• 한국기계가공학회지
• /
• 제12권5호
• /
• pp.30-35
• /
• 2013

In order to increase cell efficiency in crystalline silicon solar cell, reduction of light reflection is one of the essential problem. Until now silicon wafer was textured by wet etching process which has random patterns along crystal orientation. In this study, high aspect ratio patterns are manufactured by nano imprint process and reflectance could be minimized under 1%. After that, screen printed solar cell was fabricated on the textured wafer and I-V characteristics was measured by solar simulator. Consequently cell efficiency of solar cell fabricated using the wafer textured by nano imprint process increased 1.15% than reference solar cell textured by wet etching. Internal quantum efficiency was increased in the range of IR wave length but decreased in the UV wavelength. In spite of improved result, optimization between nano imprinted pattern and solar cell process should be followed.

• 전자공학회논문지A
• /
• 제31A권8호
• /
• pp.53-61
• /
• 1994

Intermetallic dielectric layer was formed by using SiO$_2$/SOG/SiO$_2$ for aluminum based dual-metal interconnection process and its electric characteristics were evaluated. The dielectric layer was in the cost and facility point of view more useful than the insulator that was formed by etch-back process. The planarity by using SOG process was about 40% higher than that of the insulator by the CVD process. When SiO$_2$ films were deposited by the PECVD process the Al hillock formation during the next process was restrained bucause the intermetalic insulator was made at low temperature. The leakage current was 1${\times}10^{7}~1{\times}10^{-8}A/cm^{2}$ at the electric field of 10$^{5}$V/cm and breakdown filed was 4.5${\times}10^{6}~7{\times}10^{6}A/cm$. So we had confirmed that siloxane SOG was very useful for intermetallic layer material.

• 한국산업보건학회지
• /
• 제11권3호
• /
• pp.219-228
• /
• 2001

Objective : For the purpose of preparing the fundamental data and health promotion and control program on organic solvents in air of manufacturing industry. Methods : The author surveyed number of organic solvent components which was used in working site and also determined the organic solvents concentration in air of 927 manufacturing industries and 1,267 working process with gas chromatography(NIOSH manual) for five years from 1995 to 1999. Results : Mean number of solvents components by type of industry, working process was number of 12. There were exceeded to TLV of 1,2-dichloroethane in textile manufacturing industry N,N-dimethyl furan in tanning and dressing of leather ; luggage, handbags, saddlery, harness and footwear manufacturing industry and chemical and chemical product manufacturing industry by type of industry. There were exceeded to TLV of 1,2-dichloroethane in handwriting and drawing process, cellosolve in adhesive spreading process, N,N-dimethly furan in production of solvent process and adhesion process by working process Total exceeded rate to threshold limit values of organic solvents mixture were 12.9% for EI(Exposure index) and 10.0% for Em(Estimation of mixture) by type of industry, 11.3% for EI and 8.2% for Em by type of working process. The highest exceed rate was 36.7% for EI in tanning and dressing of leather ; luggage handbags, saddlery, harness and footwear manufacturing industry and 29.0% for Em in textile manufacturing industry. The highest exceeded rate was 23.1% for EI and 12.5% for Em in adhesive spreading process by working process. Mean values of total subjects by type of industry and type of working process were $0.7{\pm}1.8$ for EI and $0.7{\pm}1.7$ for Em respectively. Conclusions : As above results, the author suggest that it makes the environmental control program on 1.2-dichloroethane, N,N-dimethyl furan, cellosolve by kind of organic solvent and on textile manufacturing industry, tanning and dressing of leather ; luggage, handbags, saddlery harness and footwear manufacturing industry by type of industry, and on handwriting, drawing process and adhesive spreading process and adhesion process by type of working process.

• 소성∙가공
• /
• 제7권5호
• /
• pp.496-504
• /
• 1998

The eccentric extrusion and bending process for the forming of the curved rectangular hollow tube is newly developed. Generally the bending process of hollow tube is the secondary process followed by the extrusion process of the hollow tube from the round billet. So many defects such as wrinkling and the difference of wall thickness can be happened during the secondary bending process. In order to avoid the defects the new process named as "the eccentric extrusion and bending process" is suggested and applied to the U-bending of rectangular hollow tube. In this paper the kinematically admissible velocity field between the dies surface and the internal plug boundary surface s developed for the curving velocity. By the using of this curving velocity field the curvature of extruded products can be calculated with the parameters such as eccentricity dies length friction constant aspect ratio.

