• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1376-1379
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• 2004

This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• 대한치과교정학회지
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• 제3권1호
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• pp.21-28
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• 1972

저자는 direct bonding system의 pretreatment액 처리후 Epoxy adhesive의 bonding strength의 변화를 측정하기 위해서 발거된 상악 전치 진면 법랑질 표면에 pretreatment액으로서 $65\%$ phosphoric acid를 도포한 실험군과 도포하지 않은 비교군을 비교연구하고 임상에 적용하여 다음과 같은 결과를 얻었다. 1. 법랑질 표면에 pumicing과 $65\%$ phosphoric acid를 도포했을때 joint strength는 현저히 상승했다. 2. Epoxy adhesive의 bonding strength는 plastic attachment를 치아면에 접착유지시키기에 충분하며 임상적으로 이용할 수 있다. 3. Joint area가 클 수록 bonding strength는 증가했다.

• 반도체디스플레이기술학회지
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• 제4권2호
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• pp.33-37
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified fer other bonding methods such as ACF.

• 대한소아치과학회지
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• 제33권3호
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• pp.422-428
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• 2006

상아질 접착제는 많은 발전을 거듭하여 적용 단계가 단순화되고 짧아져서 어린이에게 사용하기에 더욱 편리해졌다. 본 연구에서는 최근 개발된 7세대 결합제인 $i-bond^{TM}$(Kulzer, Germany)의 미세누출을 기존에 사용되는 다른 결합제와 비교하여 그 효용성을 평가하기 위함이다. 40개의 교정적 목적으로 발거된 건전한 소구치의 협면과 설면에 5급 와동을 형성하고 무작위로 4개의 군으로 나누었다. 1군은 4세대인 Scotchbond $Multi-Purpose^{(R)}$(3M, USA), 2군은 5세대 Clearfil SE Bond(Kuraray, Japan), 3군은 6세대 AQ Bond(Sun medical, Japan), 4군은 7세대 $i-bond^{TM}$(Kulzer, Germany)를 적용하고 복합레진 Z100(3M, USA)으로 충전하였다. 시편을 $5^{\circ}C$와 $55^{\circ}C$에 각 30초간 계류시켜 1,000회 열순환하고 2% methylene blue 용액에 24시간 넣어 염료를 침투시킨 뒤, 저속 diamond cutter($Isomet^{TM}$, Buehler, USA)를 이용하여 주수하에 치아를 협설로 절단하였다. 색소의 침투 정도를 입체현미경을 이용하여 침투깊이를 0에서 3점으로 채점하여 측정한 뒤 미세누출 정도를 비교하였다. 결과적으로 7세대 결합제의 미세누출 평균값이 다른 결합제보다 높게 나왔으며, 특히 4세대 결합제와는 통계적으로 유의한 차이가 있었다.

• 대한소아치과학회지
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• 제30권2호
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• pp.263-271
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• 2003

본 연구는 All-In-One system의 적용 시간과 도포횟수에 따라 유치 상아질과 복합레진의 접착 강도와 혼성층에 어떤 영향을 미치는지를 규명하고자 Single bonding agent(Scotchbond Multi-Purpose Plus, 3M, USA)와 All-In-One system(Prompt-L pop, 3M ESPE, USA)를 사용하였고 수복용 레진으로 복합레진(Z-250, 3M, USA)를 사용한 결과 다음과 같은 결과를 얻을 수 있었다. 1. 전단 결합 강도는 Single bonding agent를 적용한 경우 All-In-One system을 적용한 군보다 유의하게 높게 나타났다(P<0.05). 2. Prompt L-pop을 2회, 3회 적용한 경우에 전단 결합 강도는 1회 적용한 군보다 유의하게 높게 나타났으며(P<0.05), 혼성층의 두께는 1회 적용군보다 2회, 3회 적용한 군에서 증가하였다. 3. Prompt L-pop을 15초 적용한 경우에 전단 결합 강도는 7초 적용한 군보다 유의하게 높게 나타났으며(P<0.05), 30초 적용군과는 차이가 없었다. 혼성층의 두께는 7초 적용군이 가장 얇고, 15초군과 30초군에서는 차이가 없었다. 4. Single bonding agent를 이용한 경우 두터운 $2-4{\mu}m$의 혼성층이 관찰된 반면, All-In-One bonding system(Prompt L-pop, 3M ESPE, USA)에서는 비교적 얇은 혼성층($1-2{\mu}m$)이 형성되었다.

• 대한소아치과학회지
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• 제23권4호
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• pp.867-886
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• 1996

The purpose of this study was to evaluate the shearbond strength and resin-dentin interface of three different dentinal bonding systems in primary and permanent teeth. Thirty extracted human primary molars and premolars, which were non-carious and free of obvious defect, were selected for this study. All specimens were divided into six groups with two groups allocated for each of the three dentinal bonding system(All-bond 2, Scotchbond Multi-Purpose, Gluma bonding system). After completion of bonding composite to dentin using each tested dentin bonding system, bond strength measurement and histological observation were performed. The results are as follows: 1. All-bond 2 and Scotchbond Multi-Purpose, A good quality hybrid layer was identified, the morphology of which could be equated with the zone of H-E and Brown-Brenn staining. In Gluma bonding system, hybrid layer was very thin, and separated from the solid polymer. 2. All-bond 2 had the highest mean shearbond strength, followed by Scotchbond Multi-Purpose and Gluma bonding system in both primary and permanent teeth. There was no statistically significant difference between All-bond 2 and Scotchbond Multi-Purpose. Statistically significant difference could be found between Gluma bonding system and the other two groups(p<0.05). 3. The fracture patterns observed were mainly the mixture of adhesive failure and dentin dettachment pattern in All-bond 2 and Scotchbond Multi-Purpose while adhesive failure prevailed in Gluma bonding system.

• Journal of Welding and Joining
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• 제30권6호
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• 한국세라믹학회지
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• 제45권10호
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• pp.600-604
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• 2008

Although titanium-ceramic systems have gained substantial interests in dental prosthetic field, bonding problem between porcelain and titanium has not been solved. Main obstacle in titanium-porcelain bonding is excessive oxidation of titanium during porcelain firing. The effects of several coating materials on the bonding strength of titanium-porcelain system were investigated in this study. RF sputtering and electroplating of platinum significantly increased the bonding strength of porcelain-titanium specimen. However, coatings of Ni-Au, Ir, and ceramics(zirconia and hydroxyapatite) did not showed a significant effect on bonding strength. Platinum might be a promising material for the protective layer of excessive oxidation of titanium during porcelain firing, resulting in increase in the bonding strength.

• Journal of Welding and Joining
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• 제13권4호
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• pp.147-154
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• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.