• Title/Summary/Keyword: Bonding temperature effect

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Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface (Ar/N2 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석)

  • Choi, Seonghun;Kim, Gahui;Seo, Hankyeol;Kim, Sarah Eunkyung;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.29-37
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    • 2021
  • The effect of Ar/N2 two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N2 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N2 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m2 and 2.33±0.67 J/m2, respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

Effect of Annealing on a-Si:H Thin Films Fabricated by RF Magnetron Sputtering (RF 스퍼터를 이용하여 제작된 a-Si:H 박막의 어닐링 효과에 관한 연구)

  • Kim, Do-Yun;Kim, In-Soo;Choi, Se-Young
    • Korean Journal of Materials Research
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    • v.19 no.2
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    • pp.102-107
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    • 2009
  • The effect of annealing under argon atmosphere on hydrogenated amorphous silicon (a-Si:H) thin films deposited at room temperature and $300^{\circ}C$ using Radio Frequency (RF) magnetron sputtering has been investigated. For the films deposited at room temperature, there was not any increase in hydrogen content and optical band gap of the films, and as a result, quality of the films was not improved under any annealing conditions. For the films deposited at $300^{\circ}C$, on the other hand, significant increases in hydrogen content and optical band gap were observed, whereas values of microstructure parameter and dark conductivity were decreased upon annealing below $300^{\circ}C$. In this study, it was proposed that the Si-HX bonding strength is closely related to deposition temperature. Also, the improvement in optical, electrical and structural properties of the films deposited at $300^{\circ}C$ was originated from thermally activated hydrogen bubbles, which were initially trapped at microvoids in the films.

Fabrication of SMD Type PTC Thermistor with Multilayer Structure

  • Kim, Yong-Hyuk;Lee, Duck-Cuool
    • Journal of Sensor Science and Technology
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    • v.9 no.1
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    • pp.76-82
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    • 2000
  • PTC thermistors with multilayer structure were fabricated by internal electrode bonding technique in order to realize low resistance. MLPTC (Multilayer Positive Temperature Coefficient) possess various features, such as small size, low resistivity and large current. We describe the effect of additives on the PTC characteristics, voltage - current characteristics, temperature dependence of resistance and complex impedance spectra as a function of frequency range 100 Hz to 13MHz to determine grain boundary resistance. It was found that MLPTC thermistor has both highly nonlinear effects of temperature dependent resistance and voltage dependent current behaviors, which act as passive element with self-repair mechanisms. Decrease of room temperature resistance with increasing the number of layers was demonstrated to be a grain boundary effect. Switching characteristics of current were caused by heat capacity of PTC thermistor with multilayer structure. Switching times are lengthened by increasing the number of layers.

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Optimization Techniques of Die Disign on Hot Extrusion Process of Metal Matrix Composites (금속복합재료의 열간압출에 관한 금형설계의 최적화기법(I))

  • 강충길;김남환;김병민
    • Transactions of Materials Processing
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    • v.6 no.4
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    • pp.346-356
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    • 1997
  • The fiber orientation distribution and interface bonding in hot extrusion process have an effect on the maechanical properties of metal matrix composites(MMC's). Aluminium alloy matrix composites reinforced with alumina short fibers are fabricated by compocasting method. MMC's billets are extruded at high temperature through conical and curved shaped dies with various extrusion ratios and temperature. This present study was directed to describe the systematic correlation between extrusion die shape and subsequent results such as fiber breakage, fiber orientation and tensile strength to hot extruded MMC's billet. Extrusion load, tensile strength and hardness for variation of extrusion ratios and temperature are investigated to examine mechanical properties of extruded MMC's SEM fractographs of tensile specimens are observed to analyze the fracture mechanism.

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Effect of Spraying Conditions in Flame Spraying of Ni-Cr Base Self Fluxing Alloy on Mild Steel (가스용사에 의한 Ni-Cr 기 자용성합금 용사 의 특성에 미치는 용사조건의 영향)

  • 배종규;박경채;정인상
    • Journal of the Korean institute of surface engineering
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    • v.22 no.1
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    • pp.26-42
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    • 1989
  • It has between investigated that the optimum spaying conditions, such as, spraying distance, fusing temperature and fusing time, ect, in a Ni-cr base self fluxing alloy sprayed on the mild steel substrate by oxygen-acetylenc flame spraying. Sprayed specimens on various conditions were fuused in a vacuum furnace and the results were as follows. The optimum spraying condition for excellent coating layer are obtained under spraying distances, fusing temperature and fusing and time ; 180~240mm,1050~110$0^{\circ}C$and 15~30min, respectively. The adhesive strength and surface hurface hardness of the as sprayed specimens were very low by mechanical bonding becaus of the diffusion layer during process. The carbides and borides and formed in the sprayed coating layer and densification of the layer was resulted from the elimination of pores and oxides. The hardness of sprayed coating layer, particularly in the high temperature, was superior to ordinary tool steels.

