• Journal of Conservation Science
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• v.35 no.1
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• pp.33-40
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• 2019

During the conservation and maintenance of the birthplace center yard of President Asan Yoon Bosun, four porcelain enamel dishware were excavated from the central yard well. The glaze layer of excavated enamel was severely damaged; hence, the conservation process was done rapidly. In addition, scientific investigation and analysis were conducted to confirm the material properties of the glaze layer. It was confirmed that the outer surface was inverted and dried, while the inner surface was upright and fired during the glazing and drying process by measuring the film thickness. By examining the breakup phenomenon, the breaking up of the white enamel on the colored enamel was confirmed. This indicates that the colored glaze rose to the surface depending on the density of the colored glaze and white glaze. The investigation of the cross-section of the film confirmed that the lower layer formed according to the bonding properties with metal during the glazing process. Analysis of the constituents of the identified lower layer confirmed that there are differences between the specific components of the metal oxide of the lower layer and the surface color development of the upper layer.

• Journal of the Korean Ceramic Society
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• v.27 no.7
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• pp.925-933
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• 1990

The possible use of bioglass,, which is one of the surface active biomaterials, as implants materials has drawn great attention due to their ability to bond to human living tissue. In the present work, the investigation was carried out to find the bonding phenomena between alumina substrate and bioglass(45S5) or fluorine-containing bioglass(45S5$.$4F), and the properties of coated bioglass. The stable bonding between alumina and bioglass was formed when heat-treated at 1150$^{\circ}C$ for 120 minutes or at 1250$^{\circ}C$ for 30 minutes for the 45S5, and at 1150$^{\circ}C$ for 30 minutes for the 45S5$.$4F. When bioglass coated alumina was heat-treated, great amount of Al was diffused into bioglass from alumina substrate. More Al was diffused into fluorine-containing bioglass than into bioglass without fluorine. At early stage of heat-tretment, the diffused alumina content was increased with the square root of time and it was also increased with the thickness of coating layer and heat-treatment temperatures. The alumina content became constant after its saturation for longer heat-treatment time. Coated bioglasses were crystallized to Na2O$.$CaO$.$3SiO2 when heat-treated at lower temperature, and to CaO$.$SiO2 at higher temperature.

• Advances in aircraft and spacecraft science
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• v.11 no.1
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• pp.83-103
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• 2024

Adhesive bonding is currently widely used in many industrial fields, particularly in the aeronautics sector. Despite its advantages over mechanical joints such as riveting and welding, adhesive bonding is mostly used for secondary structures due to its low peel strength; especially if it is simultaneously exposed to temperature and humidity; and often presence of bonding defects. In fact, during joint preparation, several types of defects can be introduced into the adhesive layer such as air bubbles, cavities, or cracks, which induce stress concentrations potentially leading to premature failure. Indeed, the presence of defects in the adhesive joint has a significant effect on adhesive stresses, which emphasizes the need for a good surface treatment. The research in this field is aimed at minimizing the stresses in the adhesive joint at its free edges by geometric modifications of the ovelapping part and/or by changing the nature of the substrates. In this study, the finite element method is used to describe the mechanical behavior of bonded joints. Thus, a three-dimensional model is made to analyze the effect of defects in the adhesive joint at areas of high stress concentrations. The analysis consists of estimating the different stresses in an adhesive joint between two 2024-T3 aluminum plates. Two types of single lap joints(SLJ) were analyzed: a standard SLJ and another modified by removing 0.2 mm of material from the thickness of one plate along the overlap length, taking into account several factors such as the applied load, shape, size and position of the defect. The obtained results clearly show that the presence of a bonding defect significantly affects stresses in the adhesive joint, which become important if the joint is subjected to a higher applied load. On the other hand, the geometric modification made to the plate considerably reduces the various stresses in the adhesive joint even in the presence of a bonding defect.

• Restorative Dentistry and Endodontics
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• v.24 no.4
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• pp.546-553
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• 1999

In Older to evaluate the effectiveness of 'One-bottle dentin adhesive system', the shear bond strengths of two fourth generation dentin adhesive systems and two One-bottle systems to the occlusal dentin of the freshly extracted third molars were measured by the regulation of the ISO TR 11405. The fourth generation dentin adhesive systems used in this study were Scotchbond Multi-Purpose Plus and All-Bond 2, and the One-bottle systems were Single Bond and One-Step. The effects of the thickness of hybrid layer and adhesive layer, the diameter of resin tag and the ratio between the diameter of resin tag and that of dentinal tubule were analyzed as the contributing factors of the shear bond strength of dentin bonding systems from the Scanning Electron Microscopic images. The results were as follows: 1. The shear bond strengths of Scotchbond Multi-Purpose, All-Bond 2, and Single Bond were 16.98${\pm}$3.40 MPa, 15.10${\pm}$2.77 MPa and 15.05${\pm}$3.18 MPa, respectively. There were no statistical differences(p>0.05). 2. But, the shear bond strength of One-Step were significantly lower than those of the other groups (11.81${\pm}$1.95 MPa, p<0.05). 3. The thicknesses of hybrid layer and adhesive layer of One-Step were significantly thinner than those of the other groups(p<0.05). The differences of the diameter of resin tag(p=0.0685) and the ratio between the diameter of resin tag and that of dentinal tubule(p=0.2401) were not significant among all the material groups. 4. The thickness of hybrid layer and adhesive layer might be considered as contributing factors of the she at bond strengths of dentin bonding systems, but the diameter of resin tag and the ratio between the diameter of resin tag and that of dentinal tubule might not.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.655-659
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• 2011

