• Journal of the Korean Ceramic Society
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• v.35 no.9
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• pp.945-952
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• 1998

Ferroelectric Sr0.8Bi2.4Ta2O9 stock solutions were prepared by MOD(Metaloganic Decompostion) process. The phase transformation for the layered perovskite of the SBT thin films by changing RTA(Rapid her-mal Annealing) temperatuer from 700$^{\circ}C$to 780$^{\circ}C$ were observed using XRD and SEM. Layered perovskite phase began to appear above 740$^{\circ}C$ and then SBT thin films were annealed at 800$^{\circ}C$ for 1hr for its com-plete crystallization. The specimens showed well shaped hysteresis curves without post annealing that car-ried out after deposition of Pt top electrode. The SBT thin films showed the asymmetric ferroelectric pro-perties. It was confirmed that the properties were caused by interface effect to SBT and electrode by leak-age current density measurement and asymmetric properties reduced by post annealing. At post annealing temperature of 800$^{\circ}C$ remanant polarization values (2Pr) were 6.7 9 ${\mu}$C/cm2 and those of leakage current densities were 3.73${\times}$10-7 1.32${\times}$10-6 A/cm2 at 3, 5V respectively. Also bismuth bonding types of SBT thin film surface were observed by XPS.

• Textile Coloration and Finishing
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• v.28 no.1
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• pp.23-32
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• 2016

This study examined the dyeability of fabrics dyed with rosemary, mint, sage, and thyme herb extracts. The herb extracts were pulverized and characterized by UV and FT-IR analysis. Dyeing properties of herb colorants on cotton, silk and wool fiber and effect of dyeing conditions on dye uptake were compared. The constituents of four different herbs were shown to be similar to each other. The dye uptake of rosemary and sage were shown to be larger than those of mint and thyme regardless of the fiber types. Affinity of herb colorants to protain fibers was higher than to cellulose fiber. Compared with silk and wool, the dyeability of cotton was the worse, the dye uptake of silk and wool fibers were increased along with dyeing time and dyeing temperature. As the dye uptake increased with increasing of the dye concentration, and its isothermal adsorption curves were langmuir type, indicating that ionic bonding was involved in the adsorption of herb colorants to the fibers.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.533-537
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• 2006

The effects of binary solvent mixtures with various ratios of toluene and ethanol on the properties of slurries and green sheets were investigated. Viscosity of slurry was changed by varying the ratio of solvent mixture which affected the solubility of binder. The relative solvency behavior of a solvent mixture could be predicted with the Hildebrand solubility parameter(${\delta}$) and hydrogen bonding index( ${\gamma}$). The minimum viscosity, the best dispersion of binder, was reached at the composition of toluene:ethanol=4:6, which corresponded to our forecast. The mechanical properties of green sheets related to evaporation of solvents were influenced by the composition of the solvent mixture. At the azeotrope the skin was formed on a drying cast during the drying process because of fast evaporation. At a range of concentrations over 50wt% toluene, green sheets could not be fully dried at low temperature due to excessive toluene. The mechanical properties of green sheets were excellent at the azeotrope-like composition of toluene:ethanol=4:6 which has a little excess of toluene over the azeotrope.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2008.11a
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• pp.63-66
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• 2008

Not only mechanical properties, bonding properties, electro chemical properties, etc. but also fire safety is required in patch repair materials such as polymer modified cement mortar (PCM) which are used to deteriorated reinforced concrete structure. Unfortunately, it is very difficult to choice the appropriate repair materials because there are not enough information about fire safety properties of PCM. In this study, The combustion characters of PCM were evaluated through the heat release rate test and non-combustibility test. The pyrogenicity test uses the cone calorimeter based on the oxygen consumption method. The non-combustibility test is from the temperature change inside the furnace during the test. The effect of the types of polymer and polymer content were evaluated from the series of test. The results are like followings. 1) The higher the W/C of PCM, the lower the gross calorific value and heat generation rate in the heat release rate test. The amount of heat generation of PCM is like the order of VVA, EVA, and SBR in this study. 2) Some materials such as E45-100, E50-100, E60-100, S50-50, and S50-100 were estimated as not appropriate building materials in the non combustibility test.

• Journal of the Korea institute for structural maintenance and inspection
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• v.12 no.1
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• pp.91-100
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• 2008

Multi-stepwise Thermal Prestressing Method(TPSM) is a newly proposed prestressing method, which is combined the external prestressing method and the external bonding method. Multi-stepwise thermal prestressing force is induced by cooling process of cover-plate in the multi-stepwise temperature distribution after the cover-plate being bolted to the girder. In this study, the heating capacity test of the developed heating system for applying the multi-stepwise TPSM effectively and multi-stepwise TPSM inducing test of H-beam is performed. Also, a field test of the rhamen type temporary bridge is carried out to evaluate the effect and application of the multi-stepwise TPSM. Truck load was loaded and compared with the structure analysis results.

• Journal of the Korean Ceramic Society
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• v.32 no.7
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• pp.839-845
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• 1995

The structural and dielectric properties of Pb(Mg1/3Nb2/3)O3 ceramics substituted by Nd3+, La3+, K+ and Na+ were studied over 0~50 at.% substituent content. The 1 : 1 ordering behavior of Mg2+ and Nb5+ ions in the B site sublattice was observed in Nd3+-and La3+-modified compounds. The degree of ordering was increased with Nd3+, La3+ content in the compounds. But K+-or Na+-modified compounds did not exhibit the ordering behavior. This was explained by charge and size effect of A and B site cations and oxygen vacancies. As the mole fractions of substituent increased, the maximum values of dielectric constants were rapidly decreased and the phase transitions were broadened. Phase transition temperature was correlated with the covalency of A-O and B-O bonding.

• Polymer(Korea)
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• v.25 no.2
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• pp.160-167
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• 2001

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.91-95
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• 2007

Electromigration characteristics of Sn-3.5Ag flip chip solder bump were analyzed using flip chip packages which consisted of Si chip substrate and electroplated Cu under bump metallurgy. Electromigration test temperatures and current densities peformed were $140{\sim}175^{\circ}C\;and\;6{\sim}9{\times}10^4A/cm^2$ respectively. Mean time to failure of solder bump decreased as the temperature and current density increased. The activation energy and current density exponent were found to be 1.63 eV and 4.6, respectively. The activation energy and current density exponent have very high value because of high Joule heating. Evolution of Cu-Sn intermetallic compound was also investigated with respect to current density conditions.

• Journal of Welding and Joining
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• v.29 no.4
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• pp.54-60
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• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.