• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• 대한금속재료학회지
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• 제49권8호
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• pp.664-670
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• 2011

3-ply Mg/Al/STS clad-metal was fabricated by the roll bonding process. An interfacial reaction layer was formed at the Mg/Al interface at and above $300^{\circ}C$ whereas no interfacial reaction layer was observed up to $400^{\circ}C$. The effect of the interfacial reaction layer on the mechanical and fracture properties in clad metals after heat treatments were investigated The chemical compositions were analyzed at the Mg/Al interface by an Energy dispersive X-ray analysis (EDX). A tension test was performed to examine the interfacial cracking properties. The Mg layer fractured first, causing a sudden drop of the stress and Al/STS layer continued to deform until the final fracture. Periodic cracks and crack propagation was observed at the reaction layer between Mg and Al.

• 한국음향학회지
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• 제9권2호
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• pp.5-13
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• 1990

본 연구에서는 수 파장 이상의 깊이에 존재하는 결함을 탐상하기 위하여 50MHz의 중심주파수에서 동작하는 small aperture형 초음파현미경을 구성하였고 다층구조 샘플에 대한 영상을 연구분석하였다. 다층구조물에서의 출력특성을 음향감쇠, 수차, 렌즈형태, 샘플의 특성에 영향을 받으며 이것은 다층구조 I.C.와 bonding층 탐상에 이용할 수 있다. 실험결과, small aperture형 초음파현미경은 large aperture형 시스템에 비하여 두꺼운 샘플의 탐상에 유리하며 타 도구에서 관찰이 어려운 다층구조의 층별 탐상과 내부구조의 변형상태등을 2차원 영상으로 탐상할 수 있는 유용한 도구임을 확인하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.238-243
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• 2007

This paper is designed to estimate the adhesion strength of coating layer on galvannealed steel sheet using lap shear test. The single lap shear test is the most commonly used standard test for determining the strength of medium-strength and high strength bonds. The bond strength of bonded single lap joints on subjecting the substrates to loads is determined by lap shear forces in the direction of the bonded joint. In this study, specimen for adhesion strength test was made to attach coated sheet to cold rolled sheet and were heated in temperature of 180 for 20minutes. After test, detached parts of coatings on coated sheet were observed using SEM and EDX to identify substrate and complete detachment. The tested results showed that adhesive strength of coating is unrelated to anisotropy of sheet and is difficult to be extracted using conventional theory because of fine cracks of coating layers which were created during annealing process.

• 대한치과보철학회지
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• 제38권1호
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• pp.108-115
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• 2000

This study was designed to compare the effect of polishing on surface roughness of composite resin. We used Z100(3M) composite resin and placed the composite resin in the hole (4mm thick and 4mm in diameter) of vinyl plate and polymerized it under manufacturer's instructions. Samples were divided into 5 groups by polishing methods. Group 1 was control: resin was polymerized under glass plate, Group 2: resin was polymerized without any polishing procedure, Group 3: resin was polymerized with a polishing procedure of abrasive disc, Group 4: bonding agent was applyed in thin layer and polymerized on the polished polymerized resin surface. Group 5: resin was polymerized under transparent celluloid strip. The surface roughness of each specimen was measured with Sufacoder SEF-30D (Kosaka lab. Ltd) under 0.08mm cut off, 0.05mm/s stylus speed, ${\times}40$ horizontal magnification, ${\times}5000$ vertical magnification. The results were as follows : 1. Group 1 showed the most smooth surface in this study. 2. Group 3 showed more rough surface than Group 2. Considering the surface roughness, it would be better to make the shape completely before polymerize the resin. To finish and polish after the polymerization of resin makes less smooth surface. 3. When we use the transparent celluloid strip, minimum finishing procedures are recommended. Any polishing procedure could not recover the smooth resin surface of celluloid strip. 4. Application and polymerization of the thin layer of bonding agent on the polished surface showed the minimum surface smoothing effect.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.743-746
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• 2003

