• 제목/요약/키워드: Bonding layer

검색결과 772건 처리시간 0.031초

Facile Modulation of Electrical Properties on Al doped ZnO by Hydrogen Peroxide Immersion Process at Room Temperature

  • Park, Hyun-Woo;Chung, Kwun-Bum
    • Applied Science and Convergence Technology
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    • 제26권3호
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    • pp.43-46
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    • 2017
  • Aluminum-doped ZnO (AZO) thin films were deposited by atomic layer deposition (ALD) with respect to the Al doping concentrations. In order to explain the chemical stability and electrical properties of the AZO thin films after hydrogen peroxide ($H_2O_2$) solution immersion treatment at room temperature, we investigated correlations between the electrical resistivity and the electronic structure, such as chemical bonding state, conduction band, band edge state below conduction band, and band alignment. Al-doped at ~ 10 at % showed not only a dramatic improvement of the electrical resistivity but also excellent chemical stability, both of which are strongly associated with changes of chemical bonding states and band edge states below the conduction band.

Monodisperse Micrometer-Ranged Poly(methyl methacrylate) Hybrid Particles Coated with a Uniform Silica Layer

  • Han, Seung-Jin;Shin, Kyo-Min;Suh, Kyung-Do;Ryu, Jee-Hyun
    • Macromolecular Research
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    • 제16권5호
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    • pp.399-403
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    • 2008
  • Monodisperse, micron-sized, hybrid particles having a core-shell structure were prepared by coating the surface of poly(methyl methacrylate)(PMMA) microspheres with silica and by copolymerizing acrylamide (AAm) to supply the hydrogen bonding effect by means of the amide groups. Tetraethoxysilane (TEOS) was then slowly dropped onto the medium under certain conditions. Because of the hydrogen bonding between the amide of the PMMA particles and the hydroxyl group of the hydrolyzed silanol, a silica shell was generated on the PMMA core particles. The morphology of the hybrid particles was investigated with transmission (TEM) and scanning (SEM) electron microscopy as a function of the medium conditions and the amount of TEOS. Improved thermal properties were observed by TGA analysis.

Glass Infilteration in Bonding of $BaTiO_3$ and $Al_2O_3$ Layers

  • Shin, Hyo-Soon;Wang, Jong-Hoe;Kim, Jong-Hee
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1209-1210
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    • 2006
  • A novel sintering process is proposed for bonding of $BaTiO_3$ and $Al_2O_3$ layers. Common commercial glass was used and infilterated among filler particles. As the kind of commercial glass, the phenomenon of the infilteration is different. Although Sud-1140 glass forms a glass/filler composite, it is not completely infilterated into the filler particles at $900^{\circ}C$. However as the increase of sintering temperature the infilteration of glass was improved. In this study, GA-1 and GA-12 glasses were infilterated the more than Sud-1140 glass. However, they are reacted by $BaTiO_3$ layer. The results of the experiment show that constrained sintering and the co-firing of the different materials were possible for glass infilteration using Sud-1140 glass at $1000^{\circ}C$.

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Ti 첨가에 의한 심재의 결정립미세화 처리가 4343/3003/4343 알루미늄 클래드 판재의 브레이징 특성에 미치는 영향 (The Effect of Grain Refinement by Ti Addition on Brazing Characteristic of 4343/3003/4343 Aluminum Clad Sheet)

  • 신제식;문병문
    • 한국주조공학회지
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    • 제30권5호
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    • pp.187-195
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    • 2010
  • In this study, in order to obtain a useful guide line for design and production of automotive heat exchanger components made of 4343/3003/4343 aluminum clad sheets, it was aimed to improve the understanding about the grain refinement effect on brazing characteristic of the clad sheets. Al-10Ti master alloy was used for grain refinement of 3003 core alloy, and the Ti inoculation level was systematically changed up to 0.1 wt%. The three-layer aluminum clad sheets were fabricated by hot roll bonding process. The effect of grain refinement on brazing characteristic of the clad sheets was investigated by evaluating wettability, bonding strength and sagging resistance.

저온소성 기판과 Cu와의 동시소성에 미치는 CuO의 첨가효과 (The Influence of CuO on Bonding Behaviors of Low-Firing-Substrate and Cu Conductor)

  • 박정현;이상진
    • 한국세라믹학회지
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    • 제31권4호
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    • pp.381-388
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    • 1994
  • A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

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금속-도재관용 Ni-Cr 합금의 표면산화물특성에 따른 전단결합강도 관찰 (Shear Bonding Strength by the Characteristic of Metal Oxidation on the Surface of Ni-Cr Alloy for Porcelain Fused Metal Crown)

