• Smart Structures and Systems
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• v.1 no.1
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• Current Photovoltaic Research
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• v.3 no.1
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• pp.1-4
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• 2015

In this study, we analyzed the correlation between mechanical and electrical properties of low-temperature conductive film (LT-CF) bonded silicon solar cells by a quadrant analysis (horizontal axis (peeling strength), vertical axis (power loss)). We found that a series of points with various bonding parameters such as bonding temperature, pressure and time were distributed in the different three regimes; weak regime (Q2: weak bonding strength and high power loss), moderate regime (Q4 : strong bonding strength and low power loss) and hard regime (Q3 : weak bonding strength and low power loss). Using this analogous technique, it was possible to fabricate the LT-CF bonded silicon solar cells with the various conditions displayed in Q3 of the quadrant plots, possessing the peeling strength of ~ 1N/mm and power loss of 2~3%.

• 연구논문집
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• s.24
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• pp.63-79
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• 1994

This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.2
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• pp.106-111
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• 2007

In this research work attempts were made to study the bonding of thermo-plastics with adhesives using solar radiation. In order to study the curing behaviour necessary experiments were conducted under varying conditions of temperature, exposure time and power of solar energy. The cured samples were then studied under the optical microscope before subjecting to tensile testing in order to study their mechanical properties of thermo-plastics. The fracture surfaces were further studied under the Scanning Electron Microscopy(SEM) in order to research the microstructural changes that are taken place during curing. In order to measure the performance of solar energy cured joints the parameters such as; bond strength, surface morphology, the microstructual changes, variation in properties of adhesives bonded joints are compared to that of specimen cured at ambient conditions and specimen cured using microwave techniques.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.1
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• pp.143-150
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• 1998

The evaluation of joint fatigue strength of light weight materials for electrical vehicle body has been performed through single lap joint tests with the design parameters such as joint style, adherend, bonding overlap length and bonding thickness. Fatigue strength was evaluated through 5-Hz, tension-tension, load controlled test with the stress ratio zero value. It is experimentally observed that fatigue strength of joint increases for the increase of overlap length. The combinations of Al-Al and Al-FRP adherends show that fatigue strength of joint is hardly changed for the increase of bonding thickness, but FRP-FRP adherend specimen shows that fatigue strength of joint increases after decreases for the increase of bonding thickness. Al-Al adherend specimen has much higher fatigue length than Al-FRP and FRP-FRP adherend specimens. Riveting at adgesive bonded joint gives little effect on fatigue strength.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.233-235
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• 2006

This study was performed to find the best bonding conditions by comparing mechanical properties in solar collector. The solar collector that consists of copper plate and tube was successfully bonding by ultrasonic seam welding. In this experiment, we varied the values of welding pressure and welding amplitude and fixed the values of speed and frequency. Consequently, it was find that the welding pressure had higher effort on bonding strength than the welding amplitude.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.342-347
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• 2001

Recently, adhesive-bonding technique is wifely used in manufacturing structures. Stress and strain analysis of joints are essential to design adhesive-bonded joints structure. The single-lap adhesive joint is the design dominating the range of adhesive joints. In this study, single-lap specimens with different joint dimensions were used for the tensile-shear test and finite element calculation in of order to investigate the effect of overlap length and adhesive-bonding thickness on adhesive strength and stress distribution of the joints. Consequently, it was found that overlap lap size and thickness can be important parameters of structure joints using adhesive bonding, which is effected on adhesive strength.

• Transactions of the Korean Society of Automotive Engineers
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• v.5 no.2
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• pp.87-93
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• 1997

The bonding strength evaluation of light weight materials for electrical vehicle applications has been performed through single lap joint tests in which the design parameters such as fillet, joint style, adherend, bonding overlap length,bonding thickness, and environmental condition(soaking time in $25^{\circ}C$ water) are considered. It is experimentally oberved that lap shear strength of joint increases for higher fillet height, longer overlap length, and thinner bonding layer thickness. Al-Al adherend combination shows much higher lap shear strength than AL-FRP and FRP-FRP adherend combinations. Riveting at adhesive bonded joint of AL-AL adherend combination makes lap shear strength decrease. Effect of soaking time on lap shear strength is negligible.