm dia.${\times}$5 mm HA target, the commercial HA powder was first calcinated for 3h at $200^{\circ}C$. A certain amount of the calcinated HA powder was pressed under a pressure of 20,000 psi by the cold isostatic press(CIP) and the pressed HA target was sintered for 6 h at $1,200^{\circ}C$. The effects of different heat treating conditions on the bonding strength between HA thin films and Ti-6Al-4V alloy substrates were studied. Before deposition, the alloy substrates were annealed for 1 h at $850^{\circ}C$ under $3.0${\times}$10^{-3}$ Xtorr, and after deposition, the hydroxyapatite/Ti-6Al-4V alloy thin films were annealed for 1 h at 400, 600 and $800^{\circ}C$ under the atmosphere, respectively. Experimental results represented that the HA thin films on the annealed substrates had higher hardness than non-heat treated substrates before the deposition.