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Electronic state calculation of ceramics by $DV-X\;{\alpha}$ cluster method

  • Adachi, Hirohiko
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1994.11a
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    • pp.1-1
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    • 1994
  • ;The electronic state calculations for various types of ceramic materials have beell performed by the use of $DV-X\;{\alpha}$ cluster method. The molecular orbital levels and wave functions for model clusters have been computed to study the electronic properties ami chemical bonding of the ceramics. For ${\beta}-sialon(Si_{6-z}Al_zO_zN_{8-z})$ which is a high temperature structural material based on ${\beta}-Si_3N_4$, we have made model cluster calculations to estimate the strength of chemical bonding between atoms by the Mulliken population analysis. It is found that the covalent bonding between Si and N atoms is very strong in pure ${\beta}-Si_3N_4$, but the covalency around solute atom is considerably weakened when Si atom is substituted by AI. This tendency is enhanced by an additional substitution of oxygen atom for N. The result calculated can well explain the experimental data of changes in mechanical properties such as the reductions of Young's modulus and Vickers hardness with increment of z-value in ${\beta}-sialon$. Various model clusters for transition metal oxides which show many interesting physical and chemical properties have also been calculated. High-valent perovskite-type iron oxides EMFe0_3E(M=Ca and Sr) possess very interesting magnetic and chemical properties. In these oxides, iron exists as $Fe^{4+}$ state, but the experimental measurement of Mossba~er effect suggests that disproportionation $2Fe^{4+}=Fe^{3+}+Fe^{5+}$ takes place for $CaFe0_3$ at low temperatures. The model cluster calculations for these compounds indicated the existence of considerably strong covalent bonding of Fe-O. The calculations of hyperfine interaction at iron neucleus show very good agreement with the experimental Mossbauer measurements. The result calculated also implies that the disproportionation reaction is strongly possible by assuming the quenching of breathing phonon mode at low temperatures.tures.

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EFFECT OF DEGASSING CONDITION ON CERAMIC BOND STRENGTH OF Ni-Cr ALLOYS (Degassing 조건이 Ni-Cr 합금의 도재결합력에 미치는 영향)

  • Lee, Eun-Hwa;Jeon, Young-Chan;Jeong, Chang-Mo;Lim, Jang-Seop
    • The Journal of Korean Academy of Prosthodontics
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    • v.38 no.4
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    • pp.461-471
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    • 2000
  • This study evaluated the effect of degassing on the ceramic bond strength of two Ni-Cr alloys under varying holding time at the upper limit temperature and atmospheric conditions. Metal specimens were divided into 5 groups for each alloy according to degassing conditions prior to porcelain application no degassing, degassing under vacuum without hold, degassing under vacuum with hold for 5 min. and 10 min. respectively at the upper limit temperature and degassing in air. Total number of metal ceramic specimens was eighty and each group had eight specimens. The ceramic bond strength was measured by four-point flexural test using Instron and the fractured surface was examined under SEM. The results obtained were as follows. 1. Degassing in air improved the ceramic bond strength of Ni-Cr alloys. 2. In degassing under vacuum, hold at the upper limit temperature was advantageous to the ceramic bonding of Ni-Cr alloys. 3. After ceramic metal bond test, metal surfaces were partially covered with the thin porcelain layer, and the cohesive failures in porcelain were predominant in groups showing higher ceramic bond strength.

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Characteristics of the PbO-Bi2O3-B2O3-ZnO-SiO2 Glass System Doped with Pb Metal Filler (Pb 금속필러가 첨가된 PbO-Bi2O3-B2O3-ZnO-SiO2계 유리의 특성)

  • Choi, Jinsam;Jeong, DaeYong;Shin, Dong Woo;Bae, Won Tae
    • Journal of the Korean Ceramic Society
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    • v.50 no.3
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    • pp.238-243
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    • 2013
  • We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

Effect of hydrofluoric acid-based etchant at an elevated temperature on the bond strength and surface topography of Y-TZP ceramics

  • Yu, Mi-Kyung;Lim, Myung-Jin;Na, Noo-Ri;Lee, Kwang-Won
    • Restorative Dentistry and Endodontics
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    • v.45 no.1
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    • pp.6.1-6.8
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    • 2020
  • Objectives: This study investigated the effects of a hydrofluoric acid (HA; solution of hydrogen fluoride [HF] in water)-based smart etching (SE) solution at an elevated temperature on yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) ceramics in terms of bond strength and morphological changes. Materials and Methods: Eighty sintered Y-TZP specimens were prepared for shear bond strength (SBS) testing. The bonding surface of the Y-TZP specimens was treated with 37% phosphoric acid etching at 20℃-25℃, 4% HA etching at 20℃-25℃, or HA-based SE at 70℃-80℃. In all groups, zirconia primers were applied to the bonding surface of Y-TZP. For each group, 2 types of resin cement (with or without methacryloyloxydecyl dihydrogen phosphate [MDP]) were used. SBS testing was performed. Topographic changes of the etched Y-TZP surface were analyzed using scanning electron microscopy and atomic force microscopy. The results were analyzed and compared using 2-way analysis of variance. Results: Regardless of the type of resin cement, the highest bond strength was measured in the SE group, with significant differences compared to the other groups (p < 0.05). In all groups, MDP-containing resin cement yielded significantly higher bond strength values than MDP-free resin cement (p < 0.05). It was also shown that the Y-TZP surface was etched by the SE solution, causing a large change in the surface topography. Conclusions: Bond strength significantly improved when a heated HA-based SE solution was applied to the Y-TZP surface, and the etched Y-TZP surface was more irregular and had higher surface roughness.

Effect of the Heat Treatment Temperature on the Brazed Microstructure of Dissimilar Ti and Cu Metals Using a Zr-Base Amorphous Filler (Zr계 비정질 삽입재를 이용한 Ti-Cu 이종 접합부의 미세조직 형성에 미치는 확산 열처리 온도의 영향)

  • Lee, Jung Gu;Lee, Jong Keuk;Lee, Min Ku;Rhee, Chang Kyu
    • Journal of the Korean Society for Heat Treatment
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    • v.20 no.1
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    • pp.17-21
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    • 2007
  • In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.