• Journal of Welding and Joining
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• v.35 no.2
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• pp.23-29
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• 2017

Mechanical properties and hardness distributions in arc brazed joints of Dual phase steel using Cu-Al insert metal were investigated. The maximum tensile shear load was 10.4kN at the highest brazing current. It was about 54% compared to tensile load of base metal. This joint efficiency is higher than that of joint of DP steel using Cu-based filler metals which are Cu-Si, Cu-Sn. Fracture positions can be divided into two types. Crack initiation commonly occurred at three point junction among upper sheet, lower sheet and the fusion zone. However crack propagations were different with increasing the brazing current. In case of the lower current, it instantaneously propagated along with the interface between fusion zone and upper base material. On the other hand, in case of higher current, a crack propagation occurred through fusion zone. When the brazing current is low (60, 70A), the interface shape is flat type. However the interface shape is rough type, when the brazing current is high (80A). It is thought that the interface shapes were the reason why the crack propagations were different with brazing current. The interface was the intermetallic compounds which consisted of $(Fe,Al)_{0.85}Cu_{0.15}$ IMC formed by crystallization at $1200^{\circ}C$during cooling. Therefore the maximum tensile shear load and the fracture behavior were determined by a interface shape and effective sheet thickness of the fracture position.

• Journal of the Korean Ceramic Society
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• v.48 no.2
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• pp.168-172
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• 2011

Alumina powder was added in a general porcelain (Backja) with clay, feldspar and quartz contents to promote the mullite ($3Al_2O_3{\cdot}2SiO_2$) generation in the porcelain. Low melting materials ($B_2O_3(450^{\circ}C)$, $MnO_3(940^{\circ}C)$, CuO($1080^{\circ}C$)) were doped at ~3 wt% to modify the sinterability of porcelain with a high alumina contents and promote the mullite generation. Green body was made by slip casting method with blended slurry and then, they were fired at $1280^{\circ}C$ for 1hr by a $2^{\circ}C/min$. Densifications of samples with high alumina contents (20~30 wt%) were impeded. As the doping contents of low melting materilas increased, the sinterability of samples was improved. The shrinkage rate and bulk density of samples were improved by doping with low melting materials. Mullite phase increased with increasing the low melting contents in the phase analyses. This means lots of alumina and quartz were transformed into mullite phase by low melting contents doping. In the results, high bending strength of samples with high alumina contents was accomplished by improving the densification and mullite generation in the porcelain.

• Journal of the Korean Chemical Society
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• v.17 no.6
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• pp.434-438
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• 1973

Distribution coefficients (C) of some transition metal ions such as Ni(II), Cu(II), Cd(II), Zn(II), and Hg(II) have been determined in methanol-, ethanol-, isopropanol-, acetone-, and dimethylsulfoxide-water mixtures by using Rexyn 101 (Na-form) resin and 0.2 M sodium chloride solution. The log C values of the metallic ions decrease almost straightly with the increase in reciprocal values of the dielectric constants of the mixed solvents. In the solvents having the same dielectric constants, the distribution coefficients of the metallic ions decrease with the increase in the basicity of the aprotic organic molecule and with the decrease in the molecular size of the protic organic molecule. The separation of the metallic ions has been accomplished with the eluting agent suggested by the C values.

• Journal of Korea Foundry Society
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• v.38 no.2
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• pp.32-40
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• 2018

Changes in the microstructures and mechanical properties of an AC2B alloy through solution heat treatment were investigated using recycled AC2B cutting chips as raw material. The as-cast microstructure of the AC2B alloy comprised ${\alpha}$-Al, $Al_2Cu$, and coarse needle-shaped phases considered to be eutectic Si and an Al-Fe-Si based intermetallic compound. After solution heat treatments at $505^{\circ}C$ for 1 h and 6 h, the samples showed complete dissolution of $Al_2Cu$ and relatively fine distribution of intermetallic compounds. Hardness test results showed that the hardness rapidly increased after the solution heat treatment for 1 h by solid solution hardening, and the increase of hardness exhibited a plateau from 1 h to 6 h. The results of the hardness and tensile tests showed that there was no visible difference in the effect of 1 h and 6 h solid solution treatment.

• Transactions of the Korean hydrogen and new energy society
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• v.9 no.4
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• pp.169-176
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• 1998

An experimental study on effect of vapor-cooled heat stations in a 5.5 liter cryogenic vessel has been performed. The cryogenic vessel is made of stainless steel of thickness of 1mm and insulated by the combined insulation of vacuum, MLI(multi-layer insulation) and vapor-cooled radiation shield. Vapor-cooled heat stations are also constructed based on the 1-dimensional thermal analysis to reduce the heat inleak through a filling tube. Thermal analysis indicates that the vapor-cooled heat stations can substantially enhance the performance of vessel for cryogenic fluids with high $C_p/h_{fg}$ where $C_p$ the specific heat and $h_{fg}$ the heat of vaporization, such as $LH_2$ and LHe. The experimental results for $LN_2$ shows that the total heat inleak into inner vessel consists of 14% radiation and 86% conduction through the filling tube. Therefore, it is expected that the conduction heat in leak of the vessel for high $C_p/h_{fg}$ cryogenic fluids can be significantly reduced. powders. The amount of copper coating was 20wt%. In order to examine corrosion behavior of the electrodes, the corrosion current and the current density, in 6M KOH aqueous solution after removal of oxygen in the solution, were measured by potentiodynamic and cyclic voltamo methods. The results showed that Co in the alloy increased corrosion resistance of the electrode whereas Ni decreased the stability of the electrode during the charge-discharge cycles. The electrode used Si sealant as a binder showed a lower corrosion current density than the electrode used PTFE and the electrode used Cu-coated alloy powders showed the best corrosion resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.281-281
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• 2007

