• Title/Summary/Keyword: Bonding Layer Thickness

검색결과 169건 처리시간 0.028초

Analytical and numerical studies on hollow core slabs strengthened with hybrid FRP and overlay techniques

  • Kankeri, Pradeep;Prakash, S. Suriya;Pachalla, Sameer Kumar Sarma
    • Structural Engineering and Mechanics
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    • 제65권5호
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    • pp.535-546
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    • 2018
  • The objective of this study is to understand the behaviour of hollow core slabs strengthened with FRP and hybrid techniques through numerical and analytical studies. Different strengthening techniques considered in this study are (i) External Bonding (EB) of Carbon Fiber Reinforced Polymer (CFRP) laminates, (ii) Near Surface Mounting (NSM) of CFRP laminates, (iii) Bonded Overlay (BO) using concrete layer, and (iv) hybrid strengthening which is a combination of bonded overlay and NSM or EB. In the numerical studies, three-dimensional Finite Element (FE) models of hollow core slabs were developed considering material and geometrical nonlinearities, and a phased nonlinear analysis was carried out. The analytical calculations were carried out using Response-2000 program which is based on Modified Compression Field Theory (MCFT). Both the numerical and analytical models predicted the behaviour in agreement with experimental results. Parametric studies indicated that increase in the bonded overlay thickness increases the peak load capacity without reducing the displacement ductility. The increase in FRP strengthening ratio increased the capacity but reduced the displacement ductility. The hybrid strengthening technique was found to increase the capacity of the hollow core slabs by more than 100% without compromise in ductility when compared to their individual strengthening schemes.

Spin-coated ultrathin multilayers and their micropatterning using microfluidic channels

  • Hongseok Jang;Kim, Sangcheol;Jinhan Cho;Kookheon Char
    • Korea-Australia Rheology Journal
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    • 제15권1호
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    • pp.1-7
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    • 2003
  • A new method is introduced to build up organic/organic multilayer films composed of cationic poly(allylamine hydrochloride) (PAH) and negatively charged poly (sodium 4-styrenesulfonate) (PSS) using the spinning process. The adsorption process is governed by both the viscous force induced by fast solvent elimination and the electrostatic interaction between oppositely charged species. On the other hand, the centrifugal and air shear forces applied by the spinning process significantly enhances desorption of weakly bound polyelectrolyte chains and also induce the planarization of the adsorbed polyelectrolyte layer. The film thickness per bilayer adsorbed by the conventional dipping process and the spinning process was found to be about 4 ${\AA}$ and 24 ${\AA}$, respectively. The surface of the multilayer films prepared with the spinning process is quite homogeneous and smooth. Also, a new approach to create multilayer ultrathin films with well-defined micropatterns in a short process time is Introduced. To achieve such micropatterns with high line resolution in organic multilayer films, microfluidic channels were combined with the convective self-assembly process employing both hydrogen bonding and electrostatic intermolecular interactions. The channels were initially filled with polymer solution by capillary pressure and the residual solution was then removed by the .spinning process.

재산화 질화산화막의 기억트랩 분석과 프로그래밍 특성 (A Study on the Memory Trap Analysis and Programming Characteristics of Reoxidized Nitrided Oxide)

  • 남동우;안호명;한태현;서광열;이상은
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
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    • pp.17-20
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    • 2001
  • Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectric were fabricated, and nitrogen distribution and bonding species which contributing memory characteristics were analyzed. Also, memory characteristics of devices according to anneal temperatures were investigated. The devices were fabricated by 0.35$\mu\textrm{m}$ retrograde twin well CMOS processes. The processes could be simple by in-situ process of nitridation anneal and reoxidation. The nitrogen distribution and bonding state of gate dielectric were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary ton Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). Nitrogen concentrations are proportional to nitridation anneal temperatures and the more time was required to form the same reoxidized layer thickness. ToF-SIMS results show that SiON species are detected at the initial oxide interface and Si$_2$NO species near the new Si-SiO$_2$ interface that formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. These could be said that nitrogen concentration near initial interface is limited to a certain quantity, so excess nitrogen are redistributed near the Si-SiO$_2$ interface and contributed to electron trap generation.

