• 소성∙가공
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• 제14권3호
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• pp.257-262
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• 2005

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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• pp.33-38
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• 2004

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• 콘크리트학회논문집
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• 제11권3호
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• pp.13-21
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• 1999

Recently, many strengthening methods are developed to repair damaged structures, especially, steel plate or carbon fiber sheet bonding methods are widely used. For the bonding methods, the strengthening materials are bonded when the original structure is under loading, with causes the difference of initial stresses between original member and bonded material. However, current design method or theory, which mostly depends on ultimately strength design, cannot account the difference of initial stresses between members, and it disregards the reduction of nominal strength. In this study, a new strengthening design theory and program which can account the difference of initial stresses are developed, and applied to the case when a structure in service is repaired. In order to verify the validity of the theory and the program, a test result is referred and compare with the results and it is showed that the calculated values are almost same as the referred data and finally proved that the program is reliable. The results showed that the amount of strengthening material depends on the status of damages of structure, and the nominal strength is reduced depending on the degree of damages.

• 콘크리트학회논문집
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• 제11권3호
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• pp.35-45
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• 1999

Recently, many strengthening methods are developed to repair damaged structures, especially, steel plate or carbon fiber sheet bonding methods are widely used. For the bonding methods, the strengthening materials are bonded when the original structure is under loading, which causes difference of initial stresses between original member and bonded material. However, current design method or theory, which mostly depends on ultimately strength design, cannot account the difference of initial stresses between members, and it disregards the reduction of nominal strength. In this study, a new strengthening design theory and program which can account the difference of initial stresses are developed, and applied to the case when a structure in service is repaired. In order to verify the validity of the theory and the program, a test result is referred and compared with the results and it is showed that the calculated values are almost same as the referred data and finally proved that the program is reliable. The results showed that the amount of strengthening material depends on the status of damages of structure, and the nominal strength is reduced depending on the degree of damages.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.759-762
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• 2000

Present transistors which have vertical structure show increased parasitic capacitance characteristics in accordance with the increase of non-active base area and collector area, consequently have disadvantage for high speed switching performance. In this paper, a horizontal structure transistor which has minimized parasitic capacitance in virtue of SDB(Silicon Direct Bonding) wafer and oxide sidewall isolation utilizing silicon trench technology is presented. Its structural characteristics were designed by ATHENA(SUPREM4), the process simulator from SILVACO International, and its performance was proven by ATLAS, the device simulator from SILVACO International. The performance of the proposed horizontal structure transistor was certified through the VCE-lC characteristics curve, $h_{FE}$ -IC characteristics, and GP-plot.

• 멤브레인
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• 제19권4호
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• pp.310-316
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• 2009

조직 공학용 지지체로 사용할 목적으로 제조된 가교된 lactide/hyaluronic acid (LA/HA) 막의 분해 특성을 살펴보았다. 가교제 1,3-butadiene diepoxide (BD), 1-ethyl-3-(3-dimethyl aminopropyl) carbodiimide (EDC)를 사용하여 얻어진 고분자 막을 $37^{\circ}C$로 조절된 항온조에서 증류수에 침전시켜 분해시켰다. 가교반응시 LA/HA 몰비가 작을수록, 가교제의 농도가 작을수록 생성된 고분자 막의 분해속도가 증가하였다. 분해될 때 막의 구조 변화를 살펴보기 위해 분해 전, 3일, 6일, 9일 후의 시료를 채취하여 핵자기 공명 분광법으로 분자 구조를 살펴보았다. EDC로 가교시킨 막의 경우 시간이 지남에 따라 HA-EDC 결합구조는 서서히 분해되는데 HA-LA 결합구조는 급격히 분해되어 6일 후에는 완전히 소멸되었다. BD로 가교시킨 막의 경우 가교된 결합 구조 모두 서서히 분해되었으며 3일, 6일이 지나면서 HA-BD 결합 구조는 원래의 89, 83%가 유지되었으나 HA-LA 결합 구조는 원래의 83, 65%로 유지되었다. 분해된 막을 전자 현미경으로 측정한 결과 분해 전후 표면에서 기공의 밀도는 크게 차이나지 않았으며, 표면과 측면의 구조도 크게 차이가 나지 않아 조직공학용 재료로써 사용할 때 아무런 문제가 없는 것으로 관찰되었다.

• 대한치과보철학회지
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• 제38권3호
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• pp.328-335
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• 2000

Statement of the problem. Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. Purpose of study. The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. Methods/material. Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. Conclusion. With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.

• 전기학회논문지P
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• 제65권4호
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• pp.250-254
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• 2016

In this paper, solar-cell modules were fabricated by low-temperature bonding method of construction using CF. CF adhesive strength of cells at 180 degree using 3bus bar structure was measured average 2.4N. As the bonding temperature got higher, Voc and Iscwas increased. And at $185^{\circ}C$, Rseries was measured 0.013[${\Omega}$] which is the highest point. At $185^{\circ}C$, 2N and 6sec in bonding time, $P_{max}$ was measured 3.954[W], fillfactor was measured 67.36[%] and efficiency was measured13.178[%] the highest point.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• Bulletin of the Korean Chemical Society
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• 제32권6호
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• pp.1879-1883
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• 2011

The electronic structure and bonding in $Ti_2Pd$ and $Pd_2Ti$ alloys with and without hydrogen as an interstitial atom were studied by performing extended Huckel tight-binding band calculations. The hydrogen absorption near an octahedral site is found to be a favorable process in $Ti_2Pd$ rather than in $Pd_2Ti$. In metal hydrides, the metal-hydrogen bonding contribution is crucial to the stability of the system. The stronger interaction of hydrogen with Ti atoms in $Ti_2PdH_2$ than with Pd atoms in $Pd_2TiH_2$ is analyzed by perturbation theory.