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Quadrant Analysis in Correlation between Mechanical and Electrical Properties of Low-Temperature Conductive Film Bonded Crystalline Silicon Solar Cells

  • Received : 2015.02.16
  • Accepted : 2015.02.23
  • Published : 2015.03.31

Abstract

In this study, we analyzed the correlation between mechanical and electrical properties of low-temperature conductive film (LT-CF) bonded silicon solar cells by a quadrant analysis (horizontal axis (peeling strength), vertical axis (power loss)). We found that a series of points with various bonding parameters such as bonding temperature, pressure and time were distributed in the different three regimes; weak regime (Q2: weak bonding strength and high power loss), moderate regime (Q4 : strong bonding strength and low power loss) and hard regime (Q3 : weak bonding strength and low power loss). Using this analogous technique, it was possible to fabricate the LT-CF bonded silicon solar cells with the various conditions displayed in Q3 of the quadrant plots, possessing the peeling strength of ~ 1N/mm and power loss of 2~3%.

Keywords

References

  1. Y.-S. Kim, K. Lee, K.-W. Paik, "Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method, Components, Packaging and Manufacturing Technology", IEEE Transactions on, Vol. 3, pp. 177-182, 2013.
  2. X. Chen, J. Zhang, C. Jiao, Y. Liu, "Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection", Microelectronics reliability, Vol. 46, pp. 774-785, 2006. https://doi.org/10.1016/j.microrel.2005.07.115
  3. M. Uddin, M. Alam, Y. Chan, H. Chan, "Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film, Microelectronics Reliability", Vol. 44, pp. 505-514, 2004. https://doi.org/10.1016/S0026-2714(03)00185-9
  4. C.-K. Chung, K.-W. Paik, "The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications", in: Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, IEEE, pp. 161-167, 2009.
  5. K.K. Chan, N.H. Yeung, Y.C. Chan, S.C. Tan, K.K. Lee "Microwave Curing of Anisotropic Conductive Film: Effects of Principal Parameters on Curing Situation", in: ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, IEEE; Vol 2003, pp. 1701-1704, 1999.
  6. Y. Wu, M. Alam, Y. Chan, B. Wu, "Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages", Microelectronics Reliability, Vol. 44, pp. 295-302, 2004. https://doi.org/10.1016/S0026-2714(03)00214-2
  7. M.-J. Yim, K.-W. Paik, "The contact resistance and reliability of anisotropically conductive film (ACF), Advanced Packaging", IEEE Transactions on, Vol. 22 pp. 166-173, 1999.