• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1376-1379
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• 2004

This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• The korean journal of orthodontics
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• v.3 no.1
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• pp.21-28
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• 1972

저자는 direct bonding system의 pretreatment액 처리후 Epoxy adhesive의 bonding strength의 변화를 측정하기 위해서 발거된 상악 전치 진면 법랑질 표면에 pretreatment액으로서 $65\%$ phosphoric acid를 도포한 실험군과 도포하지 않은 비교군을 비교연구하고 임상에 적용하여 다음과 같은 결과를 얻었다. 1. 법랑질 표면에 pumicing과 $65\%$ phosphoric acid를 도포했을때 joint strength는 현저히 상승했다. 2. Epoxy adhesive의 bonding strength는 plastic attachment를 치아면에 접착유지시키기에 충분하며 임상적으로 이용할 수 있다. 3. Joint area가 클 수록 bonding strength는 증가했다.

• Journal of the Semiconductor & Display Technology
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• v.4 no.2 s.11
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• pp.33-37
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.

• Journal of the korean academy of Pediatric Dentistry
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• v.33 no.3
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• pp.422-428
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• 2006

Dentin bonding system have recently been developed in an effort to simplify and shorten bonding procedure. The intent of this study was to evaluate microleakage of newer generation of dentin bonding system comparing with other generations. Forty extracted human premolar teeth were randomly assigned to four groups for bonding : the 4th generation bonding system (Scotchbond Multi-Purpose). the 5th generation bonding system (Clearfil SE Bond), 6th generation bonding system (AQ bond) and 7th generation bonding $system(i-bond)^{TM}$ Class V cavities were prepared in buccal and lingual surface. The cavities were restored with composite resin (Z100) after the application of dentin bonding systems according to the instructions of the manufacturer Samples were thermocycled and immersed in methylene blue dye(2%). Each sample was sectioned with Isomet and evaluated for microleakage using stereomicroscopy. The mean value of the microleakage in 7th generation bonding system was greater than those of 4, 5, 6th generation dentin bonding system. Statistically, the mean values of microleakage between 4th and 7th generation bonding system were significantly different from each other (p<0.05).

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.2
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• pp.263-271
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• 2003

The purpose of the present study was to evaluate the patterns of hybrid layer according to the application time and the frequency and its effects on the shear bonding strength of All-In-One system in primary teeth. A single bonding agent(Scotchbond Multi-Purpose Plus, 3M) and an All-In-One system(Prompt L-pop, 3M ESPE) were applied on the dentin varying the application time and the frequency in primary teeth. Shear bond strength was measured and the patterns of hybrid layers were observed by SEM. The following results were obtained ; 1. The shear bonding strength of single bonding agent was significantly higher than that of All-In-One system(P<0.05). 2. The shear bonding strength of All-In-One system applied twice or 3 times were higher than that of applied once (P<0.05). And thickness of the hybrid layer was increased when applied twice or 3 times compared to once. 3. The shear bonding strength of All-In-One system when applied for 15 second and 30 second were higher than that of 7 second (P<0.05). And the hybrid layer thickness of 15 second and 30 second's application time were higher than that of 7 second. 4. Thickness of hybrid layer applied with single bonding agent was $2-4{\mu}m$ and that of All-In-One system was $1-2{\mu}m$.

• Journal of the korean academy of Pediatric Dentistry
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• v.23 no.4
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• pp.867-886
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• 1996

The purpose of this study was to evaluate the shearbond strength and resin-dentin interface of three different dentinal bonding systems in primary and permanent teeth. Thirty extracted human primary molars and premolars, which were non-carious and free of obvious defect, were selected for this study. All specimens were divided into six groups with two groups allocated for each of the three dentinal bonding system(All-bond 2, Scotchbond Multi-Purpose, Gluma bonding system). After completion of bonding composite to dentin using each tested dentin bonding system, bond strength measurement and histological observation were performed. The results are as follows: 1. All-bond 2 and Scotchbond Multi-Purpose, A good quality hybrid layer was identified, the morphology of which could be equated with the zone of H-E and Brown-Brenn staining. In Gluma bonding system, hybrid layer was very thin, and separated from the solid polymer. 2. All-bond 2 had the highest mean shearbond strength, followed by Scotchbond Multi-Purpose and Gluma bonding system in both primary and permanent teeth. There was no statistically significant difference between All-bond 2 and Scotchbond Multi-Purpose. Statistically significant difference could be found between Gluma bonding system and the other two groups(p<0.05). 3. The fracture patterns observed were mainly the mixture of adhesive failure and dentin dettachment pattern in All-bond 2 and Scotchbond Multi-Purpose while adhesive failure prevailed in Gluma bonding system.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• Journal of the Korean Ceramic Society
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• v.45 no.10
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• pp.600-604
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• 2008

Although titanium-ceramic systems have gained substantial interests in dental prosthetic field, bonding problem between porcelain and titanium has not been solved. Main obstacle in titanium-porcelain bonding is excessive oxidation of titanium during porcelain firing. The effects of several coating materials on the bonding strength of titanium-porcelain system were investigated in this study. RF sputtering and electroplating of platinum significantly increased the bonding strength of porcelain-titanium specimen. However, coatings of Ni-Au, Ir, and ceramics(zirconia and hydroxyapatite) did not showed a significant effect on bonding strength. Platinum might be a promising material for the protective layer of excessive oxidation of titanium during porcelain firing, resulting in increase in the bonding strength.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.147-154
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• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.