• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.75-78
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• 2006

In case of contacts between semiconductor and metal in semiconductor circuits, they become unstable because of thermal budget. To prevent these problems, we use diffusion barrier that has a good thermal stability between metal and semiconductor. So we consider the diffusion barrier to prevent the increase of contact resistance between the interfaces of metals and semiconductors, and the increase of resistance and the reaction between the interfaces. In this paper we deposited tungsten boron carbon nitride (W-B-C-N) thin film on silicon substrate. The impurities of the $1000\;{\AA}-thick$ W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between metal thin films $(Cu-2000\;{\AA})$ and silicon during the high temperature $(700\~1000^{\circ}C)$ annealing process.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.9
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• pp.1296-1299
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• 2012

$YBa_2Cu_3O_{7-x}$ thin films were fabricated by the spin-coating method on $SiO_2$/Si substrate using an alkoxide-based sol-gel method. The structural and electrical properties were investigated for various 1st annealing temperature. Due to the formation of the polycrystalline single phase, synthesis temperature was observed at around $720^{\circ}C-800^{\circ}C$. $YBa_2Cu_3O_{7-x}$ thin films with the 1st annealing temperature of $450^{\circ}C{\sim}500^{\circ}C$ showed the single XRD patterns without the second phase, such as $YBa_2Cu_4O_8$. The thickness of films was approximately $0.23{\mu}m{\sim}0.27{\mu}m$. Aerage grain size, resistance and temperature coefficient of resistance (TCR) of $YBa_2Cu_3O_{7-x}$ thin films with the 1st annealing temperature of $500^{\circ}C$ were $0.27{\mu}m$, $59.7M{\Omega}$ and -3.7 %/K, respecvitely.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.36.2-36.2
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• 2009

Low dielectric materials have been great attention in the semiconductor industry to develop high performance interlayer dielectrics with low k for Cu interconnect technology. In our study, the dielectric properties of SiOC /SiO2 thin film derived from polyphenylcarbosilane were investigated as a potential interlayer dielectrics for Cu interconnect technology. Polyphenylcarbosilane was synthesized from thermal rearrangement of polymethylphenylsilane around $350^{\circ}C{\sim}430^{\circ}C$. Characterization of synthesized polyphenylcarbosilane was performed with 29Si, 13C, 1H NMR, FT-IR, TG, XRD, GPC and GC analysis. From FT-IR data, the band at 1035 cm-1 is very strong and assigned to CH2 bending vibration in Si-CH2-Si group, indicating the formation of the polyphenylcarbosilane. Number average of molecular weight (Mn) of the polyphenylcarbosilane synthesized at $400^{\circ}C$ for 6hwas 2, 500 and is easily soluble in organic solvent. SiOC/SiO2 thin film was fabricated on ton-type silicon wafer by spin coating using 30wt % polyphenylcarbosilane incyclohexane. Curing of the film was performed in the air up to $400^{\circ}C$ for 2h. The thickness of the film is ranged from $1{\mu}m$ to $1.7{\mu}m$. The dielectric constant was determined from the capacitance data obtained from metal/polyphenylcarbosilane/conductive Si MIM capacitors and show a dielectric constant as low as 2.5 without added porosity. The SiOC /SiO2 thin film derived from polyphenylcarbosilane shows promising application as an interlayer dielectrics for Cu interconnect technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.1
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• pp.51-54
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• 2009

Transparent Cuprous oxide film was deposited by rapid thermal oxidation (RTO) of Cu at $500^{\circ}C$/45s condition on textured single-crystal n-Si substrate to form $Cu_2O$/n-Si heterojunction photodiode. The Hall effect measurements for the $Cu_2O$ films showed a p-type conductivity. The photovoltaic and electrical properties of the junction at room temperature were investigated without any post-deposition annealing. I-V characteristics revealed that the junction has good rectifying properties. The C-V data showed abrupt junction and a built-in potential of 1 V. The photodiode showed good stability and high responsivity in the visible at three regions; 525 nm, 625-700 nm, and 750nm denoted as regions A, B, and C, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04a
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• pp.43-46
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• 2004

CuPc와 $C_{60}$을 이용하여 ITO/CuPc/Al의 CuPc 단층구조와 $ITO/CuPc/C_{60}/Al$의 이종접합 구조에서의 광기전 특성을 연구하였다. CuPc 단층구조에서는 CuPc층의 두께를 10nm에서 50nm로 가변하여 전압-전류 특성을 측정한 결과 40nm 부근에서 최적화된 전기적인 특성이 나타났으며, $CUPC/C_{60}$의 이종접합 구조에서는 CuPc와 $C_{60}$의 두께 비율을 1 : 1 (20nm : 20nm), 1 : 2 (20nm : 40nm), 1 : 3 (20nm : 60nm)으로 가변하여 측정한 결과, 1 : 2의 두께비에서 최적화된 특성을 얻었다. 광원은 500W Xe lamp(ORIEL 66021)를 이용하였으며, 광원의 세기는 보정된 radiometer/photometer (International Inc. IL14004)와 Si-photodiode로 측정하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.237-241
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• 2000

