• 제목/요약/키워드: C60 doping

검색결과 58건 처리시간 0.03초

상 변화 메모리 재료 내의 Ga 주입에 미치는 GaGe 스퍼터링 전력의 영향 (Effect of GaGe Sputtering Power on Ga Doping in Phase Change Memory Materials)

  • 정순원;이승윤
    • 한국전기전자재료학회논문지
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    • 제28권5호
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    • pp.285-290
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    • 2015
  • The phase change memory material is an active element in phase change memory and exhibits reversible phase transition behavior by thermal energy input. The doping of the phase change memory material with Ga leads to the increase of its crystallization temperature and the improvement of its amorphous stability. In this study, we investigated the effect of GaGe sputtering power on the formation of the phase change memory material including Ga. The deposition rate linearly increased to a maximum of 127 nm and the surface roughness remained uniform as the GaGe sputtering power increased in the range from 0 to 75 W. The Ga concentration in the thin film material abruptly increased at the critical sputtering power of 60 W. This influence of GaGe sputtering power was confirmed to result from a combined sputtering-evaporation process of Ga occurring due to the low melting point of Ga ($29.77^{\circ}C$).

플라즈마 도핑 후 급속열처리법을 이용한 n+/p 얕은 접합 형성

  • 도승우;서영호;이재성;이용현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.50-50
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    • 2009
  • In this paper, the plasma doping is performed on p-type wafers using $PH_3$ gas(10 %) diluted with He gas(90 %). The wafer is placed in the plasma generated with 200 W and a negative DC bias (1 kV) is applied to the substrate for 60 sec under no substrate heating. the flow rate of the diluted $PH_3$ gas and the process pressure are 100 sccm and 10 mTorr, respectively. In order to diffuse and activate the dopant, annealing process such as rapid thermal annealing (RTA) is performed. RTA process is performed either in $N_2$, $O_2$ or $O_2+N_2$ ambient at $900{\sim}950^{\circ}C$ for 10 sec. The sheet resistance is measured using four point probe. The shallow n+/p doping profiles are investigated using secondary ion mass spectromtry (SIMS). The analysis of crystalline defect is also done using transmission electron microscopy (TEM) and double crystal X-ray diffraction (DXRD).

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질소가 도핑된 다공질 3C-SiC 박막의 열적, 기계적 특성 (Thermal and Mechanical Properties of a N2 Doped Porous 3C-SiC Thin Film)

  • 김강산;정귀상
    • 한국전기전자재료학회논문지
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    • 제23권8호
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    • pp.651-654
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    • 2010
  • This paper describes the thermal and mechanical properties of doped thin film 3C-SiC and porous 3C-SiC. In this work, the in-situ doped thin film 3C-SiC was deposited by using atmospheric pressure chemical vapor deposition (APCVD) method at $120^{\circ}C$ using single-precursor hexamethyildisilane: $Si_2(CH_3)_6$ (HMDS) as Si and C precursors. 0~40 sccm $N_2$ gas was used as doping source. After growing of doped thin film 3C-SiC, porous structure was achieved by anodization process with 380 nm UV-LED. Anodization time and current density were fixed at 60 sec and 7.1 mA/$cm^2$, respectively. The thermal and mechanical properties of the $N_2$ doped porous 3C-SiC was measured by temperature coefficient of resistance (TCR) and nano-indentation, respectively. In the case of 0 sccm, the variations of TCR of thin film and porous 3C-SiC are similar, but TCR conversely changed with increase of $N_2$ flow rate. Maximum young's modulus and hardness of porous 3C-SiC films were measured to be 276 GPa and 32 Gpa at 0 sccm $N_2$, respectively.

플라즈마 이온주입 후 RTP 열처리 온도와 시간에 따른 접촉저항 특성 (Characteristics of Contact resistivity on RTP annealing temperature and time after Plasma ion implant)

  • 최장훈;도승우;이용현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.5-6
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    • 2009
  • In this paper, plasma ion implant is performed with $PH_3$ gas diluted by helium gas on P-type Si wafer (100). Spike Rapid Thermal Processing(RTP) annealing performed for 30~60 sec from $800\;^{\circ}C$ to $1000\;^{\circ}C$ in $N_2+O_2$ ambient. Crystalline defect is analyzed by Transmission Electron Microscope(TEM) and Double crystal X-ray Diffraction(DXRD). Contact resistivity($\rho c$), contact resistance(Rc) and sheet resistance(Rs) are analyzed by measuring Transfer Length Method(TLM) using 4155C analysis. As annealing temperature increase, Rs decrease and ${\rho}c$ and Rc increase at temperature higher than $850\;^{\circ}C$. We achieve low Rs, ${\rho}c$ and Rc with Plasma ion implant and spike RTP.