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Effect of adhesive application method on repair bond strength of composite

  • Hee Kyeong Oh;Dong Hoon Shin
    • Restorative Dentistry and Endodontics
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    • 제46권3호
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    • pp.32.1-32.10
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    • 2021
  • Objectives: This study aimed to evaluate the effect of the application method of universal adhesives on the shear bond strength (SBS) of repaired composites, applied with different thicknesses. Materials and Methods: The 84 specimens (Filtek Z350 XT) were prepared, stored in distilled water for a week and thermocycled (5,000 cycles, 5℃ to 55℃). They were roughened using 400-grit sandpapers and etched with phosphoric acid. Then, specimens were equally divided into 2 groups; Single Bond Universal (SU) and Prime&Bond Universal (PB). Each group was subdivided into 3 subgroups according to application methods (n = 14); UC: 1 coat + uncuring, 1C: 1 coat + curing, 3C: 3 coats + curing. After storage of the repaired composite for 24 hours, specimens were subjected to the SBS test and the data were statistically analyzed by 2-way analysis of variance and independent t-tests. Specimens were examined with a stereomicroscope to analyze fracture mode and a scanning electron microscope to observe the interface. Results: Adhesive material was a significant factor (p = 0.001). Bond strengths with SU were higher than PB. The highest strength was obtained from the 1C group with SU. Bonding in multiple layers increased adhesive thicknesses, but there was no significant difference in SBS values (p = 0.255). Failure mode was predominantly cohesive in old composites. Conclusions: The application of an adequate bonding system plays an important role in repairing composite resin. SU showed higher SBS than PB and the additional layers increased the adhesive thickness without affecting SBS.

Analysis and modeling of hyperstatic RC beam bonded by composite plate symmetrically loaded and supported

  • Abderezak, Rabahi;Daouadji, Tahar Hassaine;Rabia, Benferhat
    • Steel and Composite Structures
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    • 제45권4호
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    • pp.591-603
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    • 2022
  • The flexural strengthening of reinforced concrete beams by external bonding of composite materials has proved to be an efficient and practical technique. This paper presents a study on the flexural performance of reinforced concrete continuous beams with three spans (one span and two cantilevered) strengthened by bonding carbon fiber fabric (CFRP). The model is based on equilibrium and deformations compatibility requirements in and all parts of the strengthened continuous beam, i.e., the continuous concrete beam, the FRP plate and the adhesive layer. The adherend shear deformations have been included in the present theoretical analyses by assuming a linear shear stress through the thickness of the adherends. Remarkable effect of shear deformations of adherends has been noted in the results. The theoretical predictions are compared with other existing solutions that shows good agreement, and It shows the effectiveness of CFRP strips in enhancing shear capacity of continuous beam. It is shown that both the normal and shear stresses at the interface are influenced by the material and geometry parameters of the composite beam.

Layering시 복합레진 층간의 계면 결합에서 oxygen inhibition layer가 필수적인가? (IS AN OXYGEN INHIBITION LAYER ESSENTIAL FOR THE INTERFACIAL BONDING BETWEEN RESIN COMPOSITE LAYERS?)

  • 김선영;조병훈;백승호;이인복
    • Restorative Dentistry and Endodontics
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    • 제33권4호
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    • pp.405-412
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    • 2008
  • 본 연구의 목적은 여러 가지 계면조건의 변화를 통해서 layering시 복합레진 층간의 결합에 oxygen inhibition layer (OIL)가 필수적인지를 고찰해보는 것이다. 가로 $\times$ 세로 $\times$ 두께가 16 $\times$ 28 $\times$ 2.5 mm인 알루미늄판에 지름 3.7 mm의 구멍을 형성하여 몰드를 제작하고 다음과 같이 복합레진 (Z-250, 3M ESPE)을 충전하여 광중합하였다. 1 군: 하층판에 복합레진을 충전하고 광중합 한 후, 상층판을 접합하고 레진을 충전하여 광중합을 하였다 (OIL를 남김). 2 군: 하층판에 복합레진을 충전하고 광중합 한 후 acetone에 적신 cotton으로 문질러서 OIL를 제거하고 상층판을 접합하여 복합레진을 충전하고 광중합을 하였다 (OIL를 제거). 3 군: 하층판에 복합레진을 충전하고 Mylar strip을 접합하여 공기와의 접촉을 차단한 후 광중합을 하였다. Mylar strip을 제거하고 상층판을 접합 후 복합레진을 충전하여 광중합을 하였다 (OIL형성을 억제). 4 군: 하층판에 복합레진을 충전하고 광중합 한 후 glycerin을 OIL 표면에 도포하고 다시 광중합하였다. 상층판을 접합하여 복합레진을 충전하고 광중합을 하였다 (OIL를 중합). 5군 (대조군): 하층판과 상층판의 경계에 복합레진층의 계면이 위치하지 않도록 복합레진을 bulk충전하였다 (계면형성 없이 bulk 충전한 복합레진). 24 시간 100% 습도에서 보관 후 상층판과 하층판 사이의 계면 전단결합강도를 측정하고 파절 양상을 관찰하였다. 계면을 통한 중합과정의 확산을 관찰하기 위하여 제조한 광개시제가 들어있지 않은 실험적 복합레진 (Exp_Com)을 몰드에 충전하고 상부에 flowable 복합 레진 (Aelite Flow) 또는 접착레진 (ScotchBond Multipurpose)을 접촉시킨 후 광조사하였다. 몰드내의 미중합된 Exp_Com을 acetone bath 에서 5 분 동안 제거한 후 몰드내에 다시 Aelite Flow를 충전하고 광중합을 시행하였다. 경화된 복합레진 시편의 단면을 관찰하여 Exp_Com 층의 두께를 측정하였다. OIL를 배제하거나 중합시킨 2-4군은 OIL이 존재하는 1 군과 통계적으로 유의한 결합강도의 차이를 보이지 않았으며, Mylar strip을 이용하여 OIL의 생성을 억제했던 3군과 glycerin을 도포하여 OIL를 중합시킨 4군은 계면을 생성하지 않은 대조군인 5 군과도 통계적으로 유의한 차이를 보이지 않았다. 중합과정의 확산에 의해 중합개시제가 포함되지 않은 Exp_Com내에 중합된 층이 생겨난 것을 시각적으로 확인할 수 있었으며, Exp_Com의 중합층 두께는 flowable 레진의 경우 20.95 (0.90) um였고 접착레진의 경우 42.13 (2.09) 였다.

