• Journal of the Korean Society for Heat Treatment
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• v.11 no.1
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• pp.17-26
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• 1998

Cladding of stainless steel on mild steel was prepared by diffusion bonding process. The bond strength increased with an increase of bonding temperature and time. It was also found that the bond strength increased as the surface roughness decreased. After the diffusion bonding of stainless steel-mild steel, the mild steel part near the bonded interface showed higher strength than the base steel due to the migration of chromium and nickel from stainless steel to mild steel. Carbon migration from mild steel gave effect on the formation of chromium carbides at grain boundaries of stainless steel, the fractograpohic features of the imperfectly bonded interface showed rather coarse dimples in the mild steel part and very fine dimples in the stainless steel part.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.863-870
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• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.

• Bulletin of the Korean Chemical Society
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• v.24 no.7
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• pp.901-905
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• 2003

The lower critical solution temperature (LCST) of thermosensitive poly(organophosphazenes) with methoxypoly(ethylene glycol) (MPEG) and amino acid esters as side groups was studied as a function of saccharide concentration in aqueous solutions of mono-, di-, and polysaccharides. Most of the saccharides decreased the LCST of the polymers, and the LCST decrease was more prominently observed by saccharides containing a galactose ring, such as D-galactose, D-galactosamine and D-lactose, and also the polysacccharide, 1-6-linked D-dextran effectively decreased the LCST of the polymers. Such an effect was discussed in terms of intramolecular hydrogen bonding of saccharides in polymer aqueous solution. The saccharide effect was found to be almost independent on the kinds of the amino acid esters and MPEG length of the polymers. Such a result implies that the polymer-saccharide interaction in aqueous solution is clearly influenced by the structure of sacchardes rather than by that of the polymers. The acid saccharides such as D-glucuronic and D-lactobionic acid increased the LCST, which seems to be due to their pH effect.

• YAKHAK HOEJI
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• v.42 no.3
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• pp.290-295
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• 1998

To optimize the formulation of acetaminophen liquid suppository, the effect of additives on the physicochemical properties of liquid suppository base was investigated. The physi cochemical properties of P 407/P 188 (15/15%) (abbreviated in 15/15) and P 407/P l88 (15/20%) (abbreviated in 15/20) were measured after the addition of following additives; 2.5% acetaminophen as an active ingredient, vehicle components (5% ethanol, 5% propylene glycol, 5% glycerin), preservatives (0.1% sodium benzoate, 0,1% methylparahydroxybenzoate, 0.1% propylparahydroxybenzoate) and 1% of sodium chloride as an ionic strength controlling agent. Poloxamer gel was prepared with three different buffer solutions (pH 1.2, 4.0 and 6.8) and the physicochemical properties, gelation temperature, gel strength and bioadhesive force, were determined. In the results, the effect of additives on the physicochemical properties was dependent on their bonding capacities including hydrogen bonding and cross-linking bonding. Because the hydrogen-bonding capacities of acetaminophen, ethanol and propylene glycol were smaller than that of poloxamer, the binding force of poloxamer gel became weak by their putting in between poloxamer gel. Therefore, the gelation temperature (15/15, $35.7^{\circ}C$ vs 37.0, 39.4 $38.2^{\circ}C$; 15/20, $29.2^{\circ}C$ vs 31.2, 32.0, $30.3^{\circ}C$) increased, and gel strength (15/15, 4.03 see vs 2.72, 2.08, 3.12sec; 15/20, 300g vs 50, 50, 200g) and bioadhesive force (15/15, $6.8{\times}10^2\;dyne/cm^2$ vs 3.2, 6.0, $6.0{\times}10^2\;dyne/cm^2$; 15/20, $97.3{\times}10^2\;dyne/cm^2$ vs 11.1, 89.5, $92.0{\times}10^2\;dyne/cm^2$) decreased. Furthermore, the binding force of poloxamer gel became strong due to the hydrogen-bonding capacities of glycerin and the cross-liking bonding of sodium salt. Then, the gelation temperature (15/15, 35.0, $32.1^{\circ}C$; 15/20, 26.0, $21.0^{\circ}C$) decreased, and gel strength (15/15, 6.51 see, 300g; 15/20, 500, 650g) and bioadhesive force (15/15, 7.2, $81.6{\times}10^2\;dyne/cm^2$; 15/20, 112.3, $309.2{\times}10^2\;dyne/cm^2$) increased. The effect of pH on the physicochemical properties of poloxamer gel was dependent on the ingredients with which the buffer solutions were prepared. Poloxamer gels prepared with pH 1.2 and 4.0 buffer solutions had the increasing gelation temperature (15/15, 37.5, $38.1^{\circ}C$; 15/20, 33.1, $34.0^{\circ}C$) and the decreasing gel strength (15/15, 2.98, 3.81sec; 15/20, 200, 200g) and bioadhesive force (15/15, $7.0{\times}10^2dyne/cm^2$; 15/20, $74.0{\sim}88.1{\times}10^2dyne/cm^2$) owing to HCl. Poloxamer gel prepared with pH 6.8 buffer solutions had the decreasing gelation temperature (15/15, $27.2^{\circ}C$; 15/20, $22.3^{\circ}C$) and the increasing gel strength (15/15, 400g; 15/20, 550g) and bioadhesive force (15/15, $207.0{\times}10^2dyne/cm^2$; 15/20, $215.0{\times}10^2dyne/cm^2$) due to the cross-linking bonding of $NaH_2PO_4\;and\;K_2HPO_4$.