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$Al_2O_3$ 첨가가 (Ba,Ca,Mg)-$Nd_2O_3-TiO_2+10wt%Bi_2O_3$ 세라믹의 마이크로파 유전특성에 미치는 영향 (Effect of $Al_2O_3$ Additives on Microwave Dielectric Properties of (Ba,Ca,Mg)-$Nd_2O_3-TiO_2+10wt%Bi_2O_3$ Ceramics)

  • 최지원;강종윤;하종윤;윤석진;김현재;정현진;윤기현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.653-656
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    • 1999
  • Effect of $Al_2O_3$ Additives on Microwave Dielectric Properties of $0.15(Ba_{0.85}Ca_{(0.15-y)}Mg_y)$-0.125 $Nd_2O_3-0.60TiO_2+10wt%Bi_zO_3$ (y=0.05, 0.08) Ceramics was investigated. To control of $\tau\;{f}$ on microwave dielectric properties of $0.15(Ba_{0.85}Ca_{(0.15-y)}Mg_y)$-0.125 $Nd_2O_3-0.60TiO_2+10wt%Bi_zO_3$ ceramics $Al_2O_3$ was doped in the composition range of 0 to 0.15 wt%. As a result, dielectric constant was decreased from 94 to 80 but $Q\cdot{f}_0$ value was increased from 4980 to 5210 GHz and temperature coefficient of resonant frequency can be controlled from +9 to -10$ppm^\circ{C}$ as an increase of$Al_2O_3$ doping concentration. Especially, a new microwave dielectric material having $\varepsilon\;_r=84,\;Q\cdot{f}_0=5120\;GHz\;and\;\tau_f=0\;ppm/^\circ{C}$ was obtained at $Al_2O_3$ doping concentration of 0.08 wt%.

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NMOS 소자의 제작 및 평가 (Fabrication and Evaluation of NMOS Devices)

  • 이종덕
    • 대한전자공학회논문지
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    • 제16권4호
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    • pp.36-46
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    • 1979
  • 본 연구에서는 N -채널 실리콘 게이트 제작기술에 의하여 일련의 크기를 가지는 커페시터와 트렌지스터들이 제작되었다. 그 결과 다양한 이온 주입 조걸, 즉 B 의 경우 에너지 30keV∼60keV와 도오스 3 × 10 ~ 5 × 10 개/㎠ 그리고 P 의 경우 에너지 1001keV∼ 175keV와 4 ×10 ~ 7×11개/㎠ 도오스 영역에서 이들에 대한 D.C. 인자들의 측정치들이 이론적인 계산치들과 비상, 분석되어 있다. 이 D.C. 인자들에는 threshold전압, 공핍층의 폭, 게이트 산화물 두께, 표면상태, 가동 하전입자 밀도, 전자의 이동도 그리고 마지막으로 누설전류가 있는데, 이중 실제 MOS의 제작에 있어서 특허 중요한 threshold전압에 있어서는, 커어브트레이서와 C - V plot을 통하여 측정된 값들이 실제 재산에서 이용된 SUPREM II 컴퓨우터 프로그램에 의한 결과와 훌륭히 접근하고 있다. 그 밖에 여기나온 D.C.인자들 중에서 도오핑 수준은 기판의 역 게이트 바이어스에서 threshold전압들로 부터 계산된 것이고, 역전도는 정의된 subthreshold 기울기로 부터 추산된 것임을 밝혀 둔다. 마지막으로 이와같은 D. C. 시험 결과들을 종합적으로 평가해 볼 때 만들어진 커페시터와 트렌지스터들이 N -채널 MOS I. C. 기억소자용으로 적합함을 보여주고 있다.

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Effect of Electric Field Frequency on the AC Electrical Treeing Phenomena in an Epoxy/Reactive Diluent/Layered Silicate Nanocomposite

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • 제15권2호
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    • pp.87-90
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    • 2014
  • The effects of electric field frequency on the ac electrical treeing phenomena in an epoxy/reactive diluent/layered silicate (1.5 wt%) were carried out, in needle-plate electrode arrangement. A layered silicate was exfoliated in an epoxy base resin, by using our ac electric field apparatus. To measure the treeing propagation rate, constant alternating current (AC) of 10 kV with three different electric field frequencies (60, 500 and 1,000 Hz) was applied to the specimen, in needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. As the electric field frequency increased, the treeing propagation rate increased. At 500 Hz, the treeing propagation rate of the epoxy/PG/nanosilicate system was $0.41{\times}10^{-3}$ mm/min, which was 3.4 times slower than that of the epoxy/PG system. The electrical treeing morphology was dense bush type at 60 Hz; however, as the frequency increased, the bush type was changed to branch type, having few branches, with very slow propagation rate.

