• 제목/요약/키워드: Bonding characteristic

검색결과 187건 처리시간 0.028초

Feasibility study of bonding state detection of explosive composite structure based on nonlinear output frequency response functions

  • Si, Yue;Zhang, Zhou-Suo;Wang, Hong-fang;Yuan, Fei-Chen
    • Steel and Composite Structures
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    • 제24권4호
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    • pp.391-397
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    • 2017
  • With the increasing application of explosive composite structure in many engineering fields, its interface bonding state detection is more and more significant to avoid catastrophic accidents. However, this task still faces challenges due to the complexity of the bonding interface. In this paper, the concept of nonlinear output frequency response functions (NOFRFs) is introduced to detect the bonding state of explosive composite structure. The NOFRFs can describe the nonlinear characteristics of nonlinear vibrating system. Because of the presence of the bonding interface, explosive composite structure itself is a nonlinear system; when bonding interface of the structure is damaged, its dynamic characteristics show enhanced nonlinear characteristic. Therefore, the NOFRFs-based detection index is proposed as indicator to detect the bonding state of explosive composite pipes. The experimental results verify the effectiveness of the detection approach.

정전 열 접합에 의한 진공전자소자의 패키징 (Packaging of Vacuum Microelectronic Device using Electrostatic Bonding)

  • 주병권;이덕중;오명환
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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    • pp.1004-1006
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    • 1998
  • Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

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Characteristic rheological responses of PVA solutions in water-containing solvents

  • Song, Song-Ie;Kim, Byoung-Chul
    • 한국섬유공학회:학술대회논문집
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    • 한국섬유공학회 2003년도 가을 학술발표회 논문집
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    • pp.181-182
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    • 2003
  • Poly(vinyl alcohol) (PVA) is a semicrystalline polymer whose hydroxyl groups produce inter-and intramolecular hydrogen bonding. The extent of hydrogen bonding is greatly affected by stereoregularity of hydroxyl groups, so-called tacticity, of PVA[1-3]. Hydrogen bonding has a profound effect on the rheological and mechanical properties of the polymer, which is largely determined by the density and spatial arrangement of hydroxyl groups. (omitted)

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Inhomogeneous bonding state modeling for vibration analysis of explosive clad pipe

  • Cao, Jianbin;Zhang, Zhousuo;Guo, Yanfei;Gong, Teng
    • Steel and Composite Structures
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    • 제31권3호
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    • pp.233-242
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    • 2019
  • Early detection of damage bonding state such as insufficient bonding strength and interface partial contact defect for the explosive clad pipe is crucial in order to avoid sudden failure and even catastrophic accidents. A generalized and efficient model of the explosive clad pipe can reveal the relationship between bonding state and vibration characteristics, and provide foundations and priory knowledge for bonding state detection by signal processing technique. In this paper, the slender explosive clad pipe is regarded as two parallel elastic beams continuously joined by an elastic layer, and the elastic layer is capable to describe the non-uniform bonding state. By taking the characteristic beam modal functions as the admissible functions, the Rayleigh-Ritz method is employed to derive the dynamic model which enables one to consider inhomogeneous system and any boundary conditions. Then, the proposed model is validated by both numerical results and experiment. Parametric studies are carried out to investigate the effects of bonding strength and the length of partial contact defect on the natural frequency and forced response of the explosive clad pipe. A potential method for identifying the bonding quality of the explosive clad pipe is also discussed in this paper.

