• 한국정밀공학회지
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• 제13권11호
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• pp.38-45
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• 1996

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. Specially, the method utilizes the longitudinal vibration of ultrasonic transducer composed of piezoelectric vibrator and horn. This work investigates the design conditions affecting the dynamic characteristics through the theretical and experimental analysis. It conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. The integrated modeling is conducted via a combbination of dynamic identification of piezoelectric vibrator and theroretical analysis of horn. Then comparison is made for theroretical and experimental results of the dynamic characteristics of the ultrasonic transducer comprised of piezoelectric vibrator and horn. Form the results of the comparison we develop the design technique of ultrasonic transducer using dynamic characteristics analysis and propose the possibility of ultrasonic bonding considering the optimal conditions for the longitudinal vibration of ultrasonic transducer and other conditions.

• Journal of Welding and Joining
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• 제20권6호
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• pp.106-106
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and Ti₃Ag and titanium oxide, TiO₂were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of 900℃ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about 30㎛, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• Journal of Welding and Joining
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• 제20권6호
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• pp.830-837
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and $Ti_3Ag$ and titanium oxide, $TiO_2$ were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of $900^{\circ}C$ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about $30\mu\textrm{m}$, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• 대한치과보철학회지
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• 제34권4호
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• pp.833-849
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• 1996

The material of choice for functional and esthetic reconstruction of maxillofacial defects is silicone. Silicone has appropriate physical properties for maxillofacial prosthesis but it has weak edge strength. Therefore, a proper combination of silicone and polyurethane sheet is recommended to improve this weakness. Various primers are also used to enhance the adhesive strength between silicone and polyurethane sheet. The purpose of this study was to determine the adhesive strength of silicone and polyurethane sheet. Silicone elastomer mixture was made by admixing MDX4-4210 elastomer (40%) and Silastic Medical Adhesive Type A(60%). This silicone elastomer mixture was attached to polyurethane sheet, using one of three different primers(1205, S-2260, or A-304), treated for 1, 2, 4, 6, and 8 hours. These were then polymerized in room temperature, dry-heat oven or microwave oven. Six specimens per each group, a total of 270 specimens were prepared for final test. The differences of T-peel bonding strengths were then determined by a test. The differences of T-peel bonding strengths were then determined by a test method that was recommended by American Society for Testing and Materials C794-80. The results were statistically analyzed using the ANOVA and Mutiple Range Tests(Tukey' HSD). The reults were as follow. 1. Type of primer, primer reaction time, and methods of polymerization showed significant correlation on the T-peel bonding strengths in adhesiveness between silicone and polyurethane sheet. 2. A-304 primer showed statistically higher in T-peel bonding strength than otehr type of primers except for the polymerization in microwave oven with reaction times of 2, 6 hours(p<0.05). 3. No significant differences in T-peel bonding strength were observed among the polymerization methods. 4. The effect of reaction time by the primer type and polymerization method showed statistically significant differences in bonding strength among different reaction times. And in most cases, reaction time of 1 or 2 hours showed higher T-peel bonding strength.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• 대한기계학회논문집A
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• 제24권10호
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• pp.2461-2468
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• 2000

In this paper, single fiber pull-out test is used to measure the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite with temperature. Fiber and matrix of $Ti_{50}-Ni_{50}$ shape memory alloy composite are respectively $Ti_{50}-Ni_{50}$ shape memory alloy and epoxy resin. To strengthen the interfacial bonding shear stress, various surface treatments are used. They are the hand-sanded surface treatment, the acid etched surface treatment and the silane coupled surface treatment etc.. The interfacial bonding shear strength of surface treated shape memory alloy fiber is greater than that of surface untreated shape memory alloy fiber by from 10% to 16%. It is assured that the hand-sanded surface treatment and the acid etched surface treatment are the best way to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory composite. The best treatment condition of surface is 10% HNO$_3$ solution in the etching method to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite.