Spray 방법을 이용한 결정질 태양전지 Emitter 확산의 최적화 연구

  • 송규완;장주연;이준신
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.406-406
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    • 2011
  • 결정질 태양전지에서 도핑(Doping)은 반도체(Semiconductor)의 PN 접합(Junction)을 형성하는 중요한 역할을 한다. 도핑은 반도체에 불순물(Dopant)을 주입하는 공정으로 고온에서 진행되며 온도는 중요한 변수(Parameter)로 작용한다. 본 연구에서는 여러 가지 에미터(emitter)층 형성방법 중에 가장 저가이면서 공정과정이 간단하며 대면적 도핑이 용의한 Spray 방법을 통해 효과적인 에미터 층 형성의 최적화를 위해 DI water에 각각 1%, 3%, 5% 7%로 희석된 H3PO4용액 으로 850$^{\circ}C$에서 열처리 시간을 가변해 가며 최적화된 면저항과 표면농도 특성을 분석하였다. 도핑소스가 웨이퍼(wafer) 각각의 표면에 흡착시킨 후 오븐에 넣어 150$^{\circ}C$에서 5분간 건조시킨 후 퍼니스(furance)에 넣어 시간을 가변해 가며 도핑시켰다. Spray 방식은 기존의 방식보다 저렴하고 In-line 공정에 적합하며 대용량으로 전환이 쉽다는 많은 장점을 가지고 있다. 도핑시 먼저 spray를 이용하여 웨이퍼 표면에 균일하게 용액을 흡착시킨 후 오븐에서 150$^{\circ}C$에서 5분간 건조 후 furnace에 넣어 850$^{\circ}C$에서 시간을 가변 해가며 실험하였다. H3PO4용액의 비율이 1%일 때는 2분 이상 열처리를 하였을 때 60${\Omega}/{\Box}$ 이하로 내려가지 않았다. 이는 최초 표면농도가 낮아 더 이상 확산되지 않음을 의미한다. 또한 H3PO4의 비율이 3% 이상일 때는 열처리 시간이 1분 이하일 때 면저항의 변화가 거의 없었으나 2분 이상일 때는 시간에 따라서 점차 낮아졌으며 균일도 역시 좋아졌다. 이는 H3PO4의 비율이 3% 이상일 때는 표면농도가 높아서 1분 이하의 열처리 시간에서는 확산해 들어가는 양이 거의 같음을 알 수 있었다.

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n-CdS/p-InP 태양전지에 관한 연구 (A study on the n-CdS/p-InP solar cells)

  • 송복식;최영복;한성준;문동찬;김선태
    • E2M - 전기 전자와 첨단 소재
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    • 제8권4호
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    • pp.406-412
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    • 1995
  • A n-CdS thin films were evaporated by thermal evaporation method and their structure, optical transmission spectra and electrical characteristics were investigated. The photovoltaic characteristics of solar cells which were fabricated in optimum conditions measured. The evaporated CdS thin films showed in hexagonal structure and above 80% of optical transmission spectra regardless of impurity doping. The high quality thin films could be obtained at 150.deg. C temperature of substrate, which is useful for solar cell window layer with low resistivity of 6*10$\^$-2/(.ohm.-cm) by In doping We measured the electrical and optical characteristics of the n-CdS/p-InP heterojunction solar cells. The most efficient photovoltaic characteristics of heterojunction solar cells had the open circuit voltage of 0.66V, short circuit current density of 13.85mA/cm$\^$2/, fill factor of 0.576 and conversion efficiency of 8.78% under 60mW/cm$\^$2/ illumination.

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A Study on the Characteristics of Ammonia Doped Plasma Polymer Thin Film with a Controlled Plasma Power

  • 서현진;황기환;주동우;유정훈;이진수;전소현;남상훈;윤상호;부진효
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.242.2-242.2
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    • 2014
  • Plasma-polymer thin films (PPTF) have been deposited on a Si(100) wafer and glass under several conditions such as different RF power by using plasma-enhanced chemical vapor deposition (PECVD) system. Ethylcyclohexane, ammonia gas, hydrogen and argon were utilized as organic precursor, doping gas, bubbler gas and carrier gases, respectively. PPTFs were grown up with RF (ratio frequency using 13.56 MHz) powers in the range of 20~60 watt. PPTFs were characterized by FT-IR (Fourier Transform Infrared), FE-SEM (Scanning Electron Microscope), AFM (Atomic Force Microscope), Contact angle and Probe station. The result of FT-IR measurement showed that the PPTFs have high cross-link density nitrogen doping ratio was also changed with a RF power increasing. AFM and FE-SEM also showed that the PPTFs have smooth surface and thickness. Impedance analyzer was utilized for the measurements of C-V curves having different dielectric constant as RF power.

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