• 한국자기학회지
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• 제16권1호
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• pp.75-78
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• 2006

텅스턴-보론-카본질소 화합물 박막(W-B-C-N)을 만들기 위하여 박막내에 보론과 카본 그리고 질소의 불순물을 주입한 다음 결정구조를 조사하였으며, 이러한 박막의 식각 특성을 조사하기 위하여 고온에서 열처리한 다음 Cu박막을 W-B-C-N 박막위에 증착한 다음에 열처리하였고 여기에서 열적인 특성을 조사하였다. $1000\;{\AA}$의 박막을 RF magnetron sputtering방법을 이용하여 증착한 후에 박막의 전기적구조적인 특성을 측정하였으며, scratch test를 통해 박막의 결합력을 측정하였고, XRD측정을 통하여 결정성을 조사하였으며, 열처리한 후 etching을 하여 nomarski 현미경을 통하여 확산방지막의 안정성을 조사하였다. 이로부터 확산방지막내의 보론과 카본 질소 등의 불순물이 들어감에 따라 Cu가 Si 속으로 얼마나 들어가는가를 효과적으로 조사하였다. W-B-C-N 확산방지막의 역할은 $850^{\circ}C$까지 고온 열처리를 하는 경우에 Cu 원자가 Si 속으로 확산되어 나가는 것을 효과적으로 방지하는 것을 알 수 있었다. 텅스텐-보론-카본질소 화합물 박막의 비저항은 질소 가스의 유량비를 조절함으로써 쉽게 조절할 수 있었으며, 텅스텐-보론-카본-질소 화합물 박막은 Cu 확산방지막으로 적용했을 때 적절한 질소 농도가 들어간 확산방지막에서는 효과적으로 Cu의 확산을 방지하는 것을 알 수 있었다.

• 전기학회논문지
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• 제61권9호
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• pp.1296-1299
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• 2012

$YBa_2Cu_3O_{7-x}$ thin films were fabricated by the spin-coating method on $SiO_2$/Si substrate using an alkoxide-based sol-gel method. The structural and electrical properties were investigated for various 1st annealing temperature. Due to the formation of the polycrystalline single phase, synthesis temperature was observed at around $720^{\circ}C-800^{\circ}C$. $YBa_2Cu_3O_{7-x}$ thin films with the 1st annealing temperature of $450^{\circ}C{\sim}500^{\circ}C$ showed the single XRD patterns without the second phase, such as $YBa_2Cu_4O_8$. The thickness of films was approximately $0.23{\mu}m{\sim}0.27{\mu}m$. Aerage grain size, resistance and temperature coefficient of resistance (TCR) of $YBa_2Cu_3O_{7-x}$ thin films with the 1st annealing temperature of $500^{\circ}C$ were $0.27{\mu}m$, $59.7M{\Omega}$ and -3.7 %/K, respecvitely.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 추계학술발표대회
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• pp.36.2-36.2
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• 2009

Low dielectric materials have been great attention in the semiconductor industry to develop high performance interlayer dielectrics with low k for Cu interconnect technology. In our study, the dielectric properties of SiOC /SiO2 thin film derived from polyphenylcarbosilane were investigated as a potential interlayer dielectrics for Cu interconnect technology. Polyphenylcarbosilane was synthesized from thermal rearrangement of polymethylphenylsilane around $350^{\circ}C{\sim}430^{\circ}C$. Characterization of synthesized polyphenylcarbosilane was performed with 29Si, 13C, 1H NMR, FT-IR, TG, XRD, GPC and GC analysis. From FT-IR data, the band at 1035 cm-1 is very strong and assigned to CH2 bending vibration in Si-CH2-Si group, indicating the formation of the polyphenylcarbosilane. Number average of molecular weight (Mn) of the polyphenylcarbosilane synthesized at $400^{\circ}C$ for 6hwas 2, 500 and is easily soluble in organic solvent. SiOC/SiO2 thin film was fabricated on ton-type silicon wafer by spin coating using 30wt % polyphenylcarbosilane incyclohexane. Curing of the film was performed in the air up to $400^{\circ}C$ for 2h. The thickness of the film is ranged from $1{\mu}m$ to $1.7{\mu}m$. The dielectric constant was determined from the capacitance data obtained from metal/polyphenylcarbosilane/conductive Si MIM capacitors and show a dielectric constant as low as 2.5 without added porosity. The SiOC /SiO2 thin film derived from polyphenylcarbosilane shows promising application as an interlayer dielectrics for Cu interconnect technology.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권1호
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• pp.51-54
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• 2009

Transparent Cuprous oxide film was deposited by rapid thermal oxidation (RTO) of Cu at $500^{\circ}C$/45s condition on textured single-crystal n-Si substrate to form $Cu_2O$/n-Si heterojunction photodiode. The Hall effect measurements for the $Cu_2O$ films showed a p-type conductivity. The photovoltaic and electrical properties of the junction at room temperature were investigated without any post-deposition annealing. I-V characteristics revealed that the junction has good rectifying properties. The C-V data showed abrupt junction and a built-in potential of 1 V. The photodiode showed good stability and high responsivity in the visible at three regions; 525 nm, 625-700 nm, and 750nm denoted as regions A, B, and C, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 제6회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.43-46
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• 2004

