Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging (기판단위 밀봉 패키징을 위한 내압 동공열의 설계 및 강도 평가)
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- Transactions of the Korean Society of Mechanical Engineers A
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- v.25 no.1
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- pp.11-15
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- 2001