• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2007년도 추계종합학술대회
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• pp.200-203
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• 2007

넓은 에너지 갭의 물질인 탄화규소(4H)기판을 사용하여, 초고내압을 위한 접합장벽 쇼트키 구조의 소자를 설계하여 제작하였다. 측정결과로써 소자의 역방향 I-V 특성은 1000V 이상의 항복전압을 보였고 p-grid의 설계 최적 길이는 $3{\mu}m$ 간격이였다. 이 연구에서는 제작한 소자의 공정 조건 파라미터들을 사용하여 I-V 특성을 모델링 하였고 I-V 특성 파라미터들을 추출하여 실제 소자 파라미터와 비교, 분석하였다.

• The Journal of Korean Physical Therapy
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• 제16권3호
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• pp.32-49
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• 2004

The primary purpose of this study was to provide the basic materials for C.V.A inpatients' actual use of medical service at the hospital with both the western and oriental medical department and the attitude on cooperative treatment. The results of this study were as follow: First, the subjects' general characteristics including job, monthly mean income and age made statistical differences to their pathological characteristics such as part of primary paralysis, detailed name of disease and cause of elicitation. Second, their general characteristics including religion and job produce statistical difference to their actual use of medical service, like medical institution form, term of treatment and type of medical institution at first-aid. Third, through the awareness of cooperative treatment system, the effect of C.V.A treatment and the shorten of the C.V.A treatment term were higher at oriental medical department inpatients and cooperative treatment serviced inpatients than western medical department inpatients and cooperative treatment non-serviced inpatients. Fourth, the biggest problem on current dual medical system is increase medical expenses and the biggest reason on not vitalized cooperative service is prejudice of both parts.

• 센서학회지
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• 제16권4호
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.195-196
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• 2009

This paper describes the fabrication and characteristics of polycrystalline 3C-SiC thin film diodes for extreme environment applications, in which the this thin film was deposited onto oxidized Si wafers by APCVD using HMDS In this work, the optimized growth temperature and HMDS flow rate were $1,100^{\circ}C$ and 8sccm, respectively. A Schottky diode with a Au, Al/poly 3C-SiC/$SiO_2$/Si(n-type) structure was fabricated and its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) values were measured as 0.84V, over 140V, 61nm, and $2.7{\times}10^{19}cm^2$, respectively. To produce good ohmic contact, Al/3C-SiC were annealed at 300, 400, and $500^{\circ}C$ for 30min under a vacuum of $5.0{\times}10^{-6}$Torr. The obtained p-n junction diode fabricated by poly 3C-SiC had similar characteristics to a single 3C-SiC p-n junction diode.

• 센서학회지
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• 제4권3호
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• pp.15-21
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• 1995

본 논문은 졸겔법에 의해 $TiO_{2}-V_{2}O_{5}$ 습도센서를 제조하고, 미세구조 및 결정구조를 분석하여 습도감지특성이 뛰어난 최적 제조조건을 찾았다. 그레인 크기는 $Ti^{4+}$ 사이트에 치환되는 $V^{5+}$비에 비례하여 증가하였다. X-선 회절분석 결과, $V_{2}O_{5}$비에 관계없이 $V^{5+}$피크는 확인할 수 없었다. 실험결과로부터 $V_{2}O_{5}$비가 1mol%, 열처리온도가 $700^{\circ}C$일때 가장 우수한 습도감지특성을 나타내었다. 시편의 정전용량은 주파수가 증가할수록 감소하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.194-197
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• 2002

Applying dual layer insulator on plastic substrates improved electrical characteristics of organic thin film transistor(TFT). A high-quality silicon dioxide(SiO$_2$) suitable for a insulator was deposited on plastic substrates by e-beam evaporation at 110$^{\circ}C$. The insulator film which was treated by N$_2$ annealing at 150$^{\circ}C$ showed excellent I-V, C-V characteristics. The dual layer insulator structure of polyimide-SiO$_2$ improved the roughness of SiO$_2$ surface and showed very low leakage current. In addition, the flat band voltage has been reduced from -2.5V to about 0.5V.