We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700nm think, single-crystal Ge films to Si substrates. Optical and electrical properties have been also observed on these samples. Triple-junction solar cell structures gown on these Ge/Si heterostructure templates show comparable photoluminescence intensity and minority carrier lifetime to a control structure grown on bulk Ge. When heavily doped p$^{+}$Ge/p$^{+}$Si wafer bonded heterostructures were bonded, ohmic interfacial properties with less than 0.3Ω$\textrm{cm}^2$ specific resistance were observed indicating low loss thermal emission and tunneling processes over and through the potential barrier. Current-voltage (I-V) characteristics in p$^{+}$Ge/pSi structures show rectifying properties for room temperature bonded structures. After annealing at 40$0^{\circ}C$, the potential barrier was reduced and the barrier height no longer blocks current flow under bias. From these observations, interfacial atomic bonding structures of hydrophobically wafer bonded Ge/Si heterostructures are suggested.ested.

• Steel and Composite Structures
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• 제20권5호
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• pp.999-1022
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• 2016

The use of Carbon Fiber Reinforced Polymer (CFRP) to strengthen steel structures has attracted the attention of researchers greatly. Previous studies demonstrated bonding of CFRP plates to the steel sections has been a successful method to increase the mechanical properties. However, the main limitation to popular use of steel/CFRP strengthening system is the concern on durability of bonding between steel and CFRP in various environmental conditions. The paper evaluates the performance of I-section steel beams strengthened with pultruded CFRP plate on the bottom flange after exposure to diverse conditions including natural tropical climate, wet/dry cycles, plain water, salt water and acidic solution. Four-point bending tests were performed at specific intervals and the mechanical properties were compared to the control beam. Besides, the ductility of the strengthened beams and distribution of shear stress in adhesive layer were investigated thoroughly. The study found the adhesive layer was the critical part and the performance of the system related directly to its behavior. The highest strength degradation was observed for the beams immersed in salt water around 18% after 8 months exposure. Besides, the ductility of all strengthened beams increased after exposure. A theoretical procedure was employed to model the degradation of epoxy adhesive.

• Structural Engineering and Mechanics
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• 제74권5호
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• pp.589-600
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• 2020

The bonding interface of the concrete slab track and cement-asphalt mortar layer plays an important role in transferring load and restraining the track slab's deformation for slab track structures without concrete bollards in high-speed railway. However, the interfacial bond-slip behavior is seldom considered in the structural analysis; no credible constitutive model has been presented until now. Elaborating the field tests of concrete to cement-asphalt mortar interface subjected to longitudinal and transverse shear loads, this paper revealed its bond capacity and failure characteristics. Interfacial fractures all happen on the contact surface of the concrete track slab and mortar-layer in the experiments. Aiming at this failure mechanism, an interfacial mechanical model that employed the bilinear local bond-slip law was established. Then, the interfacial shear stresses of different loading stages and the load-displacement response were derived. By ensuring that the theoretical load-displacement curve is consistent with the experiment result, an interfacial bond-slip constitutive model including its the corresponding parameters was proposed in this paper. Additionally, a finite element model was used to validate this constitutive model further. The constitutive model presented in this paper can be used to describe the real interfacial bonding effect of slab track structures with similar materials under shear loads.

• 한국세라믹학회지
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• 제43권9호
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• pp.544-551
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• 2006

The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.

• 대한금속재료학회지
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• 제48권2호
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• pp.116-121
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• 2010

The Mg-Zn-RE alloy cladded with the thin Al1050 sheet was fabricated by means of a roll bonding process at $280^{\circ}C$.Microstructures and mechanical properties of the clad sheets were investigated. After heat treatment at $230^{\circ}C$ for 30 min, an Mg-rich diffusion layer with about $2{\mu}m$ in thickness was developed at the Mg and Al interface. Tensile tests were carried out in a temperature range up to $300^{\circ}C$. The clad sheet exhibits superior elongation to failure not only at room temperature but also at elevated temperatures compared with those of the Mg alloy sheet. For the deformed specimens, interface debonding does not occur and the diffusion layer shows only a few cracks.