• 제목/요약/키워드: Bridge pad

검색결과 47건 처리시간 0.028초

저누설 다이오드를 사용한 저전력 압전발전기의 효율 개선에 관한 연구 (Energy Conversion Efficiency Improvement of Piezoelectric Micropower Generator Adopting Low Leakage Diodes)

  • 김혜중;강성묵;김호성
    • 전기학회논문지
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    • 제56권5호
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    • pp.938-943
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    • 2007
  • In this paper, we show that, in case of piezoelectric micropower generator, just replacing Schottky diodes in the bridge rectifier with ultra-low reverse leakage current diodes improves the mechanical-to-electrical energy conversion efficiency by more than 100%. Experimental and PSPICE simulation results show that, due to the ultra-low leakage current, the charging speed of the circuit employing PAD1 is higher than that of the circuit employing Schottky diodes and the saturation voltage of the circuit employing PAD1 is also higher. This study suggests that , when the internal impedance of source is very large (a few tens of $M{\Omega}$) such that maximum charging current is a few microamperes or less, in order to realize literally the energy scavenging system, ultra-low reverse leakage current diodes should be used for efficient energy conversion. Since low-level vibration is ubiquitous in the environment ranging from human movement to large infrastructures and the mechanical-to-electrical energy conversion efficiency is much more critical for use of these vibrations, we believe that the improvement in the efficiency using ultra-low leakage diodes, as found in this work, will widen greatly the application of piezoelectric micropower generator.

자동차용 커넥팅로드 소재의 피로특성에 관한 연구 (A Study on Fatigue Characteristic of Connecting Rod Material for Automobile)

  • 김현수;박인덕;김창훈;김태규
    • 열처리공학회지
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    • 제19권3호
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    • pp.163-169
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    • 2006
  • Fretting is a kind of surface degradation mechanism observed in mechanical components and structures. The fretting damage decreases into 50-70% of the plain fatigue strength. The connecting rod for automobile has been used in special environments and various loading conditions. Failure of connecting rod in automotive engine may cause catastrophic situation. In this study, we investigated the fatigue characteristic of connecting rod material for an automobile. Fatigue life is defined as the number of cyclic stress to failure by regular cyclic stress. Fatigue life of C70S6 specimen was obtained from 134,000 to 147,000 cycles. Fatigue limit showed 432MPa by normal fatigue test. The other hands, it was 96MPa in the case of fretting fatigue test. It was extremely lower than that of a normal fatigue test. From observation of fracture surface, it was confirmed that the fatigue crack was initiated at the boundary of a specimen and bridge pad.

Lateral arthroplasty along with buccal fat pad inter-positioning in the management of Sawhney type III temporomandibular joint ankylosis

  • Malhotra, Vijay Laxmy;Singh, Virendra;Rao, JK Dayashankara;Yadav, Sunil;Gupta, Pranav;Shyam, Radhey;Kirti, Shruti
    • Journal of the Korean Association of Oral and Maxillofacial Surgeons
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    • 제45권3호
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    • pp.129-134
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    • 2019
  • Objectives: The objective of this study was to highlight the role of lateral arthroplasty along with interposition of the buccal fat pad (BFP) in the management of Sawhney type III temporomandibular joint (TMJ) ankylosis. Materials and Methods: Ten patients with TMJ ankylosis (7 unilateral and 3 bilateral, total of 13 joints) were treated with lateral arthroplasty and BFP interposition. The bony bridge of the ankylotic mass on the lateral aspect was resected, leaving a distance of 1.5 to 2.0 cm from the base of the skull to the neck of the condyle. The condyle was left intact. Coronoidectomy was performed on the ipsilateral side via the same approach in all cases. The inter-incisal opening was measured at that time, and if it was less than 35 mm, contralateral coronoidectomy was performed by using the intra-oral approach. After satisfactory inter-incisal mouth opening (${\geq}35mm$) was achieved, the TMJ surgical site was revisited, and BFP was retrieved and used to cover the lateral aspect of the medially placed condyle. Results: With lateral arthroplasty, the medially displaced condyle can be left in-situ to maintain the mandibular ramal height and function and to act as a growth center in children. Interposition of the BFP prevents reformation of the lateral bony bridge that was removed. Conclusion: Lateral arthroplasty along with interpositioning of the BFP is a novel technique for managing Sawhney type III ankylosis that achieves management goals while avoiding complex and advanced reconstructive surgical procedures.

