• Title/Summary/Keyword: Bonding temperature effect

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Effect of high temperature on the bond performance between steel bars and recycled aggregate concrete

  • Yan, Lan-Lan;Liang, Jiong-Feng;Zhao, Yan-gang
    • Computers and Concrete
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    • v.23 no.3
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    • pp.155-160
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    • 2019
  • The use of recycled aggregate concrete for the purpose of environmental and resource conservation has gained increasing interest in construction engineering. Nevertheless, few studies have reported on the bonding performance of the bars in recycled aggregate concrete after exposed to high temperatures. In this paper, 72 pull-out specimens and 36 cubic specimens with different recycled coarse aggregate content (i.e., 0%, 50%,100%) were cast to evaluate the bond behavior between recycled aggregate concrete and steel bar after various temperatures ($20^{\circ}C$, $200^{\circ}C$, $400^{\circ}C$, $600^{\circ}C$). The results show that the recycled aggregate concrete pull-out specimens exhibited similar bond stress-slip curves at both ambient and high temperature. The bond strength declined gradually with the increase of the temperature. On the basis of a regression analysis of the experimental data, a revised bond strength mode and peak slip ratios relationship model were proposed to predict the post-heating bond-slip behavior between recycled aggregate concrete and steel bar.

Surface Modification of Polyacrylonitrile by Low-temperature Plasma (저온플라즈마처리에 의한 폴리아크릴로니트릴의 표면개질)

  • Seo, Eun-Deock
    • Textile Coloration and Finishing
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    • v.19 no.1 s.92
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    • pp.45-52
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    • 2007
  • Polyacrylonitrile(PAN) fiber was treated with low-temperature plasmas of argon and oxygen for surface modification, and its surface chemical structure and morphology were examined by a field emission scanning electron microscope(FESEM) and a Fourier-transform infrared microspectroscopy(IMS). The argon-plasma treatment caused the only mechanical effect by sputtering of ion bombardment, whereas the oxygen plasma brought about a chemical effect on the PAN fiber surface. The experimental evidences strongly suggested that cyclization of nitrile group and crosslinking were likely to occur in the oxygen-plasma treatment. On the other hand, with the argon-plasma treatment, numerous my pits resulted in ranging from several tens to hundreds nanometers in radius. The plasma sensitivity of functional groups such as C-H, $C{\equiv}N$, and O-C=O groups in the PAN fiber was dependent on their chemical nature of bonding in the oxygen-plasma, in which the ester group was the most sensitive to the plasma. Vacuum-ultraviolet(VUV) radiation emitted during plasma treatment played no substantial role to alter the surface morphology.

Heat Dissipation Analysis of 12kV Diode by the Packaging Structure (12kV급 다이오드의 패키징 구조에 따른 방열 특성 연구)

  • Kim, Nam-Kyun;Kim, Sang-Cheol;Bahng, Wook;Song, Geun-Ho;Kim, Eun-Dong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.1092-1095
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    • 2001
  • Steady state thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin with a thickness of 25${\mu}$m. It was assumed that the generated heat which is mainly by the on-state voltage drop, 9V for 12kV diode, is dissipated by way of the conduction through diodes layers to bonding wire and of the convection at the surface of passivating resin. It was predicted by the thermal analysis that the temperature rise of a pn junction of the 12kV diode can reach at the range of 16∼34$^{\circ}C$ under the given boundary conditions. The thickness and thermal conductivity(0.3∼3W/m-K) of the passivating resin did little effect to lower thermal resistance of the diode. As the length of the bonding wire increased, which means the distance of heat conduction path became longer, the thermal resistance increased considerably. The thermal analysis results imply that the generated heat of the diode is dissipated mainly by the conduction through the route of diode-dummy wafer-bonding wire, which suggests to minimize the length of the wire for the lowest thermal resistance.

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Evaluation of the Bonding Behavior of the Rehabilitation Method Applying Carbon Fiber Subjected to the Variation of Environmental Condition (탄소섬유 접착 보강공법의 환경변화에 따른 부착특성 평가)

  • Han, Cheon Goo;Byun, Hang Yong;Park, Yong Kyu
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.12 no.2
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    • pp.67-74
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    • 2008
  • This paper provides the test results of bonding behavior of the interface between concrete substrate and carbon fiber in the rehabilitation method applying carbon fiber with epoxy based resin adhesive. The difference in each components was gradually increased subjected to the repetition of temperature variation, regardless of the strength of the substrate concrete, while the ultrasonic interface between each component occurred. An increase in difference of the temperature resulted in a decrease in bond strength of each component. Associated failure mode was shown to be interfacial failure and substrate concrete failure. No remarkable changes were found in the deformation and ultrasonic velocity of each component until the four cycles of the dry and moisture test. Hence, the moisture condition may not affect the bonding behavior of each component. After the repetition of dry and moisture test, corresponding bond strength was reduced to 40% of that before test. For the effect of freeze and thaw test, the cycle of freeze and thaw within 4 cycles resulted in debonding of each component.

