• Composites Research
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• v.30 no.3
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• pp.209-214
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• 2017

Titanium carbide (TiC) reinforced SKD11 matrix composites were successfully fabricated by a novel liquid pressing infiltration process. Microstructure, mechanical properties, and wear characteristics of the fabricated 60 vol% TiC-SKD11 composite are analyzed. The composite exhibits superior mechanical properties, such as hardness and compressive strength with 24% lower density as compared with SKD11. Improved wear resistance of the TiC-SKD11 composite originates from uniformly reinforced TiC having strong interfacial bonding strength between TiC/SKD11 interface.

• International Journal of Highway Engineering
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• v.19 no.5
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• pp.33-42
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• 2017

PURPOSES : The purpose of this study is to suggest the construction and quality control method for the re-repair of a deteriorated partial depth repair for sections of Portland cement concrete pavement. METHODS : An experimental construction was conducted to extend the repair width for removing an existing repair section. A removal method was used to ensure early performance for a deteriorated partial depth repair section. Bond strength and split tensile strength were measured at the near vertical interface layer between the existing pavement and repair material. The area was analyzed for various conditions such as the extended repair area and the removing method of the existing repair section. RESULTS : As a result of analysis of bond strength and split tensile strength, the bonding performance of a milling removed section was improved over a cutting and hand breaker removed section. The bond strength was analyzed to increase slightly as the extended repair width for removing the existing repair section increased. The split tensile strength did not show a clear relationship to an increased extended repair width of an existing removed repair section. CONCLUSIONS : The milling removal method should be applied in the removal of existing deteriorated partial depth repair sections. The extended repair width for a re-repair section should be wider than the existing partial depth repair with at least a 75-mm length and width for the bond strength and the split tensile strength.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.97-104
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• 2005

The effect of Nb on interfacial bonding characteristics of Ni-Cr alloy for porcelain fused to metal crown (PFM) has been studied in order to investigate oxide layer. A specimens, which is 0.8mm in thickness, were fired at 1,000$^{\circ}C$ with four tests such as air, vacuum, air for 5 minutes and vacuum for 5 minutes in order to examine an oxide behavior of alloy surface generated by the adding of Nb to be controlled at a rate of 0, 1, 3 and 5. It observed oxide film form of the fired specimens with optical microscope and scanning electron microscope (SEM), and chemical formation of them with energy disperse X-ray spectroscopy (EDX). The other specimens, which is 2mm in thickness, were fired at 1,000$^{\circ}C$ with air and vacuum in order to analyze the diffusion behaviors of alloy-porcelain interface by X-ray dot mapping. The results of this study were as follows: 1. The observation of microstructure of specimens by SEM showed that the more Nb content is high, the more much intermediate compound of rich Nb is observed. 2. The surface morphology of oxide film is most dense in 3% Nb. The heat treatment in air constitutes denser oxide film than heat treatment under vacuum. 3. The diffusion behavior of oxide layer by X-ray dot mapping showed that Si, Al of porcelain diffuse toward metal.

• Journal of the Korean GEO-environmental Society
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• v.10 no.7
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• pp.167-177
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• 2009

This study investigates a failure mechanism of a tunnel shotcrete lining with respect to a concentrated load due to blocky rock mass. First of all, it is carried out to survey relevant researches to shotcrete failures by literature reviews and to numerically re-investigate the failure modes of shotcrete lining given by previous researches. Through this study, the failure modes are relocated with the conditions which induce each failure mode newly proposed by this study. In addition to this, the arching shape of tunnel lining, which has not been considered in the previous research despite of inherent geometrical characteristics in tunnels, is taken into consideration in numerical investigation on lining failure in this study. As a result, it is shown that more simplified failure modes can be found on the tunnel boundary condition and the corresponding failure condition to each mode can be different from ones of the previous study due to a tunnel arching effect.