교량상 slab궤도의 상향력 민감도분석 (Parameteric Analysis for Up-lifting force on Slab track of Bridge)

  • 최성기;박대근;한상윤;강영종
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2007년도 추계학술대회 논문집
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    • pp.1188-1195
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    • 2007
  • The vertical forces in rail fasteners at areas of bridge transitions near the embankment and on the pier will occur due to different deformations of adjoining bridges caused by the trainloads, the settlement of supports, and the temperature gradients. The up-lifting forces is not large problem in the blast track because the elasticity of blast and rail pad buffs up-lifting effect. But, it is likely to be difficult to ensure the serviceability of the railway and the safety of the fastener in the end in that concrete slab track consist of rail, fastener, and track in a single body, delivering directly the up-lifting force to the fastener if the deck is bended because of various load cases, such as the end rotation of the overhang due to the vertical load, the bending of pier due to acceleration/braking force and temperature deviation, the settlement of embankment and pier, the temperature deviation of up-down deck and front-back pier, and the rail deformation due to wheel loads. The analysis of the rail fastener is made to verify the superposed tension forces in the rail fastener due to various load cases, temperature gradients and settlement of supports. The potential critical fasteners with the highest uplift forces are the fastener adjacent to the civil joint. The main influence factors are the geometry of the bridge such as, the beneath length of overhang, relative position of bridge bearing and fastener, deflection of bridge and the vertical spring stiffness of the fastener.

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사교의 사각에 따른 하부구조 설계변화 (Change of Substructure Design with Changed Angle of Skew Bridges)

  • 이주호;염종윤;박경래;배한욱
    • 콘크리트학회논문집
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    • 제11권3호
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    • pp.3-12
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    • 1999
  • This study presents a suggestion of regulation of skewed slab bridge. In order to find the characteristic behavior of skew bridge, many cases of skew bridges were analyzed with changed angle of skew. The comparison of design methods for cantilever part in pier was also made. It was found that : (1) The lower the skew angle was, the higher the maximum support reaction forces at the end point were. (2) The higher the ratio of L/B was, the higher the maximum support reaction force at the point was. (3) The effect of skew may be neglected for skew angles of $70^{\circ}$or more. (4) If elastic springs are applied to the boundary conditions to simulate the rubber pad bearings, the results will be more reasonable. (5) The shear deformation effect must be considered in the analysis of cantilever part of substructure. (6) Using strut and tie model to design cantilever part of pier, it will be more simple than finite element method with same accuracy and more accurate than using frame element.

BUMPLESS FLIP CHIP PACKAGE FOR COST/PERFORMANCE DRIVEN DEVICES

  • Lin, Charles W.C.;Chiang, Sam C.L.;Yang, T.K.Andrew
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 International Symposium
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    • pp.219-225
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    • 2002
  • This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

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고속철도교량 하부구조 강성도에 관한 현장실험 (Field Test on the Rigidities of Substructures of High Speed Railway Bridges)

  • 진원종;최은석;곽종원;강재윤;조정래;김병석
    • 한국철도학회논문집
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    • 제9권1호
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    • pp.118-124
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    • 2006
  • SThe rigidities of bridge substructures are the important data in the rail-bridge interaction analysis in Korean High -Speed Railway. This experimental study is being performed because of followings. 1) More correct longitudinal stiffness of the structure including substructure should be considered in the calculation of stresses in rails. 2) There are many uncertainties in the design and construction of the piers and foundations. 3) Actual guideline for the rigidities of piers and foundations in the design is necessary. 4) Measurement on the rigidity of pier according to the types of piers, foundations and soil-conditions is needed. Curve for estimating the total rigidity of substructure will be obtained through this and further experimental studies. It may be used in the analysis of Korean High-Speed Railway bridge and then, longitudinal stresses in the rails can be estimated more accurately. One pair of piers, which consist of pot-bearing for fixed support and pad-bearing for movable support, are loaded by steel frame devices with steel wire ropes and hydraulic jack. The responses which are measured at each loading stages in those field tests are displacements and tilted angles on the top and bottom of piers. This study is being performed testing and analysis about several piers in the construction field.

