• Journal of the Korea Concrete Institute
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• v.25 no.2
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• pp.137-144
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• 2013

The use of fiber-reinforced polymer (FRP) reinforcing bars in concrete structures has been increased as an alternative of steel reinforcement which has shown greater vulnerability to corrosion problem. However, the long-term performance of concrete members with FRP reinforcement is still questioned in comparison to the used of steel reinforcement. This study presents the results of an experimental study on the long-term behaviors of GFRP (glass fiber reinforced polymer) bar reinforced concrete beams after exposed to accelerated aging in an environmental chamber with temperature of $46^{\circ}C$ ($115^{\circ}F$) and 80% of relative humidity up to 300 days. The objectives of this research was to compare strength degradation and change of ductility between GFRP reinforced concrete beams and steel reinforcement beams after accelerated aging. Two types (wrapped and sand-coated surface) of GFRP bars and steel were reinforced. in concrete beams. Test results show that the failure modes of GFRP bar reinforced concrete beams are very similar with traditional RC beams, and the change of load-carrying capacity of steel reinforcing concrete beam is greater than that of GFRP bar reinforcing concrete beam under the accelerated aging. Test result also shows that the use of GFRP reinforcing in concrete could be introduced more brittle failure than that of steel reinforcing for practical application. The deformability factor up to compression failures indicates no significant variation before and after exposure of accelerated aging.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.5
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• pp.527-533
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• 1999

Hertzian indentation tests with spherical indenters in water were conducted to examine the contact fatigue in three dental ceramics, such as feldspathic porcelain, micaceous glass-ceramic (MGC) and glass-infiltrated alumina, which was used as dental restorations, and evaluated the effect of contact damage on strength. Initial damage was dependent of microstructure, showing cone cracks of brittle behavior in the feldspathic porcelain and deformation of quasi-plastic behavior in the MGC, with an intermediate case in the glass-infiltrated alumina. However, as increasing the number of cyclic loading (n=1~n =$10^6$)all materials showed an abrupt strength degradation, at which fracture was originated from damage in the contact fatigue. There were two strength degradation with increasing the number of cyclic loading in specific loads (200N, 500N, 1000N):first was from the cone cracks, and second was from the radial cracks created by cyclic loading. The radial cracks, once formed, led to rapid degradation in strength properties, Finally the material was failed at the high number of cyclic loading. Strength degradation with indentation load at fixed number of cyclic loading indicated that the feldspathic porcelain should be highly damage tolerant to the contact fatigue.

• Geophysics and Geophysical Exploration
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• v.13 no.4
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• pp.378-387
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• 2010

We present the results of laboratory measurement of porosity and electrical resistivity for the samples collected near marine hydrothermal deposit to provide fundamental perspective of physical properties for future electromagnetic survey. The rock cores are sampled from the host rock, pumice, hydrothermal altered zone, and chimney. These samples are featured as easily brittle, rough surface with large pores, having components easily solvable in the water. We suggest systematic approach for measuring weights, volumes of core samples to calculate density and porosity. Measurements reveal that the resistivities of black host rock, gray host rock, pumice and chimney are 102, 39, 11, 0.1 ohm-m, respectively, when the core samples are saturated with saline water of $32,000\;{\mu}S$/cm (0.5 ohm-m) at temperature of $2.5^{\circ}C$ and these correspond to the factors of 5 for sea water, 110 for pumice and 390~1020 for host rocks with respect to the resistivity of chimney. We also confirm that resistivity of rock samples saturated with water decrease with temperature linearly over the temperature range of $20{\sim}80^{\circ}C$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.23 no.1
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• pp.81-94
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• 2010

This paper deals with the fracture simulation of UHPFRC girder with the interface type model. Based on the existing numerical simulation of quasi-brittle fracture in normal strength concrete, constitutive modeling for UHPFRC I-girder has been improved by including a tensile hardening at the failure surface. The finite element formulation is based on a triangular unit, constructed from constant strain triangles, with nodes along its sides and neither at the vertex nor the center of the unit. Fracture is simulated through a hardening/softening fracture constitutive law in tension, a softening fracture constitutive law in shear as well as in compression at the boundary nodes, with the material within the triangular unit remaining linear elastic. LCP is used to formulate the path-dependent hardening-softening behavior in non-holonomic rate form and a mathematical programming algorithm is employed to solve the LCP. The piece-wise linear inelastic yielding-failure/failure surface is modeled with two compressive caps, two Mohr-Coulomb failure surfaces, a tensile yielding surface and a tensile failure surface. The comparison between test results and numerical results indicates this method effectively simulates the deformation and failure of specimen.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Korea Concrete Institute
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• v.17 no.2 s.86
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• pp.201-212
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• 2005