• 한국경영과학회:학술대회논문집
• /
• 한국경영과학회/대한산업공학회 2005년도 춘계공동학술대회 발표논문
• /
• pp.723-729
• /
• 2005

Traditional statistical process control(SPC) applied to discrete part industry in the form of control charts can look for and eliminate assignable causes by process monitoring. On the other hand, engineering process control(EPC) applied to the process industry in the form of feedback control can maintain the process output on the target by continual adjustment of input variable. This study presents controlling and monitoring rules adopted variable sampling interval(VSI) to change sampling intervals in a predetermined fashion on the predicted process levels for integrated EPC and SPC systems. Twelve rules classified by EPC schemes(MMSE, constrained PI, bounded or deadband adjustment policy) and type of sampling interval combined with EWMA chart of SPC are proposed under IMA(1,1) disturbance model and zero-order (responsive) dynamic system. The properties of twelve control rules under three patterns of process change(sudden shift, drift and random shift) are evaluated and discussed through simulation and control rules for integrated VSI EPC and SPC systems are recommended.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
• /
• pp.1360-1363
• /
• 1996

EPD(End Point Detection) is used to decide etching degree of layer which must be removed at wafer etching process in plasma etching process which is one of the most important process in semiconductor manufacturing. In this thesis, the method which detects malfunction of etching process in real-time will be discussed. Several EPD signal traces are collected in normal plasma etching condition and used as reference EPD signal traces. Critical points can be detected by applying differentiation and zero-crossing techniques to reference EPD signal. Mean and standard deviation of critical parameters which is memorized from reference EPD signal are calculated and these determine the lower and higher limit of control chart. And by applying statical control chart to EPD signals which are collected in real etching process malfunctions of process are detected in real-time. By means of applying this method to the real etching process we prove our method can accurately detect the malfunction of etching process and can compensate disadvantage of current industrial method.

• 한국주거학회논문집
• /
• 제17권3호
• /
• pp.79-87
• /
• 2006

The purpose of this study is to propose an architectural design process adopting design concepts with weight on them. The process of the study is as follow; First, design concepts for the study are classified by the hierarchy. Developing process of those design concepts which had been adopted for a creative thinking was investigated. Second, after putting different weight on diverse design concepts, this study propose a design process adopting design concepts with different weight. Finally, the proposed process adopting design concepts with weight was verified through a case study of elementary school project. The case study was carried out by questionnaires 3 times. Experimental results verified the hypothesis which was about the process adopting design concepts with different weight. Architects can precede their design process with confidence about setting design concepts by the result of this study.

• 한국기계가공학회지
• /
• 제2권2호
• /
• pp.45-51
• /
• 2003

The multi-piloting type progressive die for U-bending sheet metal production part is a very specific division. This study reveals the sheet metal forming process with multi-forming die by center carrier type feeding system. Through the FEM simulation by DEFORM, it was accepted to u-bending process as the first performance to design of strip process layout. The next process of die development was studied according to sequence of die development, i.e die structure, machining condition for die making, die materials, heat treatment of partially die components, know-how and so on. The feature of this study is the die development of scrapless progressive die of multi-stage through the modeling on the I-DEAS program, components drawing on the Auto-LISP, CAD/CAM application, ordinary machine tool operating and revision by tryout.

• 대한전자공학회논문지
• /
• 제27권4호
• /
• pp.571-579
• /
• 1990

A dynamic relocation algorithm for non-deterministic process graph in distributed computer systems is proposed. A method is represented for determining the optimal policy for processing a process tree. A general database query request is modelled by a process tree which represent a set of subprocesses together with their precedence relationship. The process allocation model is based on operating cost which is a function fo selection of site for processing operation, data reduction function and file size. By using expected values of parameters for non-deterministic process tree, the process graph and optimal policy that yield minimum operating cost are determined. As process is relocated according to threshold value and new information of parameters after the execution of low level process for non-deterministic process graph, the assigned state that approximate to optiaml solution is obtained. The proposed algorihtm is heuristic By performing algorithm for sample problems, it is shown that the proposed algorithm is good in obtaining optimal solution.

• 상하수도학회지
• /
• 제18권6호
• /
• pp.778-784
• /
• 2004

Dyeing wastewater contains recalcitrant organics which can not be easily treated by conventional biological treatment. Therefore it has to be treated by other advanced oxidation process in order to remove COD and Color more efficiently. Fenton oxidation process is one of the most commonly applied processes in removal of COD and color for the dyeing wastewater. However it increase the treatment cost and the production of sludge by the use of the excessive chemical reagent. Ozonation is not suitable in Single treatment process because it is not effective in organics removal compared with Color removal. The purpose of this research in order to evaluate the comparable removal efficiency of COD and color by the combination of advanced oxidation processes for the dyeing wastewater. The sequential treatment processes of Fenton process and ozonation was more effective to remove organics and color than ozonation and Fenton process. The result of Fenton process for the pretreatment presented as the 81% removal of organics whereas ozonation process for the pretreatent presented as the 22.1% removal of organics. The removal of colour was higher as 81.3% for the ozonation as the pretreatment than 77.7% for the Fenton process as the pretreatment.