HF 전처리시 실리콘 기판의 초기접합 메카니즘에 관한 연구 (A study on pre-bonding mechanism of Si wafer at HF pre-treatment)

  • 강경두;박진성;이채봉;주병권;정귀상
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3313-3315
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    • 1999
  • Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera respectively. A bond characteristic on the interface was analyzed by using IT- IR. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si $OH{\cdots}(HOH{\cdots}HOH{\cdots}HOH){\cdots}OH-Si$. The bond strength depends on the HF pre-treatment condition before pre- bonding (Min:$2.4kgf/crn^2{\sim}Max:14.9kgf/crn^2$)

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CRUSHING CHARACTERISTIC OF DOUBLE HAT-SHAPED MEMBERS OF DIFFERENT MATERIALS JOINED BY ADHESIVE BONDING AND SELF-PIERCING RIVET

  • Lee, M.H.;Kim, H.Y.;Oh, S.I.
    • International Journal of Automotive Technology
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    • 제7권5호
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    • pp.565-570
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    • 2006
  • The development of a light-weight vehicle is in great demand for enhancement of fule efficiency and dynamic performance. The vehicle weight can be reduced effectively by using lightweight materials such as aluminum and magnesium. However, if such materials are used in vehicles, there are often instances when different materials such as aluminum and steel need to be joined to each other. The conventional joining method, namely resistance spot welding, cannot be used in joining different materials. Self-piercing rivet(SPR) and adhesive bonding, however, are good alternatives to resistance spot welding. This paper is concerned with the crushing test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding. Various parameters of crashworthiness are analyzed and evaluated. Based on these results, the applicability of SPR and adhesive bonding are proposed as an alternative to resistance spot welding.

초소성 및 확산접합을 이용한 우주항공 부품 성형기술 개발 (Development of Aerospace Components Forming Technology using Superplasticity and Diffusion Bonding Characteristic)

  • 이호성;윤종훈;이영무
    • 한국군사과학기술학회지
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    • 제8권3호
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    • pp.51-55
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    • 2005
  • In this paper, a near net shape technology using superplasticity and diffusion bonding characteristics was presented for application to various components of aircraft and missiles. Due to these special characteristics of some aerospace alloys, it is possible to produce complex components to shape very near final dimension with enhanced design freedom, reduced material usage, and overall saving of weight and cost. The high pressure vessel for a space launcher was fabricated with Ti-6Al-4V alloy by superplastic forming and diffusion bonding process and the failure characteristics are compared with conventionally fabricated vessel spin formed and TIG welded. The structural integrity of the superplastic forming and diffusion bonding process was successfully demonstrated.

1.5wt%C 초고탄소 워크롤 제조를 위한 단조 공정 설계: 기공압착 및 접합강도 분석 (Process Design for Manufacturing 1.5wt%C Ultrahigh Carbon Workroll: Void Closure Behavior and Bonding Strength)

  • 임형철;이호원;김병민;강성훈
    • 소성∙가공
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    • 제22권5호
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    • pp.269-274
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    • 2013
  • Experiments and numerical simulations of the incremental upsetting test were carried out to investigate void closure behavior and mechanical characteristic of a 1.5wt%C ultra-high carbon steel. The experimental results showed that the voids become quickly smaller as the reduction ratio increases. The simulation results confirmed this behavior and indicated that the voids were completely closed at a reduction ratio of about 40~45% during incremental upsetting. After the completion of the incremental upsetting tests, the process of diffusion bonding was employed to heal the closed voids in the deformed specimens. To check the appropriate temperature for diffusion bonding, deformed specimens were kept at 800, 900, 1000 and $1100^{\circ}C$ for an hour. In order to investigate the effect of holding time for diffusion bonding at $1100^{\circ}C$, specimens were kept at 10, 20, 30, 40, 50 and 60minutes in the furnace. A distinction between closed and healed voids was clearly established using microstructural observations. In addition, subsequent tensile tests demonstrated that complete healing of a closed void was achieved for diffusion bonding temperatures in the range $900{\sim}1100^{\circ}C$ with a holding time larger than 1 hour.

브레이징한 Ti/Cu 접합계면부의 미세조직 특성 (A Characteristic of Microstructures in Bonding Interlayer of Brazed Titanium to Copper)

  • 김우열;정병호;이성렬
    • Journal of Welding and Joining
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    • 제13권3호
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    • pp.106-115
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    • 1995
  • To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

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