• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• The Korea Journal of Herbology
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• v.31 no.4
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• pp.61-69
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• 2016

Objectives : This study is to propose discriminative keys with stereoscope for minute seed herbs easily mixed up, but hard to discriminate by naked eyes: Alli Tuberosi Semen(ATS)✳Alli Fistulosi Semen(AFS), Malvae Semen(MS)✳ Abutili Semen(AS), Plantaginis Semen(PS)✳Schizonepetae Semen(SS).Objectives : We reviewed the description of original plants and medicinal herbs from literature. The specimen of original plant were collected, determinated and compared to samples in the market. Primary classification was performed with naked eyes. and we found out other discrimination keys for non-distinctive herbs with stereoscope. Discrimination keys were set as the morphological criteria of authentic herbs, percentage of adulteration, and standards for discriminating genuine herbs from adulteration.Results : 1) ATS is bigger, has reticulate pattern on protuberant side and unique garlic chives taste. AFS which is usually mixed up, is smaller, has 1~2 ridges and unique welsh onion taste. 2) MS is smaller, has no villus, but its length of bumps are similar. AS easily mixed up, is bigger and has white villus. Its upper side bump is longer and more sharp. 3) PS has dent at middle of the back side. It becomes very sticky when it is put or boiled in water. SS which can be mixed up has no dent and low viscosity compared to PS.Conclusions : With this result, we propose discriminative keys which can identify the original plants and processed herbal state of six herbs. Because minute medicinal herbs are hardly distinguishable by sensory test, It is essential to differentiate by using stereoscope.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.395-403
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• 2012

This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.4
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• pp.396-401
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• 2015

A door checker holds a car door at several opening angles and limits the maximum door opening, so that the door does not bump against to passengers. Recently, the performance of door checker becomes more important as the feeling of door opening and closing effects on the quality of a car. However, some of door checkers make squealing noise when they are used for ages, which causes consumer's complaints as well as decreasing commercial value of the product. In this study, after various experiments for the noise, we concluded that the major reasons of the noise are acceleration of wearing and loss of lubricant due to impurities in working parts. Therefore, we developed a new mechanism of door checker which can resolve the major reasons of the noise. The developed mechanism is effective to prevent inflow of impurities and loss of lubricant by locating working parts in the case. We also proved that the developed mechanism does not make any noise after the test of 50,000 times of operations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.123-123
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• 2012

최근 연구되고 있는 TSV(Through Silicon Via) 기술은 Si 웨이퍼 상에 직접 전기적 연결 통로인 관통홀을 형성하는 방법으로 칩간 연결거리를 최소화 할 수 있으며, 부피의 감소, 연결부 단축에 따른 빠른 신호 전달을 가능하게 한다. 이러한 TSV 기술은 최근의 초경량화와 고집적화로 대표되는 전자제품의 요구를 만족시킬 수 있는 차세대 실장법으로 기대를 모으고 있다. 한편, 납땜 재료의 주 원료인 주석은 주로 반도체 소자의 제조, 반도체 칩과 기판의 접합 및 플립 칩 (Flip Chip) 제조시의 범프 형성 등 반도체용 배선재료에 널리 사용되고 있다. 최근에는 납의 유해성 때문에 대부분의 전자제품은 무연솔더를 이용하여 제조되고 있지만, 주석을 이용한 반도체 소자가 고밀도화, 고 용량화 및 미세피치(Fine Pitch)화 되고 있기 때문에, 반도체 칩의 근방에 배치된 주석으로부터 많은 알파 방사선이 방출되어 메모리 셀의 정보를 유실시키는 소프트 에러 (Soft Error)가 발생되는 위험이 많아지고 있다. 이로 인해, 반도체 소자 및 납땜 재료의 주 원료인 주석의 고순도화가 요구되고 있으며, 특히 알파 방사선의 방출이 낮은 로우알파솔더 (Low Alpha Solder)가 요구되고 있다. 이에 따라 본 연구는 4인치 실리콘 웨이퍼상에 직경 $60{\mu}m$, 깊이 $120{\mu}m$의 비아홀을 형성하고, 비아 홀 내에 기능 박막증착 및 전해도금을 이용하여 전도성 물질인 Cu를 충전한 후 직경 $80{\mu}m$의 로우알파 Sn-1.0Ag-0.5Cu 솔더를 접합 한 후, 접합부 신뢰성 평가를 수행을 위해 고속 전단시험을 실시하였다. 비아 홀 내 미세구조와 범프의 형상 및 전단시험 후 파괴모드의 분석은 FE-SEM (Field Emission Scanning Electron Microscope)을 이용하여 관찰하였다. 연구 결과 비아의 입구 막힘이나 보이드(Void)와 같은 결함 없이 Cu를 충전하였으며, 고속전단의 경우는 전단 속도가 증가할수록 취성파괴가 증가하는 경향을 보였다. 본 연구를 통하여 전해도금을 이용한 비아 홀 내 Cu의 고속 충전 및 로우알파 솔더 볼의 범프 형성이 가능하였으며, 이로 인한 전자제품의 소프트에러의 감소가 기대된다.