• International Journal of Highway Engineering
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• v.15 no.2
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• pp.47-55
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• 2013

PURPOSES : This study aimed to evaluate the feasibility of AASHTO86 design method for Bonded Concrete Overlay. METHODS : The Feasibility of AASHTO86 design method for Bonded Concrete Overlay is investigated based on the following study : i) Sensitivity analysis of designed service life of Bonded Concrete Overlay by major design input for AASHTO86 guide. ii) Comparison of actual Bonded Concrete Overlay life and predicted Bonded Concrete Overlay life by AASHTO86. iii) Finding the stress component influence the potential distress of Bonded Concrete Overlay based on 3-d FEM analysis. iv) Exploring the limitation of AASHTO86 in the aspect of design input. RESULTS : Sensitivity analysis showed that the condition of existing pavement significantly on the Bonded Concrete Overlay life. Also the overlay thickness affect the Bonded Concrete Overlay life. The comparison of actual Bonded Concrete Overlay life and predicted Bonded Concrete Overlay life showed relatively good agreement when the early distress sections are excluded in comparison. Bonding stress occurred at the interface may be larger than the bond strength used in the specification of Bonded Concrete Overlay construction. CONCLUSIONS : Bonded Concrete Overlay life predicted by the AASHTO86 may not be reliable. Number of points to improve the reliability in the design of Bonded Concrete Overlay are suggested in this study.

• Journal of the Korean Vacuum Society
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• v.8 no.1
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• pp.20-25
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• 1999

The effect of different plasma surface preparation and oxidation processes for the formation of $SiO_2-Si$(100) interfaces was studied using angle resolved uv-photoelectron spectroscopy. The surface preparation processes included ex situ preclean as well as in situ hydrogen plasma, which were compared to the processes of UHV annealing at high temperature. The spectral position of the oxide valence band features, with respect to the Fermi level. Were found to shift according to the different processes of surface preparation and oxidation. The shifts were analyzed in terms of band bending in the Si. Origins of the spectral shifts were considered to include defects at the $SiO_2Si$ interfaces and surface morphology(roughness) dependent on the surface preparation processes. From comparison of the ARUPS results of the various processes, it was concluded that the interface bonding of the silicon oxide-showed the lowest band bending.

• The Journal of Advanced Prosthodontics
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• v.12 no.4
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• pp.181-188
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• 2020

PURPOSE. The effect of core design on the fracture resistance of zirconia-lithium disilicate (LS2) bilayered crowns for anterior teeth is evaluated by comparing with that of metal-ceramic crowns. MATERIALS AND METHODS. Forty customized titanium abutments for maxillary central incisor were prepared. Each group of 10 units was constructed using the same veneer form of designs A and B, which covered labial surface to approximately one third of the incisal and cervical palatal surface, respectively. LS2 pressed-on-zirconia (POZ) and porcelain-fused-to-metal (PFM) crowns were divided into "POZ_A," "POZ_B," "PFM_A," and "PFM_B" groups, and 6000 thermal cycles (5/55 ℃) were performed after 24 h storage in distilled water at 37 ℃. All specimens were prepared using a single type of self-adhesive resin cement. The fracture resistance was measured using a universal testing machine. Failure mode and elemental analyses of the bonding interface were performed. The data were analyzed using Welch's t-test and the Games-Howell exact test. RESULTS. The PFM_B (1376. 8 ± 93.3 N) group demonstrated significantly higher fracture strength than the PFM_A (915.8 ± 206.3 N) and POZ_B (963.8 ± 316.2 N) groups (P<.05). There was no statistically significant difference in fracture resistance between the POZ_A (1184.4 ± 319.6 N) and POZ_B groups (P>.05). Regardless of the design differences of the zirconia cores, fractures involving cores occurred in all specimens of the POZ groups. CONCLUSION. The bilayered anterior POZ crowns showed different fracture resistance and fracture pattern according to the core design compared to PFM.

• Journal of the Korean institute of surface engineering
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• v.46 no.1
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• pp.9-15
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• 2013

The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.