Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 13 Issue 1 Serial No. 38
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- Pages.7-15
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- 2006
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
In-situ Analysis of Temperatures Effect on Electromigration-induced Diffusion Element in Eutectic SnPb Solder Line
공정조성 SnPb 솔더 라인의 온도에 따른 Electromigration 확산원소의 In-situ 분석
- Kim Oh-Han (School of Materials Science and Engineering, Andong National University, Hybrid FCBGA, R&D Center, STATS ChipPAC KOREA) ;
- Yoon Min-Seung (School of Materials Science and Engineering, Seoul National University) ;
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Joo Young-Chang
(School of Materials Science and Engineering, Seoul National University) ;
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Park Young-Bae
(School of Materials Science and Engineering, Andong National University)
- 김오한 (안동대학교 신소재공학부, 스태츠칩팩 코리아 R&D center) ;
- 윤민승 (서울대학교 재료공학부) ;
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주영창
(서울대학교 재료공학부) ;
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박영배
(안동대학교 신소재공학부)
- Published : 2006.03.01
Abstract
In-situ observation of electromigration in thin film pattern of 63Sn-37Pb solder was performed using a scanning electron microscope system. The 63Sn-37Pb solder had the incubation stage of electromigration for edge movement when the current density of
63Sn-37Pb 솔더의 실시간 electromigration 거동 관찰을 박막형 edge 이동 선형시편과 주사전자현미경을 이용하여 실시하였다. 공정조성 63Sn-37Pb 솔더의 electromigration에 의한 edge 이동 잠복기는
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