• Journal of the Korea institute for structural maintenance and inspection
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• v.25 no.6
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• pp.19-26
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• 2021

The seismic isolation system have been applied in order to protect the collapse of bridge by seismic load and the vertical load transmitted from the superstructure. However, the failure and damages of non-shrinkage mortar, isolator and wedge in total 12 bridge were reported by Pohang Earthquake. In this study, the damage mechanism and behavior characteristics of elastomeric bearing by an earthquake were evaluated to consider the seismic isolation system including non-shrinkage mortar and the seat concrete of pier. To discuss the effect of installed wedge and damage mode of elastomeric bearing, the compressive-shear tests were carried out. Also, the mechanical behaviors and damage mechanism for each component of elastomeric bearing were evaluated by using finite element analysis. From the test results, the cracks were created at boundary between non-shrinkage mortar and seismic isolator and the shear loads were rapidly increased after bump into wedge. The cause for damage mechanism of seismic isolation system was investigated by comparing stress distribution of anchor socket and non-shrinkage mortar depending on wedge during earthquake.

• Tribology and Lubricants
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• v.35 no.1
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• pp.44-51
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• 2019

The paper presents the rotordynamic performance measurements and model predictions of a fuel cell electric vehicle (FCEV) air compressor supported on gas foil bearings (GFBs). The rotor has an impeller on one end and a thrust runner on the other end. The front (impeller side) and rear (thrust side) gas foil journal bearings (GFJBs) are located between the impeller and thrust runner to support the radial loads, and a pair of gas foil thrust bearings are located on both sides of the thrust runner to support the axial loads. The test GFJBs have a partial arc shim foil installed between the top foil and bump strip layers to enhance hydrodynamic pressure generation. During the rotordynamic performance tests, two sets of orthogonally installed eddy-current displacement sensors measure the rotor radial motions at the rotor impeller and thrust ends. A series of speed-up and coast-down tests to 100k rpm demonstrates the dominant synchronous (1X) rotor responses to imbalance masses without noticeable subsynchronous motions, which indicates a rotordynamically stable rotor-GFB system. Finite element analysis of the rotor determines the rotor free-free (bending) natural modes and frequencies well beyond the maximum rotating frequency. The predicted damped natural frequencies and damping ratios of the rotor-GFB system reveal rotordynamic stability over the speeds of interest. The imbalance response predictions show that the predicted critical speeds and rotor amplitudes strongly agree with the test measurements, thus validating the developed rotordynamic model.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.7-15
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• 2006

In-situ observation of electromigration in thin film pattern of 63Sn-37Pb solder was performed using a scanning electron microscope system. The 63Sn-37Pb solder had the incubation stage of electromigration for edge movement when the current density of $6.0{\times}10^{4}A/cm^2$ was applied the temperature between $90^{\circ}C\;and\;110^{\circ}C$. The major diffusion elements due to electromigration were Pb and Sn at temperatures of $90-110^{\circ}C\;and\;25-50^{\circ}C$, respectively, while no major diffusion of any element due to electromigration was detected when the test temperature was $70^{\circ}C$. The reason was that both the elements of Sn and Pb were migrated simultaneously under such a stress condition. The existence of the incubation stage was observed due to Pb migration before Sn migration at $90-110^{\circ}C$. Electromigration behavior of 63Sn-37Pb solder had an incubation time in common for edge drift and void nucleation, which seemed to be related the lifetime of flip chip solder bump. Diffusivity with $Z^*$(effective charges number) of Pb and Sn were strongly affect the electromigration-induced major diffusion element in SnPb solder by temperature, respectively.