Low Temperature Co-fired Ceramic (LTCC) technology has been used in electronic device for various functions. LTCC technology is to fire dielectric ceramic and a conductive electrode such as Ag or Cu thick film below the temperature of $900^{\circ}C$ simultaneously. The glass-ceramic has been widely used for LTCC materials due to its low sintering temperature, high mechanical properties and low dielectric constants. To obtain the high strength, addition of filler, the microstructure should have various crystals and low pores in a composite. In this study, two glass frits were mixed with different alumina size(0.5, 2, 3.7um) and sintered at the range of $850{\sim}950^{\circ}C$. The microstructure, crystal phases, thermal and mechanical properties of the composites were investigated using FE-SEM, XRD, TG-DTA, Dilatomer. When the particle size of $Al_2O_3$ filler increased, the starting temperatures for the densification of the sintered bodies, onset point of crystallization, peak crystallization temperature in the glass-ceramic composites decreased gradually. After sintered at $900^{\circ}C$, the glass frits were crystallized as $CaAl_2Si_2O_8\;and\;CaMgSi_2O_6$. The purpose of our study is to understand the relationship between the $Al_2O_3$ particle size and thermal properties in composites.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.71-71
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• 2012

As the critical dimensions of integrated circuits are scaled down, the line width and spacing between the metal interconnects are made smaller. The dielectric film used as insulation between the metal lines contributes to the resistance-capacitance (RC) time constant that governs the device speed. If the RC time delay, cross talk and lowering the power dissipation are to be reduced, the intermetal dielectric (IMD) films should have a low dielectric constant. The introduction of Cu and low-k dielectrics has incrementally improved the situation as compared to the conventional $Al/SiO_2$ technology by reducing both the resistivity and the capacitance between interconnects. Some of the potential candidate materials to be used as an ILD are organic and inorganic precursors such as hydrogensilsequioxane (HSQ), silsesquioxane (SSQ), methylsilsisequioxane (MSQ) and carbon doped silicon oxide (SiOCH), It has been shown that organic functional groups can dramatically decrease dielectric constant by increasing the free volume of films. Recently, various inorganic precursors have been used to prepare the SiOCH films. The k value of the material depends on the number of $CH_3$ groups built into the structure since they lower both polarity and density of the material by steric hindrance, which the replacement of Si-O bonds with Si-$CH_3$ (methyl group) bonds causes bulk porosity due to the formation of nano-sized voids within the silicon oxide matrix. In this talk, we will be introduce some properties of SiOC(-H) thin films deposited with the dimethyldimethoxysilane (DMDMS: $C_4H_{12}O_2Si$) and oxygen as precursors by using plasma-enhanced chemical vapor deposition with and without ultraviolet (UV) irradiation.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.190-195
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• 1997

The requirement of precision products about difficult-to-cut materials such as Cu and Aluminum alloy is becoming more and more. Because of soft materials, the exist narrow groves on surface are difficult to gotten off even on the polishing stage. It has been proved that Magnetic-Electrolytic-Abrasive Polishing (MEAP) is a efficient method to resolve this problem by using the nonwoven-abrasive pads together [1, 2]. In this study, through the experiments, their machining properties of newly developer polishing material of SiC, Al2O3 and diamond nonwoven abrasive pads have been proved. Through the experiments, the optimal machining conditions on larger cylinder shape workpiece of Cu and Aluminium alloy have been found, through the Taguchi[3] method the optimal machining conditions can be selected.

• 한국초전도학회:학술대회논문집
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• v.13
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• pp.51-51
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• 2003

• Journal of the Korean institute of surface engineering
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• v.31 no.2
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• pp.73-80
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• 1998

The aim of this study is to develop sintered stainless steels (SSS) with good mechanical strength, wear resistance, and corrosion resistance by nitrogen ion implantation on the Culated SSS surface. Stainless steel compacts containg Cu (2-10 wt%) were prepared by electroless Cu-pating method which results in the increased3 homogenization in alloying powder. Nitrogen ion implantation was carried out by using N2 gas as the ion source. Nitrogen ions were embedded by an acceleratol of 130keV with doese $3.0\times10^{17}\;ions/\textrm{cm}^2$ on the SSS at $25^{\circ}C$ in$2\times10^{-6}$ torr vacuum. The nitrogen ion implanted SSS obtained from anodic ploarization curves revealed higher corrosion potential than that of nitrogen ion unimplante one. And nitrogen ion implanted 316LSSS had good resistance to pitting corrosion due to the synergistic effect of Mo and N, and the inhibition of $NH_4\;^+$<\TEX>, against $CI^-$<\TEX>.