• Journal of Welding and Joining
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• 제20권5호
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• pp.93-98
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• 2002

The effect of bonding misfit on single crystallization of transient liquid phase (TLP) bonded joints of single crystal superalloy CMSX-2 was investigated using MBF-80 insert metal. The bonding misfit was defined by (100) twist angle (rotating angle) at bonded interface. TLP bonding of specimens was carried out at 1523K for 1.8ks in vacuum. The post-bond heat treatment consisted of the solution and sequential two step aging treatment was conducted in the Ar atmosphere. The crystallographic orientation analysis across the TLP bonded joints was conducted three dimensionally using the electron back scattering pattern (EBSP) method. EBSP analyses f3r the bonded and post bonded heat treated specimens were conducted. All bonded joints had misorientation centering around the bonded interface for as-bonded and post-bond heat treated specimens with rotating angle. The average misorientation angle between both solid phases in bonded interlayer was almost identical to the rotating angle at bonded interface. HRTEM observation revealed that the atom arrangement of both solid phases in bonded interlayer was quite different across the bonded interface. It followed that grain boundary was formed in bonded interface. It was confirmed that epitaxial growth of the solid phase occurred from the base metal substrates during TLP bonding and single crystallization could not be achieved in joints with rotating angle.

• 한국표면공학회지
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• 제54권5호
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Restorative Dentistry and Endodontics
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• 제34권5호
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• pp.442-449
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• 2009

이 연구의 목적은 5급 와동의 복합레진 수복에서 상아질 접착제를 비교적 두껍게 도포하거나 낮은 탄성계수(low elastic modulus)를 가진 복합레진을 선택하는 방법을 택하여 수복물의 탄성율의 차이에 따른 치아와 복합레진 경계에서 발생하는 응력의 차이를 알아보는 것이었다. abfraction 병소가 있는 하악 제 1소구치를 유한요소법을 이용하여 모델로 만들었다. 병소는 상아질 접착제의 두께 ($50{\mu}m$, $100{\mu}m$, $150{\mu}m$) 및 복합레진의 종류를 달리하며 수복되었다. 170N의 교합압을 협측 또는 설측에서 가하여 상아질 접착제와 치아면에서의 Von Mises stress를 측정하였다. 상아질 접착제의 두께가 두꺼울수록 상아질 접착제면에 가해지는 Von Mises stresss 는 감소하였다. 낮은 탄성계수 값을 가진 복합레진에서 Von Mises stress가 더 작았다. 치근상아질 경계 (margin)가 법랑질 경계에서보다 더 큰 응력이 발생하였다. 상아질 접착제면에 작용하는 교합압의 영 향을 감소시키기 위해 상아질 접착제를 두껍게 바르거나 낮은 탄성계수 값을 가진 복합레진을 사용하는 것이 추천된다.

• 한국터널지하공간학회 논문집
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• 제11권1호
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• pp.71-83
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• 2009

숏크리트는 터널에서 적용되는 요요한 주지보재이다. 숏크리트의 품질평가는 터널의 안전한 시공과 효과적인 운영을 위한 핵심 요소이다. 숏크리트가 암반에 적절히 타설되었다 하더라도, 막장 및 벤치부에서의 발파, 수축, 지반의 변형 등으로 인해 숏크리트 균열발생 및 배면공동 등의 문제를 야기한다. 본 논문에서는 비파괴 시험인 충격 반항 기법(Impact-Echo) 및 지하레이다 탐사(GPR)를 이용하여 경임에 타설된 숏크리트 배면의 접착상태를 평가하고자 하였다. 기존의 수치해석 연구에 대한 검증과 더불어 현장 적용성에 대한 검토를 위해 실험적 연구를 수행하였다. 숏크리트의 접착상태는 완전 접착, 접착력 상실 및 공동 조건으로 구분할 수 있다. 실내 실대형 시험체에 이 세 가지 숏크리트 접착상태를 조사하였다. 충격반향시험으로부터 획득된 신호는 시간영역, 주파수 영역, 및 시간-주파수 영역에서 각각 분석되었다. 능동적 신호 처리 기법인 Short-Time Fourier Transform(STFT)을 이용하여 숏크리트 배면의 접착상태를 효과적으로 예측할 수 있었으며, 그 결과는 기존의 수치해석 연구로부터 획득한 신호특성과 잘 부합하였다. 숏크리트 배면의 접착상태가 불량할수록 다음과 같은 특징들을 나타낸다. 즉, 주파수 영역에서 자기스펙트럼밀도가 커지며, 기하학적 감쇠비는 감소하고, 시간-주파수 영역에서 윤곽선은 시간축에 평행한 형상을 나타내며, 숏크리트 두께가 얇을수록 그 공진시간이 길어진다. 또한 본 연구에서 제시한 상관계수를 이용하여 숏크리트의 접착상태를 정량적으로 평가할 수 있다. 본 연구 결과를 바탕으로 숏크리트의 접착상태를 평가할 수 있는 평가 기법 및 평가 기준을 제안하였다.