• Transactions on Electrical and Electronic Materials
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• 제8권4호
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• pp.170-173
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• 2007

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated the organic field-effect transistor based a copper phthalocyanine (CuPc) as an active layer on the silicon substrate. The CuPc FET device was made a topcontact type and the substrate temperature was room temperature and $150^{\circ}C$. The CuPc thickness was 40 nm, and the channel length was $50{\mu}m$, channel width was 3 mm. We observed the typical current-voltage (I-V) characteristics and capacitance-voltage (C-V) in CuPc FET and we calculated the effective mobility with each device. Also, we observed the AFM images with different substrate temperature.

• 센서학회지
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• 제9권3호
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• pp.196-202
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• 2000

본 논문에서는 3축의 가속도를 검출하기 위한 새로운 방식인 브리지조합 검출원리를 제안하고, SOI 구조의 웨이퍼를 이용하여 $200^{\circ}C$ 이상 고온에서 동작이 가능한 압저항형 실리콘 가속도센서를 제작하였다. 제작된 센서의 감도는 x 및 y축이 8mV/V G, z 축이 40mV/V G 이였다. 그리고 출력전압의 비선형성은 1.6%FS, 타축감도는 약 4.6% 이하였다. 이것은 외부 연산회로를 이용하여 3축의 가속도성분을 검출하는 방법에 비해 검출방식은 간단하면서도, 특성은 거의 동일하였다. 또한 SOI 구조를 이용하여 고온에서도 안정한 동작을 하였다. 제작된 가속도센서의 오프셋전압 온도계수와 감도 온도계수는 $27^{\circ}C$에서 각각 $1033ppm^{\circ}C^{-1}$와 $1145ppm^{\circ}C^{-1}$이였다.

• 전자공학회논문지D
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• 제35D권2호
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• pp.52-59
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• 1998

The ZnS:Mn thin film electroluminescent(TFEL) devices fabricated by ALE system were investigated. Yellow-orange light emission was observed when the applied voltage exceeded 134 V and luminance increased sharply as the applied voltage increased. Luminance of 568 Cd/c $m^{2}$ was obtained under 1 KHz sinusoidal voltage wave application at the peak applied voltage of 230 V. The peak wavelength of the emissionwas 577 nm. The C-V, Q-V, $Q_{t}$ - $F_{p}$ , L- $Q_{cond}$, and V- $Q_{pol}$ have been measured under theapplication of the trapezoidal wave with its pulse width varying 0 to 75 .mu.sec. The phoshor and the insulator capacitance of the TFEL device under test were 24.3 nF/c $m^{2}$ and 9 nF/c $m^{2}$, respectively. It was observed that the threshold voltage changed from 137V to 100V as the pulse width varied from 0 to 75 .mu.sec. The L- $Q_{cond}$ characteristics showed that the light emission increased in proportion to the $Q_{cond}$. The luminance increased from 386 Cd/ $m^{2}$ to 607 Cd/ $m^{2}$ when the $Q^{+}$$_{cond}$ increased from 1.3 .mu.C/c $m^{2}$ to 2.3 .mu.C/c $m^{2}$. The V- $Q_{pol}$ characteristics showed that the V was inversely proportional to $Q_{pol}$./. th/ was inversely proportional to $Q_{pol}$./. pol/./.

• 전자공학회논문지A
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• 제28A권12호
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• pp.59-64
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• 1991

Thin (25-103$\AA$) SiO$_2$ films are grown using the rapid thermal oxidation processing at temperatures of 105$0^{\circ}C$-115$0^{\circ}C$ for 5-30 sec, in order to investigate the characteristics of ultra thin oxide. For measuring the thickness of oxide TEM, ellipsometry, and C-V method which is taken in the condition of small surface band bending are used and compared. When neglecting the small deviation affected by both interface state and moisture charge effect, those three methods described above give similar results. In order to examine the effect of rapid thermal annealing, part of samples are annealed in N$_2$ ambient. MOS capacitors are fabricated and the characteristics of I-V and C-V are measured. Measurements show that the activation energy of initial thickness of oxide grown during the ramp-up time is of 1.125eV and the activation energy of the oxidation rate is of 0.98eV. As oxidation temperature is increased, dielectric breakdown field E$_{BD}$ is decreased due to the increase of fixed charge density N$_f$ However, E$_{BD}$ is shown to be decreased as increasing the thickness of oxide. The increase of N$_f$ in the early stage of thermal annealing results in the decrease of E$_{BD}$.