• 제목/요약/키워드: Bulk-micromachining

검색결과 84건 처리시간 0.02초

Polymer MEMS 공정을 이용한 의료용 미세 부품 성형 기술 개발 (Development of micro check valve with polymer MEMS process for medical cerebrospinal fluid (CSF) shunt system)

  • 장준근;박찬영;정석;김중경;박훈재;나경환;조남선;한동철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.1051-1054
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    • 2000
  • We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2*0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5*2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

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Piezo-electrically Actuated Micro Corner Cube Retroreflector (CCR) for Free-space Optical Communication Applications

  • Lee, Duk-Hyun;Park, Jae-Y.
    • Journal of Electrical Engineering and Technology
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    • 제5권2호
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    • pp.337-341
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    • 2010
  • In this paper, an extremely low voltage operated micro corner cube retroreflector (CCR) was fabricated for free-space optical communication applications by using bulk silicon micromachining technologies. The CCR was comprised of an orthogonal vertical mirror and a horizontal actuated mirror. For low voltage operation, the horizontal actuated mirror was designed with two PZT cantilever actuators, torsional bars, hinges, and a mirror plate with a size of $400{\mu}m{\times}400{\mu}m$. In particular, the torsional bars and hinges were carefully simulated and designed to secure the flatness of the mirror plate by using a finite element method (FEM) simulator. The measured tilting angle was approximately $2^{\circ}$ at the applied voltage of 5 V. An orthogonal vertical mirror with an extremely smooth surface texture was fabricated using KOH wet etching and a double-SOI (silicon-on-insulator) wafer with a (110) silicon wafer. The fabricated orthogonal vertical mirror was comprised of four pairs of two mutually orthogonal flat mirrors with $400{\mu}m4 (length) $\times400{\mu}m$ (height) $\times30{\mu}m$ (thickness). The cross angles and surface roughness of the orthogonal vertical mirror were orthogonal, almost $90^{\circ}$ and 3.523 nm rms, respectively. The proposed CCR was completed by combining the orthogonal vertical and horizontal actuated mirrors. Data transmission and modulation at a frequency of 10 Hz was successfully demonstrated using the fabricated CCR at a distance of approximately 50 cm.

3차원 LIGA 미세구조물 제작을 위한 마이크로 액추에이터 내장형 X-선 마스크 (Deep X-ray Mask with Integrated Micro-Actuator for 3D Microfabrication via LIGA Process)

  • 이광철;이승섭
    • 대한기계학회논문집A
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    • 제26권10호
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    • pp.2187-2193
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    • 2002
  • We present a novel method for 3D microfabrication with LIGA process that utilizes a deep X-ray mask in which a micro-actuator is integrated. The integrated micro-actuator oscillates the X-ray absorber, which is formed on the shuttle mass of the micro-actuator, during X-ray exposures to modify the absorbed dose profile in X-ray resist, typically PMMA. 3D PMMA microstructures according to the modulated dose contour are revealed after GG development. An X-ray mask with integrated comb drive actuator is fabricated using deep reactive ion etching, absorber electroplating, and bulk micromachining with silicon-on-insulator (SOI) wafer. 1mm $\times$ 1 mm, 20 $\mu$m thick silicon shuttle mass as a mask blank is supported by four 1 mm long suspension beams and is driven by the comb electrodes. A 10 $\mu$m thick, 50 $\mu$m line and spaced gold absorber pattern is electroplated on the shuttle mass before the release step. The fundamental frequency and amplitude are around 3.6 kHz and 20 $\mu$m, respectively, for a do bias of 100 V and an ac bias of 20 $V_{p-p}$ (peak-peak). Fabricated PMMA microstructure shows 15.4 $\mu$m deep, S-shaped cross section in the case of 1.6 kJ $cm^{-3}$ surface dose and GG development at 35$^{\circ}C$ for 40 minutes.

LED 빔조형에 의한 초소형 이미징 장치의 제조 기술 (LED Beam Shaping and Fabrication of Optical Components for LED-Based Fingerprint Imager)

  • 주재영;송상빈;박순섭;이선규
    • 대한기계학회논문집A
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    • 제36권10호
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    • pp.1189-1193
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    • 2012
  • 본 연구는 초소형 광학 시스템을 구현할 수 있는 설계 및 제작의 방법론을 제시하고자 한다. 초소형 광학계에서는 조명 및 결상 광학소자의 성능과 소형화가 조광면의 균질도와 결상 된 이미지의 선명도에 중요한 영향을 미치게 된다. 본 연구에서는 얇은 두께로 실효 광도를 배가시키기 위한 초박형의 LED 빔조형 렌즈를 설계 제작하였다. 상기 렌즈는 중앙부의 비구면렌즈와 외각의 전반사 프레넬 가장자리 부로 구성되어 있다. 설계된 LED 빔조형 렌즈(직경 4.7 mm, 두께 0.6 mm)는 다이아몬드 선삭으로 중앙 비구면부의 전반사(TIR) 가장자리가 정밀하게 가공되었으며, LED 의 빔각을 150 도에서 17.5 도로 축소 시켰다. 다른 광학소자들 마이크로 프리즘, 결상광학용 프레넬 렌즈, 광가이드는 다양한 마이크로 나노 크기의 제조공정으로 일체형으로 성형되었다. 시작품으로 제작된 초소형 광학계($6.8{\times}2.2{\times}2.5mm$)는 마이크로 패턴을 결상의 가능성을 보여주었고, 지문인식용 초소형광학계로서의 성능을 검증하였다.