• International Journal of Highway Engineering
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• v.19 no.6
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• pp.37-46
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• 2017

PURPOSES : A composite pavement utilizes both an asphalt surface and a concrete base. Typically, a concrete base layer provides structural capacity, while an asphalt surface layer provides smoothness and riding quality. This pavement type can be used in conjunction with rollercompacted concrete (RCC) pavement as a base layer due to its fast construction, economic efficiency, and structural performance. However, the service life and functionality of composite pavement may be reduced due to interfacial bond failure. Therefore, adequate interfacial bonding between the asphalt surface and the concrete base is essential to achieving monolithic behavior. The purpose of this study is to investigate the bond characteristics at the interface between asphalt (HMA; hot-mixed asphalt) and the RCC base. METHODS : This study was performed to determine the optimal type and application rate of tack coat material for RCC-base composite pavement. In addition, the core size effect, temperature condition, and bonding failure shape were analyzed to investigate the bonding characteristics at the interface between the RCC base and HMA surface. To evaluate the bond strength, a pull-off test was performed using different diameters of specimens such as 50 mm and 100 mm. Tack coat materials such as RSC-4 and BD-Coat were applied in amounts of 0.3, 0.5, 0.7, 0.9, and $1.1l/m^2$ to determine the optimal application rate. In order to evaluate the bond strength characteristics with temperature changes, a pull-off test was carried out at -15, 0, 20, and $40^{\circ}C$. In addition, the bond failure shapes were analyzed using an image analysis program after the pull-off tests were completed. RESULTS : The test results indicated that the optimal application rate of RSC-4 and BD-Coat were $0.8l/m^2$, $0.9l/m^2$, respectively. The core size effect was determined to be negligible because the bond strengths were similar in specimens with diameters of 50 mm and 100 mm. The bond strengths of RSC-4 and BD-Coat were found to decrease significantly when the temperature increased. As a result of the bonding failure shape in low-temperature conditions such as -15, 0, and $20^{\circ}C$, it was found that most of the debonding occurred at the interface between the tack coat and RCC surface. On the other hand, the interface between the HMA and tack coat was weaker than that between the tack coat and RCC at a high temperature of $40^{\circ}C$. CONCLUSIONS : This study suggested an optimal application rate of tack coat materials to apply to RCC-base composite pavement. The bond strengths at high temperatures were significantly lower than the required bond (tensile) strength of 0.4 MPa. It was known that the temperature was a critical factor affecting the bond strength at the interface of the RCC-base composite pavement.

• Textile Coloration and Finishing
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• v.25 no.2
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• pp.110-117
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• 2013

The purpose of this study is to fabricate the flame retardant polyester fabric by thermal bonding with low melting component of flame retardant bicomponent filament(LMFRPC) and to describe the characteristics of thermal bonded fabrics. The fabrics were prepared with flame retardant polyester filaments(FRP) as warp and blended filaments of FRP and LMFRPC as weft. The LMFRPC have a sheath and a core wherein the core comprises a flame retardant polyester and the sheath comprises a thermoplastic polyester of low-melting point. In this study, we investigated the physical properties, melting behavior of filament, the effect of the component of FRP and LMFRPC on the thermal bonding, mechanical properties. Melting peak of LMFRPC showed the double melting peak. The thermal bonding of the fabric formed at lower melting peak temperature of bicomponent filament of LMFRPC. The optimum thermal bonding conditions for fabrics was applied at about $170^{\circ}C$ for 60 seconds by pin tenter. On the other hand, the tensile strength, elongation, and LOI of the fabric increased with an increasing component of FRP of weft.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.35-40
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• 2007

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

• Carbon letters
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• v.7 no.3
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• pp.196-200
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• 2006

Graphite has hexagonal closed packing structure with two bonding characteristics of van der Waals bonding between the carbon layers at c axis, and covalent bonding in the carbon layer at a and b axis. Graphite has high tolerant to the extreme conditions of high temperature and neutron irradiations rather than any other materials of metals and ceramics. However, carbon elements easily react with oxygen at as low as 400C. Considering the increasing production of today of hydrogen and electricity with a nuclear reactor, study of oxidation characteristics of graphite is very important, and essential for the life evaluation and design of the nuclear reactor. Since the oxidation behaviors of graphite are dependent on the shapes of testing specimen, critical care is required for evaluation of nuclear reactor graphite materials. In this work, oxidation rate and amounts of the isotropic graphite (IG-110, Toyo Carbon), currently being used for the Koran nuclear reactor, are investigated at various temperature. Oxidation process or principle of graphite was figured out by measuring the oxidation rate, and relation between oxidation rate and sample shape are understood. In the oxidation process, shape effect of volume, surface area, and surface to volume ratio are investigated at $600^{\circ}C$, based on the sample of ASTM C 1179-91.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.549-555
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• 1996

Diamond Like Carbon film is amorphous film which is considered to consist of three coordinate graphite structure and tetrahedron coordinate diamond structure. Its hardness, thermal conductivity and chemical stability are nearly to one of diamond. It is well known to become semi-conductor by doping of inpurity. In this study Diamond Like Carbon film was synthesized by Microwave Plasma CVD in the gas mixture of hydrogen-methan-nitrogen and doped of nitrogen on the single-crystal silicon or silica glass. The temperature of substrate and nitrogen concentration in the gas mixture had an effect on the bonding state, structural properties and conduction mechanism. The surface morphology was observed by Scanning Electron Microscope. The strucure was analyzed by laser Raman spectrometry. The bonding state was evaluated by electron spectroscopy. Diamond Like Carbon film synthesized was amorphous carbon containing the $sp^2$ and $sp^3$ carbon cluster. The number of $sp^2$ bonding increased as nitrogen concentration increased from 0 to 40 vol% in the feed gas at 1233K substrate temperature and at $7.4\times10^3$ Pa. Increase of nitrogen concentration made Diamond Like Carbon to be amorphous and the doze of nitragen could be controlled by nitrogen concentration of feed gas.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.