레진 시멘트의 film thickness가 간접 복합 레진 수복물의 접착 효율에 미치는 영향에 관한 연구 (EFFECT OF FILM THICKNESS OF RESIN CEMENT ON BONDING EFFICIENCY IN INDIRECT COMPOSITE RESTORATION)

  • 이상혁;최기운;최경규
    • Restorative Dentistry and Endodontics
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    • 제35권2호
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    • pp.69-79
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    • 2010
  • 본 연구는 여러 레진 시멘트의 film thickness에 따른 상아질과 간접 레진 수복물 간의 미세인장 결합 강도를 측정하고, 각 레진 시멘트의 중합 수축 및 굴곡 강도, 탄성 계수를 비교 분석하며, 접착 계면 및 파단면의 주사전자 현미경 관찰을 통하여 레진 시멘트의 film thickness가 레진 간접 수복물의 접착 효율에 미치는 영향을 평가하고자 시행하였다. 복합 레진형 레진 시멘트인 Variolink II와 Duo-Link, 접착형 레진 시멘트인 Panavia F와 Rely X Unicem의 4가지 레진 시멘트를 사용하였고, 각각의 시멘트를 film thickness에 따라 < $50\;{\mu}m$ (control)의 대조군과 $50\;{\mu}m$ (T50), $100\;{\mu}m$ (T100), $150\;{\mu}m$ (T150)의 실험군으로 나누어 총 16개의 군으로 분류하였다. 데이터는 ANOVA와 Duncan's multiple comparison test (p < 0.05)를 이용하여 통계 분석하였으며 다음과 같은 결론을 얻었다; 1. Variolink Ⅱ는 모든 film thickness에서 접착형 레진 시멘트보다 높은 결합 강도를 나타냈지만(p < 0.05), Duo-Link는 대조군을 제외하고는 통계학적 유의차가 없었다(p > 0.05). 2. Film thickness가 증가할수록 복합 레진형 레진 시멘트의 결합 강도는 유의성 있게 감소(p < 0.05)하는 경향을 보인 반면, 접착형 레진 시멘트는 통계학적 유의차가 없었다(p > 0.05). 3. Panavia F는 통계학적으로 유의성 있게 낮은 중합 수축량을 나타냈다(p <0.05). 4. 굴곡 강도와 탄성 계수는 복합 레진형 레진 시멘트가 접착형 레진 시멘트보다 유의성 있게 높게 나타났다(p < 0.05). 5. FE-SEM 관찰 결과 결합 강도가 높은 복합 레진형 레진 시멘트는 균일한 접착층과 잘 발달된 resin tag 소견을 보였으나, 접착형 레진 시멘트는 불분명한 접착층과 resin tag 소견을 나타냈다. 파단면 관찰에서 복합 레진형 레진 시멘트는 혼합형 파괴 양상을 나타냈으나 접착형 레진 시멘트는 접착성 파괴 양상을 나타냈다.