An ultrafine grained complex aluminum alloy was fabricated by an accumulative roll-bonding (ARB) process using dissimilar aluminum alloys of AA1050 and AA5052 and subsequently annealed. A two-layer stack ARB process was performed up to six cycles without lubricant at an ambient temperature. In the ARB process, the dissimilar aluminum alloys, AA1050 and AA5052, with the same dimensions were stacked on each other after surface treatment, rolled to the thickness reduction of 50%, and then cut in half length by a shearing machine. The same procedure was repeated up to six cycles. A sound complex aluminum alloy sheet was fabricated by the ARB process, and then subsequently annealed for 0.5h at various temperatures ranging from 100 to $350^{\circ}C$. The tensile strength decreased largely with an increasing annealing temperature, especially at temperatures of 150 to $250^{\circ}C$. However, above $250^{\circ}C$ it hardly decreased even when the annealing temperature was increased. On the other hand, the total elongation increased greatly above $250^{\circ}C$. The hardness exhibited inhomogeneous distribution in the thickness direction of the specimens annealed at relatively low temperatures, however it had a homogeneous distribution in specimens annealed at high temperatures.

• Korean Journal of Materials Research
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• v.29 no.6
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• pp.392-397
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• 2019

A cold roll-bonding process is applied to fabricate an AA6061/AA5052/AA6061 three-layer clad sheet. Two AA6061 and one AA5052 sheets of 2 mm thickness, 40 mm width, and 300 mm length are stacked, with the AA5052 sheet located in the center. After surface treatment such as degreasing and wire brushing, sample is reduced to a thickness of 1.5 mm by multi-pass cold rolling. The rolling is performed at ambient temperature without lubricant using a 2-high mill with a roll diameter of 400 mm at rolling speed of 6.0 m/sec. The roll bonded AA6061/AA5052/AA6061 complex sheet is then hardened by natural aging(T4) and artificial aging(T6) treatments. The microstructures of the as-roll bonded and age-hardened Al complex sheets are revealed by optical microscopy; the mechanical properties are investigated by tensile testing and hardness testing. After rolling, the roll-bonded AA6061/AA5052/AA6061 sheets show a typical deformation structure in which grains are elongated in the rolling direction. However, after T4 and T6 aging treatment, there is a recrystallization structure consisting of coarse equiaxed grains in both AA5052 and AA6061 sheets. The as roll-bonded specimen shows a sandwich structure in which an AA5052 sheet is inserted into two AA6061 sheets with higher hardness. However, after T4 and T6 aging treatment, there is a different sandwich structure in which the hardness of the upper and lower layers of the AA6061 sheets is higher than that of the center of the AA5052 sheet. The strength values of the T4 and T6 age-treated specimens are found to increase by 1.3 and 1.4 times, respectively, compared to that value of the starting material.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.557-560
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• 2000

Combination of SDB(Si-wafer Direct Bonding) and electrochemical etch-stop in TMAH anisotropic etchant can be used to create a variety of MEMS(Micro Electro Mechanical System). Especially, fabrication of SDB SOI structures using electrochemical etch-stop is accurate method to fabrication of 3D(three-dimensional) microstructures. This paper describes on the fabrication of SDB SOI structures with sealed cavity for MEMS applications and thickness control of active layer on the SDB SOI structure by electrochemical etch-stop. The flatness of fabricated SDB SOI structure is very uniform and can be improved by addition of TMAH to IPA and pyrazine.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.273.1-273.1
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• 2014

Graphene, a two dimensional plane structure of $sp^2$ bonding, has been promised for a new material in many scientific fields such as physics, chemistry, and so on due to the unique properties. Chemical vapor deposition (CVD) method using transitional metals as a catalyst can synthesize large scale graphene with high quality and transfer on other substrates. However, it is difficult to control the number of graphene layers. Therefore, it is important to manipulate the number of graphene layers. In this work, homogeneous solid solution of Cu and Ni was used to control the number of graphene layers. Each films with different thickness ratio of Cu and Ni were deposited on $SiO_2/Si$ substrate. After annealing, it was confirmed that the thickness ratio accords with the composition ratio by X-ray diffraction (XRD). The synthesized graphene from CVD was analyzed via raman spectroscopy, UV-vis spectroscopy, and 4-point probe to evaluate the properties. Therefore, the number of graphene layers at the same growth condition was controlled, and the correlation between mole fraction of Ni and the number of graphene layers was investigated.

• Composites Research
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• v.17 no.6
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• pp.14-21
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• 2004

Failure process, mode and strength of unidirectional composite single lap bonded joints were investigated experimentally with respect to bonding methods, those are, co-curing with and without adhesive and secondary bonding. The co-cured joint specimens without adhesive had the largest failure strength. Progressive failures along the adhesive layer occurred in the secondary bonded specimens. In the co-cured specimens with adhesive film which had better material strength and adhesion performance, delamination failure occurred and the joint strengths were less than those of secondary bonded specimens. Delamination failure did not occur in the secondary bonded specimens because of earlier crack growth and progressive failure in the adhesive layer. Therefore, failure strength of composite bonded Joints were not always proportionate to material strength and adhesion performance of the adhesive due to the weakness of delamination in composite materials. The effects of surface roughness, bondline thickness and fillets were also studied on secondary bonded specimens.