CuPc와 $C_{60}$을 이용하여 ITO/CuPc/Al의 CuPc 단층구조와 $ITO/CuPc/C_{60}/Al$의 이종접합 구조에서의 광기전 특성을 연구하였다. CuPc 단층구조에서는 CuPc층의 두께를 10nm에서 50nm로 가변하여 전압-전류 특성을 측정한 결과 40nm 부근에서 최적화된 전기적인 특성이 나타났으며, $CUPC/C_{60}$의 이종접합 구조에서는 CuPc와 $C_{60}$의 두께 비율을 1 : 1 (20nm : 20nm), 1 : 2 (20nm : 40nm), 1 : 3 (20nm : 60nm)으로 가변하여 측정한 결과, 1 : 2의 두께비에서 최적화된 특성을 얻었다. 광원은 500W Xe lamp(ORIEL 66021)를 이용하였으며, 광원의 세기는 보정된 radiometer/photometer (International Inc. IL14004)와 Si-photodiode로 측정하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.237-241
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• 2000

The effects of Si addition on the precipitation processes of in Al-Cu-Si alloy films were studied by the transmission electron microscopy. Deposition of an Al-1.5Cu-1.5Si (wt. %) film at $305^{\circ}C$ resulted in formation of fine, uniformly distributed spherical $\theta$-phase particles due to the precipitation of the $\theta$ and Si phase particles during deposition. For deposition at $435^{\circ}C$, fine $\theta$-phase particles precipitated during wafer cooldown, while coarse Si nodules formed at the sublayer interface during deposition. The film susceptibility to corrosion is discussed in relation to the film microstructure and deposition temperature.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2008년도 추계종합학술대회 B
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• pp.612-614
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• 2008

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10nm to 50nm, we have obtained that the optimum CuPc layer thickness is around 40nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$C_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc:$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL14004).

• 한국자기학회지
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• 제5권5호
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• pp.864-873
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• 1995

비정질 $Fe_{73.5}Cu_{1}Nb_{3}Si_{16.5}B_{6}$ 리본을 DSC 곡선상의 최초 발열반응 전 후의 온도인 $500^{\circ}C$ 및 $552^{\circ}C$에서 열처리하여 열처리 시간에 따른 초미립상의 생성 과정을 뫼스바우어 분광법으로 분석하였다. 열처리된 시료에 생성된 결정상은 대부분 $DO_{3}Fe-Si$이었으며, $t-Fe_{3}B$로 추정되는 강자 성상도 소량 확인되었으며, 비정질상도 잔류하여 공존함을 확인하였다. $DO_{3}Fe-Si$내의 Si 조성 즉, Si/(Fe+Si)는 $500^{\circ}C$ 60분 열처리에서 0.218 이었으며, $552^{\circ}C$ 10분 열처리에서 0.222이었다. 열처리 시간이 120분이 될 때까지 이들 두 값은 감소한 후 계속된 열처리에서 0.210으로 거의 일정하게 유지되었다. 열처리 시간 에 따른 Si 조성의 변화는 초미세자기장과 이성질체이동의 변화를 유발시킨 것으로 분석할 수 있었다. 즉, Fe-Si의 평균초미세자기장의 증가와 평균이성질체이동의 감소는 Si 조성의 증가에 기인됨을 알 수 있었다. 잔류비정질의 체적분율은 초기에 급격히 감소하여 $500^{\circ}C$와 $552^{\circ}C$ 둘 다의 열처리 온도에서 120분 이후 거의 일정해 진다. 120분 이후 Fe-Si와 잔류비정질의 체적분율의 미소한 변화에도 불구하고 잔류비 정질의 평균초미세자기장의 현저한 감소는 잔류비정질내의 Nb와 B 원소의 양의 증가에 기인된다. 결정질의 체적분율은 예측과는 달리 $500^{\circ}C$에서 180분 열처리될 경우 81 %, $552^{\circ}C$에서 960분 열처리될 경우 77 % 이었다.

• 한국표면공학회지
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• 제32권3호
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• pp.433-439
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• 1999

In this study, the diffusion barrier properties of $1000\AA$ thick molybdenum compounds (Mox=1-5 Si) were investigated using sheet resistance measurements, X-ray diffractometry (XRD), and Rutherford back scattering spectrometry (RBS). Each barrier material was deposited by the de and rf magnetron co-sputtering of Mo and Si, respectively, and annealed at $500-700^{\circ}C$ for 30 min in vacuum. Each barrier material was failed at low temperatures due to Cu diffusion through grain boundaries and defects of barrier thin films or through the reaction of Cu with Si within Mo-barrier thin films. It was found that Mo rich thin films were less effective than Si rich films to Cu penetration activating Cu reaction with the substrate at a temperature higher than $500^{\circ}C$.

• Journal of Korean Vacuum Science & Technology
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• 제1권1호
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• pp.30-37
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• 1997

Interactions of Cu films with Si substrates separated by thin layers of molybdenum and molybdenum nitride were investigated in the viewpoint of diffusion barrier to copper. the diffusion barrier behavior of the layers was studied as functions of deposition and annealing conditions by cross-sectional transmission electron microscopy and Nomarski microscopy. the layers deposited at $N_2$ gas ratios of 0.4 and 0.5 exhibited good diffusion barrier behaviors up to $700^{\circ}C$, mainly due to the phase transformation of molybdenum to $\gamma$-Mo$_2$N phase. The increase in the N gas ratio in deposition elevates the lower limit of barrier failure temperature. Futhermore, amorphous molybdenum nitride films deposited at 20$0^{\circ}C$ and 30$0^{\circ}C$ did not fail, while the crystalline $\gamma$-Mo$_2$N films deposited at 40$0^{\circ}C$ and 50$0^{\circ}C$ showed signs of interlayer interactions between Cu and Si after annealing at 75$0^{\circ}C$ for 30 minutes. Therefore, the amorphous nature of the molybdenum nitride layer enhanced its ability to reduce Cu diffusion and its stability as a diffusion barrier at elevated temperatures.