  • 정인성;김치영
    • 대한치과기공학회지
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    • 제35권4호
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    • pp.359-364
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    • 2013
  • Purpose: This study was to observe characteristic of metal oxidation and bonding strength according to composition of Ni-Cr alloy for porcelain fused to metal crown. The three kinds of Ni-Cr alloy with different composition ratio of parent metal were observed general properties and chemical properties of each alloy surface and measured the shear bonding strength between ceramic and each alloys. The aim of study was to suggest the material for design of parent metal's composition ratio to development of alloy for porcelain fused to metal crown. Methods: The three kinds of alloy as test specimen was Ni(59wt%)-Cr(24wt%), Ni(67wt.%)-Cr(16wt.%) alloy and Ni(71wt%)-Cr(12wt%)alloy. The oxide on surface was observed by EDX. And the shear test was performed by MTS. Results: The surface property and oxide characteristic analysis of oxide layer, weight percentage of Element O within $Ni_{59}Cr_{24}$ alloy measured 23.03wt%, $Ni_{67}Cr_{16}$ alloy measured 21.13wt% and $Ni_{71}Cr_{12}$ alloy was measured 48.55wt%. And the maximum shear bonding strength was measured 58.02Mpa between $Ni_{59}Cr_{24}$ alloy and vintage halo(H2 group). Conclusion: The surface property and oxide characteristic three kind of Ni-Cr alloy was similar. and shear bonding strength showed the highest bonding strength in H2 specimens.

Methanoplanus limicola S-Layer 당단백질 2차원 결정의 구조적 특성 (Structural Character of Two-Dimensional Crystal of the S-Layer Glycoprotein from Methanoplanus limicola)

  • 정강원;곽대오;주우홍
    • Applied Microscopy
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    • 제24권1호
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    • pp.102-113
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    • 1994
  • A thin section of the methanogenic archaebacterium, Methanoplanus limicola, shows that the surface glycoprotein array (S-layer) is separated from plasma membrane by a distinct inter-space, approximately 4.0-6.0nm wide. We report our structural study of the S-layer by electron crystallographic techniques. Image analysis and thin sections of the S-layer treated with and without triton disclosed that retention of the single layer crystal requires the presence of detergent to avoid hydrophobic bonding.

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Thick Graphene Embedded Metal Heat Spreader with Enhanced Thermal Conductivity

  • Park, Minsoo;Chun, Kukjin
    • 센서학회지
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    • 제23권4호
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    • pp.234-237
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    • 2014
  • In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

Three-Dimensional Nanofabrication with Nanotransfer Printing and Atomic Layer Deposition

  • 김수환;한규석;한기복;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.87-87
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    • 2010
  • We report a new patterning technique of inorganic materials by using thin-film transfer printing (TFTP) with atomic layer deposition. This method consists of the atomic layer deposition (ALD) of inorganic thin film and a nanotransfer printing (nTP) that is based on a water-mediated transfer process. In the TFTP method, the Al2O3 ALD growth occurs on FTS-coated PDMS stamp without specific chemical species, such as hydroxyl group. The CF3-terminated alkylsiloxane monolayer, which is coated on PDMS stamp, provides a weak adhesion between the deposited Al2O3 and stamp, and promotes the easy and complete release of Al2O3 film from the stamp. And also, the water layer serves as an adhesion layer to provide good conformal contact and form strong covalent bonding between the Al2O3 layer and Si substrate. Thus, the TFTP technique is potentially useful for making nanochannels of various inorganic materials.

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콘크리트포장 위 아스팔트 덧씌우기용 택코팅 재료의 접착강도특성 연구 (Investigation into Bonding Characteristics of Tack Coat Materials for Asphalt Overlay on Concrete Pavement)

  • 조문진
    • 한국도로학회논문집
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    • 제15권4호
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    • pp.85-94
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    • 2013
  • PURPOSES: The performance of tack coat, commonly used for layer interface bonding, is affected by application rate and curing time. In this study, bonding strength tests were performed according to the application rate and curing time of asphalt emulsion. Based on finding from this study, optimum application rates and curing times are proposed. METHODS: In order to investigate bonding characteristic of asphalt emulsion, tests were performed on both asphalt concrete pavement and portland concrete pavement. Also, asphalt emulsions were tested at the application rate of 0, 0.2, 0.4, 0.6, and $0.8{\ell}/m^2$ and at the curing time of 0, 0.5, 1, 2, and 24 hours. Pull-off test and shear bonding strength test, which commonly used for bonding strength measurement of asphalt emulsion, were adopted for this study. To assess field performance under different testing condition, asphalt emulsions were applied to in-service pavement. Throughout coefficient of determination analysis between material index properties from asphalt emulsion and mechanical response from bonding strength tests, performance correlativity was analyzed. RESULTS: Test results show that optimum application rate for asphalt overlay on asphalt concrete pavement (AOA) and asphalt overlay on concrete pavement (AOC) was $0.4{\sim}0.5{\ell}/m^2$ and $0.3{\sim}0.5{\ell}/m^2$, respectively. According to the curing time increment, tensile strength and shear strength of AOC were increased to 22~44% and 20~39%, respectively. AOA case also show strength increment in tensile strength (42%) and shear strength (9%). We tested the applicability of tack coat materials at the field sites, and our findings demonstrated that the bonding (for D and E) and rapid curing (for B, C, and D, E) performances were superior than others. Among material index properties, there was a high correlation between penetration ratio and bonding strength test result. CONCLUSIONS : Result show that interlayer bonding strength was affected by asphalt emulsion type, application rate and curing time. AOC required slightly higher application ($0.1{\ell}/m^2$) than AOA. Both AOA and AOC cases show higher strength at longer curing time. Up to 2hours of curing, rapid strength increments were observed, but strength increment ratio was decreased after 2hours of curing. From the observed correlation between penetration ratio and bonding strength, it is expected that penetration ratio can be used as one of important factors affecting bonding strength analysis.