• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.101-104
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• 2002

The influences of the powder packing density on the Bi-2223/Ag tape have been investigated. For packing powder, both method of uniaxial press and packed rod form made by cold isostatic press(CIP) have been applied. As the pressure of cold isostatic press(CIP) is increased, fill factor and critical current (Ic) of Bi-2223/Ag tape is increased. At a pressure of 2000kgf/cm$^2$, fill factor reach ∼3l% and this sample has the engineering current density(Je) value of ∼8.5kA/cm$^2$(Ic ∼77A, Jc ∼ 30kA/cm$^2$). The tape sample packed by uniaxial press method shows more sawsaging effect than the sample processed by cold isostatic press(CIP), resulting from inhomogity of powder distribution produced by the process of uniaxial press.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.245-248
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.243-246
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• 2006

In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.220-224
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• 2005

The technology trend of Flat Panel Display (FPD) equipments have been demanded that there are compact and multi-function. Therefore, nano/micro scale patterned on polymeric materials of Back Light Unit (BLU) in Liquid Crystal Display (LCD) that has been investigated. This paper describes a series of Horizontal Type Micro Tensile Tester that were carried out to investigate the load strain distance performance of typical polymeric material sheets. The polymeric materials film that micro size shaped specimens for tensile test are used by Cold-Isostatic-Press (CIP). Test equipment is Horizontal type Micro Tensile Tester that is presented to measure the micro scale mechanical property of thin film for FPD. This paper presents which easy testing tools measure for micro patterned on polyethylene (PET) specimens.

• Korean Journal of Materials Research
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• v.12 no.8
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• pp.634-640
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• 2002

To improve the ductility of mTEX>$(Al +12.5%Cu)<_3$Zr intermetallics, which are the potential high temperature structural materials, the mechanical alloying behavior, the effect of pressure and temperature on the $Ll_2$, phase formation and the behavior of the cold isostatic press and sintering were investigated. However mechanically alloyed A1$_3$Zr alloy have been known to have high mechanical strength even at high temperature, its workability was poor. A method of solution is refined grain size and phase transformation from $DO_{23}$ to $Ll_2$.$ Ll_2$ structure TEX>$(Al+12.5%Cu)<_3$Zr with nanocrystalline microstructure intermetallic powders where were prepared by mechanical alloying of elemental powders. Grain sizes of the as milled powders were less than 10nm (from transmission electron microscopy, TEM). Thermal analyses showed that $Ll_2$ structure was stable up to$ 800^{\circ}C$ for 1hour $(Al+ 12.5%Cu)<_3$Zr. $(Al+12.5%Cu)<_3$Zr has been consolidated by cold isostatic pressing (CIP 138, 207, 276, 414MPa) at room temperature and subsequent heat treatment at high temperatures where $Ll_2$ structure was stable under vacuum atmosphere. The results showed that 94.2% density of Ll$_2$ compacts was obtained for the (Al +12.5%Cu)$_3$Zr by sintering at 80$0^{\circ}C$ for 1hour (under CIPed 207MPa). This compact of the grain size was 40nm.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1428-1429
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• 2011

This paper variation of stranded cable conductor with CIP(Cold Isostatic Press) technology. Conductor as cable material takes majority costs. Thus many experiments have been done on conductor compaction. The core technology is to maintain the resistance of circular stranded conductor after compaction process, while reducing the weight of conductor diameter, but by increasing filling factor. Testing by varying the compaction ratio using 300SQ conductor, conductor after CIP process shows lower resistance rather than conductor before CIP process.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.16 no.1
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• pp.123-136
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• 2018

The objective of this study is to propose a new methodology to fabricate a reliable engineering-scale buffer block, which shows homogeneous and uniform distribution in buffer block density, for in-situ experiments. In this study, for the first time in Korea, floating die press and CIP (Cold Isostatic Press) are applied for the manufacture of an engineering-scale bentonite buffer. The optimized condition and field applicability are also evaluated with respect to the method of manufacturing the buffer blocks. It is found that the standard deviation of the densities obtained decreases noticeably and that the average dry density increases slightly. In addition, buffer size is reduced by about 5% at the same time. Through the test production, it is indicated that the stress release phenomenon decreases after the application of the CIP method, which leads to a reduction in crack generation on the surface of the buffer blocks over time. Therefore, it is confirmed that the production of homogeneous buffer blocks on industrial scale is possible using the method suggested in this study, and that the produced blocks also meet the design conditions for dry density of buffer blocks in the AKRS (Advanced Korea Reference Disposal System of HLW).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.333-340
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• 2019

The effects of compaction methods on the sintering density, microstructures, and mechanical properties were investigated in ${\alpha}-alumina$ ceramics. ${\alpha}-Alumina$ powders were granulated with a 10% aqueous solution of polyvinyl alcohol (PVA). Uniaxially pressed (UAP) and cold isostatic-pressed (CIP) samples were prepared by pressing uniaxially at a pressure of 1 ton for 1 min, and isostatically at 200 MPa for 15 min, respectively. Subsequently, both types of samples were sintered at $1,200^{\circ}C$, $1,300^{\circ}C$, $1,400^{\circ}C$, $1,450^{\circ}C$, $1,500^{\circ}C$, $1,550^{\circ}C$, and $1,600^{\circ}C$ at a rate of $5^{\circ}C/min$ for 2 h. The CIP samples were better than the UAP samples for all properties measured, such as the sintering density, Vicker's hardness, and toughness. The CIP sample sintered at $1,400^{\circ}C$ showed the maximum Vicker's hardness and toughness; this may be attributed to the competing effects of a decrease in porosity and the growth of grains with increasing sintering temperature.

• Korean Journal of Materials Research
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• v.13 no.4
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• pp.205-212
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• 2003

RF sputtering process was applied to produce thin hydroxyapatite［HA, Ca10($PO_4$)$_{6}$ $ (OH)_2$films on Ti-6Al-4V alloy substrates. To make a 101.6 mm dia.${\times}$5 mm HA target, the commercial HA powder was first calcinated for 3h at $200^{\circ}C$. A certain amount of the calcinated HA powder was pressed under a pressure of 20,000 psi by the cold isostatic press(CIP) and the pressed HA target was sintered for 6 h at $1,200^{\circ}C$. The effects of different heat treating conditions on the bonding strength between HA thin films and Ti-6Al-4V alloy substrates were studied. Before deposition, the alloy substrates were annealed for 1 h at $850^{\circ}C$ under $3.0${\times}$10^{-3}$ Xtorr, and after deposition, the hydroxyapatite/Ti-6Al-4V alloy thin films were annealed for 1 h at 400, 600 and $800^{\circ}C$ under the atmosphere, respectively. Experimental results represented that the HA thin films on the annealed substrates had higher hardness than non-heat treated substrates before the deposition.