The effects of Si addition on the precipitation processes of in Al-Cu-Si alloy films were studied by the transmission electron microscopy. Deposition of an Al-1.5Cu-1.5Si (wt. %) film at $305^{\circ}C$ resulted in formation of fine, uniformly distributed spherical $\theta$-phase particles due to the precipitation of the $\theta$ and Si phase particles during deposition. For deposition at $435^{\circ}C$, fine $\theta$-phase particles precipitated during wafer cooldown, while coarse Si nodules formed at the sublayer interface during deposition. The film susceptibility to corrosion is discussed in relation to the film microstructure and deposition temperature.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.612-614
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• 2008

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10nm to 50nm, we have obtained that the optimum CuPc layer thickness is around 40nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$C_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc:$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL14004).

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.864-873
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• 1995

Amorphous $Fe_{73.5}Cu_{1}Nb_{3}Si_{16.5}B_{6}$ ribbons were annealed for different time at $500^{\circ}C$ and $552^{\circ}C$, just before and after the exothermic reaction in DSC curve. The development of nanocrystalline phase was investigated by means of $M\"{o}ssbsuer$ spectroscopy. The crystalline phase consists mainly of $DO_{3}Fe-Si$. Though slight in amount (5%), another ferromagnetic phase which could be presumed $t-Fe_{3}B$ was detected Si content of $DO_{3}Fe-Si$, Si/(Fe+Si), was 0.218 under the heat treatment at $500^{\circ}C$ for 60 min and 0.222 at $552^{\circ}C$ for 10 min. Since then both of those values decreased with time until 120 min and finally these two values remained constant at 0.210. The variation in Si content with annealing time results in the variation in the hyperfine field and the isomer shift. The increase in the mean hyperfine fields and the decrease in the mean isomer shifts of Fe-Si are caused by the increase in Si content. The volume fractions of residual amorphous phase rapidly decrease during the early stage of annealing and come nearer to saturation after 120 min both at $500^{\circ}C$ and $552^{\circ}C$. The decrease in the mean hyperfine field of residual amorphous. in spite of slight changes in the volume fractions of Fe-Si and of residual amorphous after 120 min. is caused by the increase in the content of Nb and B in residual amorphous phase. The saturated volume fraction of the crystalline phase was 81% for $500^{\circ}C$ (180 min) and 77% for $552^{\circ}C$ (960 min), different from expectation.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.433-439
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• 1999

In this study, the diffusion barrier properties of $1000\AA$ thick molybdenum compounds (Mox=1-5 Si) were investigated using sheet resistance measurements, X-ray diffractometry (XRD), and Rutherford back scattering spectrometry (RBS). Each barrier material was deposited by the de and rf magnetron co-sputtering of Mo and Si, respectively, and annealed at $500-700^{\circ}C$ for 30 min in vacuum. Each barrier material was failed at low temperatures due to Cu diffusion through grain boundaries and defects of barrier thin films or through the reaction of Cu with Si within Mo-barrier thin films. It was found that Mo rich thin films were less effective than Si rich films to Cu penetration activating Cu reaction with the substrate at a temperature higher than $500^{\circ}C$.

• Journal of Korean Vacuum Science & Technology
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• v.1 no.1
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• pp.30-37
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• 1997

Interactions of Cu films with Si substrates separated by thin layers of molybdenum and molybdenum nitride were investigated in the viewpoint of diffusion barrier to copper. the diffusion barrier behavior of the layers was studied as functions of deposition and annealing conditions by cross-sectional transmission electron microscopy and Nomarski microscopy. the layers deposited at $N_2$ gas ratios of 0.4 and 0.5 exhibited good diffusion barrier behaviors up to $700^{\circ}C$, mainly due to the phase transformation of molybdenum to $\gamma$-Mo$_2$N phase. The increase in the N gas ratio in deposition elevates the lower limit of barrier failure temperature. Futhermore, amorphous molybdenum nitride films deposited at 20$0^{\circ}C$ and 30$0^{\circ}C$ did not fail, while the crystalline $\gamma$-Mo$_2$N films deposited at 40$0^{\circ}C$ and 50$0^{\circ}C$ showed signs of interlayer interactions between Cu and Si after annealing at 75$0^{\circ}C$ for 30 minutes. Therefore, the amorphous nature of the molybdenum nitride layer enhanced its ability to reduce Cu diffusion and its stability as a diffusion barrier at elevated temperatures.