Adhesive Strength and Interface Characterization of CF/PEKK Composites with PEEK, PEI Adhesives Using High Temperature oven Welding Process (고온 오븐 접합을 적용한 PEEK, PEI 기반 CF/PEKK 복합재의 접착 강도 및 계면 특성 평가)

  • Park, Seong-Jae;Lee, Kyo-Moon;Park, Soo-Jeong;Kim, Yun-Hae
    • Composites Research
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    • v.35 no.2
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    • pp.86-92
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    • 2022
  • This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.

EFFECT OF AN INTERMEDIATE BONDING RESIN AND FLOWABLE RESIN ON THE COMPATIBILITY OF TWO-STEP TOTAL ETCHING ADHESIVES WITH A SELF-CURING COMPOSITE RESIN (자가 중합 복합 레진과 두 단계 산 부식 접착제의 친화성에 대한 중간 접착제와 흐름성 레진의 효과)

  • Choi, Sook-Kyung;Yum, Ji-Wan;Kim, Hyeon-Cheol;Hur, Bock;Park, Jeong-Kil
    • Restorative Dentistry and Endodontics
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    • v.34 no.5
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    • pp.397-405
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    • 2009
  • This study compared the effect of an activator, intermediate bonding resin and low-viscosity flowable resin on the microtensile bond strength of a self-curing composite resin used with two-step total etching adhesives. Twenty extracted permanent molars were used. The teeth were assigned randomly to nine groups (n=10) according to the adhesive system and application of additional methods (activator, intermediate adhesive, flowable resin). The bonding agents and additional applications of each group were applied to the dentin surfaces. Self-curing composite resin buildups were made for each tooth to form a core, 5mm in height. The restored teeth were then stored in distilled water at room temperature for 24h before sectioning. The microtensile bond strength of all specimens was examined. The data was analyzed statistically by one-way ANOVA and a Scheffe's test. The application of an intermediate bonding resin (Optibond FL adhesive) and low-viscosity flowable resin (Tetric N-flow) produced higher bond strength than that with the activator in all groups. Regardless of the method selected, Optibond solo plus produced the lowest ${\mu}TBS$ to dentin. The failure modes of the tested dentin bonding agents were mostly adhesive failure but there were some cases showed cohesive failure in the resin.

Bonding Behavior of Carbon Black/Nylon 66 Hybrid Nanofiber Webs via Microwave Heating (카본블랙/나일론 66 혼합 나노섬유웹의 마이크로파에 의한 접착거동)

  • Shin, Dong-Ho;Joo, Chang-Whan
    • Proceedings of the Korean Fiber Society Conference
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    • 2003.10b
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    • pp.114-117
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    • 2003
  • Conventional heating the heat source cause the molecules to react from the surface toward the center so that successive layers of molecules heat in turn. The product surfaces may be in danger of over heating by the time heat penetrates the material. Microwave, however, produce a volume heating effect. All molecules are set in action at the same time. It also evens temperature gradients and offers other important benefits such as selective heating. (omitted)

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Study on the microwave heating on kevlar fiber-bonding using Polyvinylidene floride(PVDF) (Polyvinylidene floride(PVDF)를 이용한 케블라 섬유접착에 마이크로웨이브에 관한 연구)

  • Young-Soo Lee;Jin-Ah Lee;Chang-Whan Joo
    • Proceedings of the Korean Fiber Society Conference
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    • 2001.10a
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    • pp.403-404
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    • 2001
  • In conventional heating, the heat source causes the molecules to react from the surface toward the center so that successive layers of molecules heat in turn. In the microwave heating, which is produced a volume heating effect, all molecules are set in action at the same time. And, It also evens temperature gradients without the concern of material thickness. (omitted)

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Effect of Brazing Condition on Tensile Properties in Brazing Joints of Inconel-625/Ni-201 Using MBF-30 (MBF-30을 사용한 Inconel-625/Ni-201 브레이징 접합부의 인장성질에 미치는 접합조건의 영향)

  • Yu, Jeong-Woo;Park, Sang-Hyun;Kim, Chang-Su;Kang, Chung-Yun
    • Journal of Welding and Joining
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    • v.30 no.6
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    • pp.106-112
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    • 2012
  • This study was carried out to investigate the effect of bonding temperature and holding time on microstructure and mechanical properties in brazing joints of Ni-base superalloy using MBF-30 (Ni-4.5Si-3.2B [wt.%]). The heating rate was $20^{\circ}C$/min to the bonding temperatures $1050^{\circ}C$, $1070^{\circ}C$, $1090^{\circ}C$ under high vacuum condition. The holding times were 100s, 400s, 900s and 1600s. $Ni_3B$ phases and proeutectic Ni were observed in the interlayer of Ni-201. Then, Ni3B and Ni3Si were found in the middle region of brazing joint. Cr-boride phase appeared in the interlayer of Inconel-625. Tensile strength and elongation were decreased at $1050^{\circ}C$-1600s, $1070^{\circ}C$-900s and $1090^{\circ}C$-400s. After observation the fracture specimens, There was Ni3B which is very brittle phase in the grain boundary of Ni201.