A new strut-tie model using secant stiffness, Direct Inelastic Strut-Tie Model, was developed. Since basically the proposed design method uses linear analysis, it is convenient and stable in numerical analysis. At the same time, the proposed design method can accurately estimate the inelastic strength and ductility demands of struts and ties because it can analyzes the inelastic behavior of structure using iterative calculations for secant stiffness. In the present study, the procedure of the proposed design method was established, and a computer program incorporating the proposed method was developed. Design examples using the proposed method were presented, and its advantages were highlighted by the comparison with the traditional strut-tie model. The Direct Inelastic Strut-Tie Model, as an integrated analysis/design method, can directly address the design strategy intended by the engineer to prevent development of macro-cracks and brittle failure of struts. Since the proposed model can analyze the inelastic deformation, indeterminate strut-tie model can be used. Also, since the proposed model controls the local deformations of struts and ties, it can be used as a performance-based design method for various design criteria.

• Journal of the Korea Concrete Institute
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• v.13 no.4
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• pp.371-378
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• 2001

Recently, the parameters, models, and experimentations, which evaluate the fracture properties of concrete, have been proposed by many researchers, and their developments allow us to analyze the non-linear and quasi-brittle fracture mechanisms. In this paper, a brief treatment of the fracture parameters was presented and the experiments of 3-point bending tests were conducted to compare J-integral($J_{Ic}$ /) with other parameters($K_{Ic}$ , $G_{v}$ , and $G_{F}$ ). The change of parameter values according to the width and notch length of concrete beam specimens was also considered. The load-displacement curves are used to experimentally measure concrete fracture toughness. From the results of experiment, it is noted that the value of $GF$ and tic decreases as the notch depth increases and $G_{F}$ is less sensitive than $J_{Ic}$ . Therefore, the former is more appropriate to use as the concrete fracture toughness parameter. The values of $v_{v}$ and $J_{Ic}$ increase when the width of concrete specimens increase from 75 mm to 150 mm. Therefore, the effects of specimen width need to be considered in determining the concrete fracture toughness.

• Journal of the Korea Concrete Institute
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• v.20 no.2
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• pp.203-212
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• 2008

The cyclic behavior and energy dissipation mechanism of short coupling beams with various reinforcement layouts were studied. For numerical analysis of coupling beams, nonlinear truss model was used. The results of numerical analysis showed that the coupling beams with conventional reinforcement layout showed pinched cyclic behavior without significant energy dissipation, whereas the coupling beams with diagonal reinforcement exhibited stable cyclic behavior without pinching. The energy dissipation of the coupling beams was developed mainly by diagonal reinforcing bars developing large plastic strains rather than concrete which is a brittle material Based on this result, simplified equations for evaluating the energy dissipation of coupling beams were developed. For verification, the predicted energy dissipation was compared with the test results. The results showed that the simplified equations can predict the energy dissipation of short coupling beams with shear span-to-depth ratio less than 1.25 with reasonable precision, addressing various design parameters such as reinforcement layout, shear span-to-depth ratio, and the magnitude of inelastic displacement. The proposed energy equations can be easily applied to performance-based seismic evaluation and design of reinforced concrete structures and members.

• Journal of the Korean Ceramic Society
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• v.40 no.9
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• pp.867-873
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• 2003

$Si_{3}N_{4}$-BN based machinable ceramics were fabricated by hot-pressing at $1800^{\circ}C$ for 2 h under a pressure of 25 MPa. The microstructure, mechanical properties, and machinability were investigated. With increasing h-BN content from 5 vol% to 30 vol%, three point flexural strength decreased from 1000 MPa of monolithic S $i_3$ $N_4$ to 720～400 MPa. The fracture toughness, $K_{IC}$ , was decreased from 7.6 MPaㆍ$m^{1/2}$ of monolithic S $i_3$ $N_4$ to 6.5～4.1 MPaㆍ$m^{1/2}$. The grain size and aspect ratio of $\beta$-S $i_3$ $N_4$ slightly decreased with increasing h-BN content. S $i_3$ $N_4$ monolith could not be machined due to brittle fracture, but S $i_3$ $N_4$-BN based machinable ceramics could be machined without fracture, showing excellent machinability. With increasing h-BN content, the thurst force during cutting and micro-drilling process was decreased.