Nb/Fe-C-(Si) 주조접합재에서 등온열처리시 계면반응층의 성장에 관한 연구 (Growth of Interfacial Reaction Layer by the Isothermal Heat Treatment of Cast-Bonded Fe-C-(Si)/Nb/Fe-C-(Si))

  • 정병호;김무길;정상훈;박홍일;안용식;이성열
    • 열처리공학회지
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    • 제16권5호
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    • pp.260-266
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    • 2003
  • In order to study the interfacial reaction between Nb thin sheet and Fe-C-(Si) alloy with different Chemical compositions, they were cast-bonded. The growth of carbide layer formed at the interface after isothermal heat treatment at 1173K, 1223K, 1273K and 1323K for various times was investigated. The carbide formed at the interface was NbC and the thickness of NbC layer was increased linearly in proportional to the heat treating time. Therefore, It was found that the growth of NbC layer was controlled by the interfacial reaction. The growth rate constant of NbC layer was slightly increased with increase of carbon content when the silicon content is similar in the cast irons. However, as silicon content increases with no great difference in carbon content, the growth of NbC layer was greatly retarded. The calculated activation energy for the growth of NbC layer was varied in the range of 447.4~549.3 kJ/moI with the compositions of cast irons.

Cu 머쉬룸 범프를 적용한 플립칩 접속부의 접속저항 (Contact Resistance of the Flip-Chip Joints Processed with Cu Mushroom Bumps)

  • 박선희;오태성
    • 마이크로전자및패키징학회지
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    • 제15권3호
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    • pp.9-17
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    • 2008
  • 전기도금법으로 Cu 머쉬룸 범프를 형성하고 Sn 기판 패드에 플립칩 본딩하여 Cu 머쉬룸 범프 접속부를 형성하였으며, 이의 접속저항을 Sn planar 범프 접속부와 비교하였다. $19.1\sim95.2$ MPa 범위의 본딩응력으로 형성한 Cu머쉬룸 범프 접속부는 $15m\Omega$/bump의 평균 접속저항을 나타내었다. Cu머쉬룸 범프 접속부는 Sn planar범프 접속부에 비해 더 우수한 접속저항 특성을 나타내었다. 캡 표면에 $1{\sim}w4{\mu}m$ 두께의 Sn 코팅층을 전기도금한 Cu 머쉬룸 범프 접속부의 접속저항은 Sn 코팅층의 두께에 무관하였으나 캡 표면의 Sn코팅층을 리플로우 처리한 Cu머쉬룸 범프 접속부에서는 접속저항이 Sn 코팅층의 두께와 리플로우 시간에 크게 의존하였다.

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확산 접합에 의해 제조된 텅스텐-레늄 합금/티타늄/그래파이트 접합체의 미세구조 및 고온 안정성 (Interfacial Microstructure of Diffusion-Bonded W-25Re/Ti/Graphite Joint and Its High-Temperature Stability)

  • 김주형;백창연;김동석;임성택;김도경
    • 한국재료학회지
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    • 제26권12호
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    • pp.751-756
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    • 2016
  • Graphite was diffusion-bonded by hot-pressing to W-25Re alloy using a Ti interlayer. For the joining, a uniaxial pressure of 25 MPa was applied at $1600^{\circ}C$ for 2 hrs in an argon atmosphere with a heating rate of $10^{\circ}C\;min^{-1}$. The interfacial microstructure and elemental distribution of the W-25Re/Ti/Graphite joints were analyzed by scanning electron microscopy (SEM). Hot-pressed joints appeared to form a stable interlayer without any micro-cracking, pores, or defects. To investigate the high-temperature stability of the W-25Re/Ti/Graphite joint, an oxy-acetylene torch test was conducted for 30 seconds with oxygen and acetylene at a 1.3:1 ratio. Cross-sectional analysis of the joint was performed to compare the thickness of the oxide layer and its chemical composition. The thickness of W-25Re changed from 250 to $20{\mu}m$. In the elemental analysis, a high fraction of rhenium was detected at the surface oxidation layer of W-25Re, while the W-25Re matrix was found to maintain the initial weight ratio. Tungsten was first reacted with oxygen at a torch temperature over $2500^{\circ}C$ to form a tungsten oxide layer on the surface of W-25Re. Then, the remaining rhenium was subsequently reacted with oxygen to form rhenium oxide. The interfacial microstructure of the Ti-containing interlayer was stable after the torch test at a temperature over $2500^{\circ}C$.