철도교용 고무패드 설치에 따른 판형교의 동적 거동 분석 (Analysis of Dynamic Behavior of Open-Steel-Plate-Girder Bridges Due to Installing Rubber Pads)

  • 최은수;김현민;오지택;김성일
    • 한국강구조학회 논문집
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    • 제17권3호통권76호
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    • pp.295-306
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    • 2005
  • 본 연구에서는 '철도교용 고무패드의 강성추정기법'에서 결정된 각 고무패드의 강성과 가정된 감쇠비를 이용하여 두 판형교에서의 동적 거동을 분석하였다. 또한 패드에 의한 판형교의 동적 거동 변화가 철도교량의 거동의 한계를 규정하고 있는 규준에 적합한지도 판단하였다. 고무패드를 교좌로 판형교에 설치하면 판형교의 동적 처짐은 증가하였다. 그러나 처짐이 증가하더라도 규정에 있는 한계를 넘지는 않아 차량의 안정적 주행에 영향을 주지는 않는다. 천연고무나 크로로프렌 고무패드는 변형이 크게 발생하여 교좌로서 활용이 부적합하나, 폴리우레탄 고무패드는 변형이 작게 나타나 사용성이 우수한 것으로 판단되었다. 그러나 고속 주행을 위해서는 패드의 면적을 증가 시켜서 패드변형을 제한해야 하는 것으로 나타났다. 고무패드의 강성증가 및 감쇠비 증가가 교량의 동적 거동에 미치는 영향에 대해서 분석을 실시하였다. 고무패드의 감쇠비 증가는 교량의 동적 거동에 거의 영향을 주지 않았다. 패드의 강성 증가는 상대적으로 자중이 크고 강성이 작은 교량에서는 응답 개선 효과가 적지만, 자중이 작고 강성이 큰 즉 경간이 짧은 교량에서 상대적으로 응답 개선 효과가 크게 나타났다.

프레팅 피로 균열의 발생 위치 및 방향 예측 (Prediction of Initiation Location and Direction of Fretting Fatigue Crack)

  • 허용학
    • 대한기계학회논문집A
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    • 제27권7호
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    • pp.1185-1192
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    • 2003
  • Governing parameters for determination of the location of crack initiation and direction of crack initiation were investigated by performing fretting fatigue tests and analysis on Al 2024-T351. Fatigue tests were carried out using biaxial fatigue machine. It was shown that the dominant fatigue crack tended to initiate at the outer edge of one of the four bridge pads, growing at an angle beneath a pad, before turning perpendicular to the orientation of the axial load. Distribution of stresses generated during fretting fatigue loading along the interface was calculated by elastic FE simulation. It can be known that the location of crack initiation can be predicted by using the maximum tangential stress range. Futhermore, the crack initiation direction can also be predicted by a maximum tangential stress range.

MMIC에 적용되는 MIM 커패시터의 실리콘 질화막 증착과 전기적 특성 (Deposition and Electrical Properties of Silicon Nitride Thin Film MIM Capacitors for MMIC Applications)

  • 성호근;소순진;박춘배
    • 한국전기전자재료학회논문지
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    • 제17권3호
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    • pp.283-288
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    • 2004
  • We have fabricated MIM capacitors for MMIC applications, with capacitances as high as 600pF/$\textrm{mm}^2$ and excellent electrical properties of the insulator layer. Silicon nitride thin film is the desirable material for MMIC capacitor fabrication. Standard MIM capacitance in MMIC is 300pF/$\textrm{mm}^2$ with an insulator layer thickness of more than 2000$\AA$. However, capacitors with thin insulator layers have breakdown voltages as low as 20V. We have deposited insulator layers by PECVD in our MIM structure with an air bridge between the top metal and the contact pad. The PECVD process was optimized for fabricating the desired capacitors to be used in MMIC. Silicon nitride(Si$_{x}$N$_{y}$) thin films of about 1000$\AA$ thick show capacitances of about 600pF/$\textrm{mm}^2$, and breakdown voltages above 70V at 100nA.A.A.